Method and system for auto dispatching wafer

Claim 3

The method according to claim 1 , wherein a specified one of said wafers is processed by a specified one of said tools whenever said specified wafer has been located on said specified tool but has not been processed.

Claim 4

The method according to claim 1 , wherein a specified one of aid wafers is processed by a specified one of said tools whenever said specified wafer is dedicated to said specified tool by said exception rule.

Claim 5

The method according to claim 1 , wherein said automatically calculated priority is a summation of nine terms, said terms consisting of process time term, Q-Time term, waiting status term, commit due date term, output term, hot run term, idle term, super hot run term and exception rule term.

Claim 6

The method according to claim 4 , wherein said process time term reflects effect of the process time and the normal rule is that wafer with shorter process time product is presidential to be processed except said process time term is switched.

Claim 7

The method according to claim 4 , wherein said Q-Time term reflects effect of the Q-time that is the period since a wafer has been waited to be processed, and the normal rule is that wafer with longer Q-Time is presidential to be processed except said Q-Time term is switched.

Claim 8

The method according to claim 4 , wherein said waiting status term is used to reflect whether a wafer is ready to be processed or not.

Claim 9

The method according to claim 4 , wherein said commit due date term is increasing when the commit due date is approached and is more increasing when product is overdue.

Claim 10

The method according to claim 4 , wherein said output term is increasing when the current output is lesser than scheduled output and is decreasing when the current output is lager than scheduled output.

Claim 11

The method according to claim 4 , wherein said hot run term is active only when wafer belong to said hot run.

Claim 12

The method according to claim 4 , wherein said idle term is active only when wafer has been located on said available tool but has not been processed.

Claim 13

The method according to claim 4 , wherein said super hot run term is active only when said wafer belongs to said super hot run.

Claim 14

The method according to claim 4 , wherein said exception rule is active only when at least one of said exception rule is assigned.

Claim 15

The method according to claim 1 , wherein said priorities of said wafers are automatically recalculated per a specific duration that is assigned by said dispatcher.

Claim 16

The method according to claim 1 , wherein said priorities are automatically recalculated whenever one of said wafers is processed by one of said tools.

Claim 17

The method according to claim 1 , wherein said priorities are automatically recalculated whenever a new wafer is appeared.

Claim 18

The method according to claim 1 , wherein said priorities are automatically recalculated whenever said limitation database is modified.

Claim 19

The method according to claim 1 , wherein said priorities are automatically recalculated whenever at least one of said system variables is modified.

Claim 20

The method according to claim 1 , when a wafer that belongs to said super hot run is appeared, said wafer being dispatched into one of said available tools to cause a specific process be processed on said wafer in accordance with these rules as following: when said wafer is assigned to a specified tool by said exception rule and product of preceding process of said specified tool is equal to product of said wafer, then interrupts preceding process of said specified tool to process said wafer by said specified tool; when said wafer is assigned to said specified tool and product of preceding process of said specified tool is not equal to product of said wafer, and when all required materials of said specific process are available, then interrupts preceding process of said specified tool to process said wafer by said specified tool; when said wafer is assigned to said specified tool and product of preceding process of said specified tool is not equal to product of said wafer, and when required materials of said specific process are not all available, then sends a shortage warning message; when said wafer is not assigned to any specified tool and an idle tool with enough required materials of said specific process is available, then said idle tool is used to process said wafer; when said wafer is not assigned to any specified tool and an idle tool with enough required materials of said specific process is not available, and when at least one specific tool with same product as said wafer is available, then preceding process of a chose said specific tool that with lowest priority is interrupted to processed said wafer by chose said specific tool; when said wafer is not assigned to any specified tool and no idle tool with enough required materials of the specific process is available, and when no tool with same product as the wafer is available and when required materials of the specific process are not all available, then sends said shortage warning message; and when said wafer is not assigned to any specified tool and no idle tool with enough required materials of the specific process is available, and when no tool with same product as said wafer is available but required materials of said specific process are available, then preceding process of a chose said available tool that with lowest priority is interrupted to processed the wafer.

