Patent US6477058B1 successfully refreshed from Google Patents.
US6477058B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit device package including multiple stacked components
Assignee: Hewlett Packard Enterprise Development LP
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Filing: 2001-06-28
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Granted: 2002-11-05
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Expires: 2021-06-28
Abstract
Abstract An integrated circuit device package in accordance with the invention comprises a first land grid array (LGA) interposer socket positioned between, and in communication with, an LGA integrated circuit device and a first side of a first circuit board; a second LGA interposer socket positioned between, and in communication with, a second circuit board and a second side of the first circuit board, wherein the second side of the first circuit board is opposite to and parallel with the first side of the first circuit board; and a clamping mechanism for compressively urging together the LGA integrated circuit device, the first LGA interposer socket, the first circuit board, the second LGA interposer socket, and the second circuit board into electrical interconnection under a predetermined load.
Inventors
- 👤 Richard J Luebs
- 👤 Jonathan W Craig
- 👤 Jeffrey L. Deeney
- 👤 David W. Peters
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 13:26
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/02; H05K7/10; H05K7/1053; H05K7/1061; H05K1/00; H05K1/02; H05K1/14; H05K1/141; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/10378; H05K2201/10613; H05K2201/10621; H05K2201/10719; H05K3/00; H05K3/30; H05K3/32; H05K3/325; H05K3/36; H05K3/368
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
214 words
An integrated circuit device package comprising: a land grid array integrated circuit device; a first circuit board having opposed, parallel, first and second major surfaces, each of the major surfaces of the first circuit board including a land grid array; a second circuit board having opposed, parallel, first and second major surfaces, the first major surface of said-second circuit board including a land grid array; a first land grid array interposer socket sandwiched between the land grid array integrated circuit device and the land grid array on the first major surface of the first circuit board; a second land grid array interposer socket sandwiched between the land grid array on the second major surface of the first circuit board and the land grid array on the first major surface of the second circuit board; and a clamping mechanism for compressively urging into electrical interconnection (i) the land grid array integrated circuit device and the land grid array on the first major surface of the first circuit board through the first land grid array interposer socket, and (ii) the land grid array on the second major surface of the first circuit board and the land grid array on the first major surface of the second circuit board through the second land grid array interposer socket.
Claim 2
Dependent Claim
214 words
An integrated circuit device package comprising: a land grid array integrated circuit device; a first circuit board having opposed, parallel, first and second major surfaces, each of the major surfaces of the first circuit board including a land grid array; a second circuit board having opposed, parallel, first and second major surfaces, the first major surface of said-second circuit board including a land grid array; a first land grid array interposer socket sandwiched between the land grid array integrated circuit device and the land grid array on the first major surface of the first circuit board; a second land grid array interposer socket sandwiched between the land grid array on the second major surface of the first circuit board and the land grid array on the first major surface of the second circuit board; and a clamping mechanism for compressively urging into electrical interconnection (i) the land grid array integrated circuit device and the land grid array on the first major surface of the first circuit board through the first land grid array interposer socket, and (ii) the land grid array on the second major surface of the first circuit board and the land grid array on the first major surface of the second circuit board through the second land grid array interposer socket.
Claim 3
Dependent Claim
21 words
The integrated circuit device package, as defined in claim 1 , in which: said first circuit board comprises a daughter card.
Claim 4
Dependent Claim
21 words
The integrated circuit device package, as defined in claim 1 , in which: said second circuit board comprises a mother board.
Claim 5
Dependent Claim
38 words
The integrated circuit device package, as defined in claim 1 , further comprising: a clamping plate overlying the land grid array integrated circuit device; and a backing plate engaging the second major surface of the second circuit board.
Claim 6
Dependent Claim
28 words
The integrated circuit device package, as defined in claim 1 , wherein the clamping mechanism comprises: at least one fastener coupling said clamping plate and said backing plate.
Claim 7
Dependent Claim
20 words
The integrated circuit device package, as defined in claim 5 , in which: said at least one fastener is spring-loaded.
Claim 8
Dependent Claim
31 words
The integrated circuit device package, as defined in claim 5 , in which: said at least one fastener is operable to provide a predetermined level of compression to said IC package.
Claim 9
Dependent Claim
62 words
The integrated circuit device package, as defined in claim 1 , which includes: a retention frame secured to the first major surface of the second circuit board, the land grid array on the first major surface of the second circuit board being disposed within the confines of the retention frame; and a clamping plate overlying the land grid array integrated circuit device.
Claim 10
Dependent Claim
29 words
The integrated circuit device package, as defined in claim 1 , wherein the clamping mechanism includes: at least one fastener coupling said clamping is plate and said retention frame.
Claim 11
Dependent Claim
35 words
The integrated circuit device package, as defined in claim 8 , further comprising: a backing plate engaging the second major surface of the second circuit board, the backing plate being secured to the retention frame.