Claim 21

The method according to claim 19 , wherein said materials comprise probe-card when said available tools belong to test equipment.

Claim 22

The method according to claim 1 , when a wafer that belongs to said hot run is appeared, said wafer being dispatched into one of said available tools to cause a specific process be processed on said wafer in accordance with these rules as following: when said wafer is assigned to a specified tool and product of preceding process of said specified tool is equal to product of said wafer, then processes said wafer by said specified tool when preceding process of said specified tool is finished; when said wafer is assigned to said specified tool and product of preceding process of said specified tool is not equal to product of said wafer, and all required materials of said specific process are available, then processes said wafer by said specified tool when preceding process of said specified tool is finished; when said wafer is assigned to said specified tool and product of preceding process of said specified tool is not equal to product of said wafer, and required materials of said specific process are not all available, then sends a shortage warning message; when said wafer is not assigned to any specified tool and an idle tool with enough required materials of said specific process is available, then process said wafer by said idle tool; when said wafer is not assigned to any specified tool and no idle tool with enough required materials of said specific process is available, and when at least one first specific tool with same product as said wafer is available and preceding processes of said first specific tool can be finished in a Q-Time duration is available, then process said wafer with a chose said first specific tool that with lowest priority when preceding process of said chose first specific tool is finished; when said wafer is not assigned to any specified tool and no idle tool with enough required materials of said specific process is available, and when at least one second specific tool with same product as said wafer is available and no said second specific tool that preceding process can not be finished in said Q-Time duration is available, then interrupts preceding process of a chose said second specific tool that with lowest priority to process said wafer; when said wafer is not assigned to any specified tool and no idle tool with enough required materials of said specific process is available, and when no tool that fabricates same product as said wafer is available and when required materials of said specific process are not all available, then sends said shortage warning message; when said wafer is not assigned to any specified tool and no idle tool with enough required materials of said specific process is available, and no said available tool with same product as said wafer is exist but required materials of said specific process are available, and at least one third specific tool that can finish preceding process in said Q-Time duration is available, then process said wafer by an earliest third specific tool that preceding process of said chose specific is finished earliest; and when said wafer is not assigned to any specified tool and no idle tool with enough required materials of said specific process is available, and no available tool with same product as said wafer is exist but required materials of said specific process are available, and all said available tools can not finish preceding process in said Q-Time duration, then interrupt preceding process of a lowest available tool to process said wafer where said lowest available tool is one of said available tools that priority of product of preceding process is lowest.

Claim 23

The method according to claim 21 , wherein said required materials comprise probe-card when said available tools belong to test equipment.

Claim 24

The method according to claim 1 , when preceding process of a specific tool is finished and said specific tool can be used to process a succeeding process, one of said wafers that belongs to said normal run is dispatched into said specific tool in accordance with these rules as following: when a specified product is assigned to be fabricated by said specific tool in accordance with said exception rule and when a plurality of first specific wafers with said specified product are available, and when product of said preceding process is equal to said specified product, then said specific tool is used to process some of said first specific wafers that with highest priority to fabricated said specified product; when a specified product is assigned to be fabricated by said specific tool in accordance with said exception rule and when a plurality of second specific wafers with said specified product are available, and when product of said preceding process is not equal to said specified product but all required materials of said specific process are available, then said specific tool is used to process some of said second specific wafers that with highest priority to fabricate said specified product; when a specified product is assigned to be fabricated by said specific tool in accordance with said exception rule and when a plurality of third specific wafers with said specified product are available, and when product of said preceding process is not equal to said specified product and required materials of said specific process are not all available, then sends a shortage warning message; when said specific tool is not assigned to process any specified product and scheduled output of product of said preceding process is not achieved, and a plurality of fourth specific wafers with same product as said preceding process are available, then said specific tool is used to process some of said fourth specific wafers that with highest priority; when said specific tool is not assigned to process any specified product and scheduled output of product of said preceding process is not achieved, and no wafer with same product as said preceding process is available but a plurality of fifth specific wafer with different products and sufficient required materials of said different products are available, then the specific tool is used to process a plurality of said fifth specific wafers that with highest priority; when said specific tool is not assigned to process any specified product and scheduled output of product of said preceding process is not achieved, and no wafer with same product as said preceding process of said specific tool is available and no wafer with both different product and sufficient required materials of said different product is available, then said specific tool is idle and a wafer pull-in list is sent; when said specific tool is not assigned to process any specified product and scheduled output of product of said preceding process is achieved, and when no wafer with product that scheduled output is not achieved is available and a plurality of sixth specific wafer with same product as said preceding process and sufficient materials of said sixth specific product are available, then the specific tool is used to process a plurality of said sixth specific wafers that with highest priority; when said specific tool is not assigned to process any specified product and scheduled output of product of said preceding process is achieved, and when no wafer with product that scheduled output is not achieved is available and no wafer with same product as said preceding process is available, and when a plurality of seventh specific wafers that corresponding product is not equal to product of said preceding process are available and sufficient required materials of said seventh specific wafers are available, then said specific tool is used to process a plurality of said seventh specific wafers that with highest priority; when said specific tool is not assigned to process any specified product and scheduled output of product of said preceding process is achieved, and when no wafer with product that scheduled output is not achieved is available and no wafer with same product as said preceding process is available, and when no wafer with sufficient required materials is available, then said specific tool is idle and said wafer pull-in list is sent; when said specific tool is not assigned to process any specified product and scheduled output of product of said preceding process is achieved, and when a plurality of eighth specific wafers with product that scheduled output is not achieved are available and required materials of said eighth specific wafers are available, then said specific tool is used to process some of said eighth wafers that with highest priority; when said specific tool is not assigned to process any specified product and scheduled output of product of said preceding process is achieved, and when a plurality of ninth specific wafer with product that scheduled output are not achieved are available but required materials of said ninth specific wafers are not available, and when a plurality of tenth specific wafer with product that required materials are sufficient are available, then said specific tool is used to process a plurality of said tenth specific wafers that with highest priority; and when said specific tool is not assigned to process any specified product and scheduled output of product of said preceding process is achieved, and when a plurality of eleventh specific wafer with product that scheduled output is not achieved are available but required materials of said eleventh specific wafers are not available, and also when no wafer with product that required materials is sufficient is available, then said specific tool is idle and said wafer pull-in list is sent.

Claim 25

The method according to claim 23 , further comprising when said shortage warning message is sent, re-dispatching said wafer in accordance with a preferential rule that wafer with product that required materials are not all available is not dispatched until required materials are available.

Claim 26

The method according to claim 23 , further comprising when the assignment relation between said specific tool and said specified product is cancelled, re-dispatching wafers into said specific tool in accordance with an antecedent rule that said specific tool is not assigned to process any specified product.

Claim 29

The system according to claim 26 , wherein a specified one of said wafers is processed by a specified one of said tools whenever said specified wafer has been located on said specified tool but has not been processed or said specified wafer is dedicated to said specified tool by said exception rule.

Claim 30

The system according to claim 26 , wherein said automatically calculated priority is a summation of nine terms, said nine terms consisting of process time term, Q-Time term, waiting status term, commit due date term, output term, hot run priority, idle term, super hot run term and exception rule term.

Claim 31

The system according to claim 28 , wherein said process time term reflects effect of the process time and the normal rule is that wafer with shorter process time product is presidential to be processed except said process time term is switched.

Claim 32

The system according to claim 28 , wherein said Q-Time term reflects effect of the Q-time that is the period since a wafer has been waited to be processed, and the normal rule being that wafer with longer Q-Time is presidential to be processed except said Q-Time term is switched.

Claim 33

The system according to claim 28 , wherein said waiting status term reflects whether a wafer is ready to be processed or not.

Claim 34

The system according to claim 28 , wherein said commit due date term is increasing when the commit due date is approached and is more increasing when product is overdue.

Claim 35

The system according to claim 28 , wherein said output term is increasing when the current output is lesser than the scheduled output and is decreasing when the current output is lager than the scheduled output.