Claim 12
Independent Claim
221 words
An apparatus for electrically interconnecting a plurality of stacked electrical components including a land grid array integrated circuit device, a daughter card and a mother board, the daughter card having opposed, parallel, first and second major surfaces, the mother board having opposed, parallel, first and second major surfaces, said apparatus comprising: a land grid array on each of said first and second major surfaces of the daughter board electrically connected to electrical elements carried by the daughter board; a land grid array on the first major surface of the mother board electrically connected to electrical elements carried by the mother board; a first land grid array interposer socket and a second land grid array interposer socket, said first interposer socket enabling electrical connection between said land grid array integrated circuit device and the land grid array on the first major surface of the daughter card, and said second land grid array interposer socket enabling electrical connection between the land grid array on the second major surface of the daughter card and the land grid array on the mother board; a clamping plate for overlying the integrated circuit device; and a clamping mechanism for compressively urging the integrated circuit device, said first interposer socket, said daughter card, said second interposer socket and said mother board into electrical interconnection under a predetermined load.
Claim 13
Independent Claim
221 words
An apparatus for electrically interconnecting a plurality of stacked electrical components including a land grid array integrated circuit device, a daughter card and a mother board, the daughter card having opposed, parallel, first and second major surfaces, the mother board having opposed, parallel, first and second major surfaces, said apparatus comprising: a land grid array on each of said first and second major surfaces of the daughter board electrically connected to electrical elements carried by the daughter board; a land grid array on the first major surface of the mother board electrically connected to electrical elements carried by the mother board; a first land grid array interposer socket and a second land grid array interposer socket, said first interposer socket enabling electrical connection between said land grid array integrated circuit device and the land grid array on the first major surface of the daughter card, and said second land grid array interposer socket enabling electrical connection between the land grid array on the second major surface of the daughter card and the land grid array on the mother board; a clamping plate for overlying the integrated circuit device; and a clamping mechanism for compressively urging the integrated circuit device, said first interposer socket, said daughter card, said second interposer socket and said mother board into electrical interconnection under a predetermined load.
Claim 14
Dependent Claim
23 words
The apparatus, as defined in claim 11 , further comprising: a backing plate for engaging the second major surface of the mother board.
Claim 15
Dependent Claim
20 words
The apparatus, as defined in claim 12 , in which: said clamping mechanism couples said clamping and said backing plates.
Claim 16
Dependent Claim
25 words
The apparatus, as defined in claim 13 , wherein the clamping mechanism comprises: at least one fastener coupling said clamping plate and said backing plate.
Claim 17
Dependent Claim
19 words
The apparatus, as defined in claim 11 , in which: said clamping plate is configured as a heat sink.
Claim 18
Dependent Claim
40 words
The apparatus, as defined in claim 11 , further comprising: a retention frame for overlying the first major surface of the mother board about the land grid array thereon and for attachment to the backing plate through the mother board.
Claim 19
Dependent Claim
51 words
The apparatus, as defined in claim 16 , further comprising: a clamping mechanism for coupling said clamping plate and said retention frame for compressively urging the integrated circuit device, said first interposer socket, said daughter card, said second interposer socket and said mother board into electrical interconnection under a predetermined load.
Claim 20
Dependent Claim
120 words
An integrated circuit device package comprising: a first land grid array (LGA) interposer socket positioned between, and in communication with, an LGA integrated circuit device and a first side of a first circuit board; a second LGA interposer socket positioned between, and in communication with, a second circuit board and a second side of said first circuit board, wherein said second side of said first circuit board is opposite to and parallel with said first side of said first circuit board; and a clamping mechanism for compressively urging together said LGA integrated circuit device, said first LGA interposer socket, said first circuit board, said second LGA interposer socket, and said second circuit board into electrical interconnection under a predetermined load.
Claim 21
Dependent Claim
120 words
An integrated circuit device package comprising: a first land grid array (LGA) interposer socket positioned between, and in communication with, an LGA integrated circuit device and a first side of a first circuit board; a second LGA interposer socket positioned between, and in communication with, a second circuit board and a second side of said first circuit board, wherein said second side of said first circuit board is opposite to and parallel with said first side of said first circuit board; and a clamping mechanism for compressively urging together said LGA integrated circuit device, said first LGA interposer socket, said first circuit board, said second LGA interposer socket, and said second circuit board into electrical interconnection under a predetermined load.
Claim 22
Dependent Claim
36 words
An integrated circuit package, as defined in claim 18 , further comprising: a clip holding together the LGA integrated circuit device, the first LGA interposer socket, the first circuit board and the second LGA interposer socket.
Claim 23
Dependent Claim
58 words
An integrated circuit package, as defined in claim 18 , further comprising: a combination of (i) at least one additional circuit board and (ii) an additional LGA interposer socket operatively associated with said at least one additional circuit board, said combination being disposed between, and in communication with, said second LGA interposer socket and said second circuit board.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-11-04 | 2006-05-06 | 2006-11-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-11-04 | 2010-05-06 | 2010-11-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-11-04 | 2014-05-06 | 2014-11-05 | $7700.00 | Window Closed / Lapsed |