Claim 36

The system according to claim 28 , wherein said hot run term is active only when said wafer belong to said hot run.

Claim 37

The system according to claim 28 , wherein said idle term is active only when said wafer has been located on said available tool but has not been processed.

Claim 38

The system according to claim 28 , wherein said super hot run term is active only when said wafer belongs to said super hot run.

Claim 39

The system according to claim 28 , wherein said exception rule is active only when at least one of said exception rule is assigned.

Claim 40

The system according to claim 26 , wherein said priorities of said wafers are automatically recalculated per a specific duration that is assigned by said dispatcher.

Claim 41

The system according to claim 26 , wherein said priorities are automatically recalculated whenever one of said wafers is processed by one of said tools.

Claim 42

The system according to claim 26 , wherein said priorities are automatically recalculated whenever a new said wafer is appeared.

Claim 43

The system according to claim 26 , wherein said priorities are automatically recalculated whenever said limitation database is modified.

Claim 44

The system according to claim 26 , wherein said priorities are automatically recalculated whenever at least one of said system variables is modified.

Claim 45

The system according to claim 26 , when a wafer that belongs to said super hot run is appeared, said wafer being dispatched into one of said available tools to cause a specific process to be processed on said wafer in accordance with these rules as following: when said wafer is assigned to a specified tool by said exception rule and product of preceding process of said specified tool is equal to product of said wafer, then interrupts preceding process of said specified tool to process said wafer by said specified tool; when said wafer is assigned to said specified tool and product of preceding process of said specified tool is not equal to product of said wafer, and when all required materials of said specific process are available, then interrupts preceding process of said specified tool to process said wafer by said specified tool; when said wafer is assigned to said specified tool and product of preceding process of said specified tool is not equal to product of said wafer, and when required materials of said specific process are not all available, then sends a shortage warning message; when said wafer is not assigned to any specified tool and an idle tool with enough required materials of said specific process is available, then said idle tool is used to process said wafer; when said wafer is not assigned to any specified tool and an idle tool with enough required materials of said specific process is not available, and when at least one specific tool with same product as said wafer is available, then preceding process of a chose said specific tool that with lowest priority is interrupted to processed said wafer by said specific tool; when said wafer is not assigned to any specified tool and no idle tool with enough required materials of the specific process is available, and when no tool with same product as the wafer is available and when required materials of the specific process are not all available, then sends said shortage warning message; and when said wafer is not assigned to any specified tool and no idle tool with enough required materials of the specific process is available, and when no tool with same product as said wafer is available but required materials of said specific process are available, then preceding process of a chose said available tool that with lowest priority is interrupted to processed the wafer.

Claim 46

The system according to claim 43 , wherein said materials comprise probe-card when said available tools belong to test equipment.

Claim 47

The system according to claim 26 , when a wafer that belongs to said hot run is appeared, said wafer being dispatched into one of said available tools to cause a specific process to be processed on said wafer in accordance with these rules as following: when said wafer is assigned to a specified tool and product of preceding process of said specified tool is equal to product of said wafer, then processes said wafer by said specified tool when preceding process of said specified tool is finished; when said wafer is assigned to said specified tool and product of preceding process of said specified tool is not equal to product of said wafer, and all required materials of said specific process are available, then processes said wafer by said specified tool when preceding process of said specified tool is finished; when said wafer is assigned to said specified tool and product of preceding process of said specified tool is not equal to product of said wafer, and required materials of said specific process are not all available, then sends a shortage warning message; when said wafer is not assigned to any specified tool and an idle tool with enough required materials of said specific process is available, then process said wafer by said idle tool; when said wafer is not assigned to any specified tool and no idle tool with enough required materials of said specific process is available, and when at least one first specific tool with same product as said wafer is available and preceding processes of said first specific tool can be finished in a Q-Time duration is available, then process said wafer with a chose said first specific tool that with lowest priority when preceding process of said chose first specific tool is finished; when said wafer is not assigned to any specified tool and no idle tool with enough required materials of said specific process is available, and when at least one second specific tool with same product as said wafer is available and no said second specific tool with preceding process that can not be finished in said Q-Time duration is available, then interrupts preceding process of a chose said second specific tool that with lowest priority to process said wafer; when said wafer is not assigned to any specified tool and no idle tool with enough required materials of said specific process is available, and when no tool that fabricates same product as said wafer is available and when required materials of said specific process are not all available, then sends said shortage warning message; when said wafer is not assigned to any specified tool and no idle tool with enough required materials of said specific process is available, and no said available tool with same product as said wafer is exist but all required materials of said specific process are available, and at least one third specific tool that preceding process can be finished in said Q-Time duration is available, then process said wafer by an earliest third specific tool that preceding process is finished earliest; and when said wafer is not assigned to any specified tool and no idle tool with enough required materials of said specific process is available, and no available tool with same product as said wafer is exist but all required materials of said specific process are available, and all said available tools can not finish preceding process in said Q-Time duration, then interrupt preceding process of a lowest available tool to process said wafer where said lowest available tool is one of said available tools that priority of product of preceding process is lowest.

Claim 48

The system according to claim 45 , wherein said required materials comprise probe-card when said available tools belong to test equipment, and solution when available tools belong to wet etching equipment.

Claim 49

The system according to claim 26 , when preceding process of a specific tool is finished and said specific tool can be used to process a succeeding process, one of said wafers that belongs to a normal run being dispatched into said specific tool in accordance with following rules: when a specified product is assigned to be fabricated by said specific tool in accordance with said exception rule and when a plurality of first specific wafers with said specified product are available, and when product of said preceding process is equal to said specified product, then said specific tool is used to process some of said first specific wafers that with highest priority to fabricated said specified product; when a specified product is assigned to be fabricated by said specific tool in accordance with said exception rule and when a plurality of second specific wafers with said specified product are available, and when product of said preceding process is not equal to said specified product but all required materials of said specific process are available, then said specific tool is used to process some of said second specific wafers that with highest priority to fabricate said specified product; when a specified product is assigned to be fabricated by said specific tool in accordance with said exception rule and when a plurality of third specific wafers with said specified product are available, and when product of said preceding process is not equal to said specified product and required materials of said specific process are not all available, then sends a shortage warning message and the assignment relation between said specific tool and said specified product is cancelled; when said specific tool is not assigned to process any specified product and scheduled output of product of said preceding process of said specific tool is not achieved, and a plurality of fourth specific wafers with same product as said preceding process are available, then said specific tool is used to process some of said fourth specific wafer that with highest priority; when said specific tool is not assigned to process any specified product and scheduled output of product of said preceding process is not achieved, and no wafer with same product as said preceding process of said specific tool is available but a plurality of fifth specific wafers with both different products and sufficient required materials of said different products are available, then said specific tool is used to process some of said fifth specific wafers that with highest priority; when said specific tool is not assigned to process any specified product and scheduled output of product of said preceding process is not achieved, and no wafer with same product as said preceding process is available and no wafer with different product and sufficient required materials of said different product is available, then said specific tool is idle and a wafer pull-in list is sent; when said specific tool is not assigned to process any specified product and scheduled output of product of said preceding process is achieved, and when no wafer with product that scheduled output is not achieved is available and a plurality of sixth specific wafers with both same product as said preceding process and sufficient materials of product of said sixth specific wafers are available, then said specific tool is used to process part of said sixth specific wafers that with highest priority; when said specific tool is not assigned to process any specified product and scheduled output of product of said preceding process is achieved, and when no wafer with product that scheduled output is not achieved is available and no wafer with same product as said preceding process is available, and when a plurality of seventh specific wafers that corresponding product is not equal to product of said preceding process are available and sufficient required materials of said seventh specific wafers are available, then said specific tool is used to process part of said seventh specific wafers that with highest priority; when said specific tool is not assigned to process any specified product and scheduled output of product of said preceding process is achieved, and when no wafer with product that scheduled output is not achieved is available and no wafer with same product as said preceding process is available, and when no wafer with sufficient required materials is available, then said specific tool is idle and said wafer pull-in list is sent; when said specific tool is not assigned to process any specified product and scheduled output of product of said preceding process is achieved, and when a plurality of eighth specific wafers with product that scheduled output is not achieved are available and required materials of said eighth specific wafers are available, then said specific tool is used to process some of said eighth wafers that with highest priority; when said specific tool is not assigned to process any specified product and scheduled output of product of said preceding process is achieved, and when a plurality of ninth specific wafers with product that scheduled output are not achieved are available but required materials of said ninth specific wafers are not available, and when a plurality of tenth specific wafers with product that required materials are sufficient are available, then said specific tool is used to process part of said tenth specific wafers that with highest priority; and when said specific tool is not assigned to process any specified product and scheduled output of product of said preceding process is achieved, and when a plurality of eleventh specific wafers with product that scheduled output is not achieved are available but required materials of said eleventh specific wafers are not available, and also when no wafer with product that required materials is sufficient is available, then said specific tool is idle and said wafer pull-in list is sent.

Claim 50

The system according to claim 47 , further comprising when said shortage warning message is sent, re-dispatching said wafers in accordance with a preferential rule that wafers with product that required materials are not all available are not dispatched until required materials are available.

Claim 51

The method according to claim 47 , further comprising when the assignment relation between said specific tool and said specified product is cancelled, re-dispatching wafers into said specific tool in accordance with an antecedent that said specific tool is not assigned to process any specified product.

Claim 54

The system according to claim 50 , wherein said exception rule comprises information about which specified lot is assigned to be process by which specified tool.

Claim 55

The system according to claim 50 , wherein said exception rule comprises information about which specified tool is assigned to fabricate a specific product, any lot with product as said specific product must be processed by said specified tool.

Claim 56

The system according to claim 50 , wherein said system variables are modified by said dispatcher.

Claim 57

The system according to claim 50 , wherein said priority is a summation of process time term, Q-Time term, waiting status term, commit due date term, output term, hot run priority, idle term, super hot run term and exception rule term.

Claim 58

The system according to claim 54 , wherein said process time term reflects effect of the process time and the normal rule is that wafer with shorter process time product is presidential to be processed except said process time term is switched.

Claim 59

The system according to claim 54 , wherein said Q-Time term reflects effect of the Q-time that is the period since a wafer has been waited to be processed, and the normal rule is that wafer with longer Q-Time is presidential to be processed except said Q-Time term is switched.

Claim 60

The system according to claim 54 , wherein said waiting status term is used to reflect whether a wafer is ready or not.

Claim 61

The system according to claim 54 , wherein said commit due date term is increasing when the commit due date is approached and is more increasing when product is overdue.

Claim 62

The system according to claim 54 , wherein said output term is increasing when the current output is lesser than scheduled output and is decreasing when the current output is lager than scheduled output.

Claim 63

The system according to claim 54 , wherein said hot run term is active only when wafer belong to said hot run.

Claim 64

The system according to claim 54 , wherein said idle term is active only when wafer has been located on said available tool but has not been processed.

Claim 65

The system according to claim 54 , wherein said super hot run term is active only when wafer belongs to said super hot run.

Claim 66

The system according to claim 54 , wherein said exception rule is active only when at least one said exception rule is assigned.

Claim 67

The system according to claim 50 , wherein conditions for automatically recalculating said priorities of said lots comprises a specific duration that is assigned by said dispatcher is arrived, one of said lots is processed by one of said tools, a new said lot is appeared, said limitation database is modified, and at least one of said system variables is modified.

Claim 68

The system according to claim 50 , when a wafer that belongs to said super hot run is appeared, said wafer being dispatched into one of said available tools to cause a specific process is processed on said wafer in accordance with these rules as following: when said wafer is assigned to a specified tool by said exception rule and product of preceding process of said specified tool is equal to product of said wafer, then interrupts preceding process of said specified tool to process said wafer by said specified tool; when said wafer is assigned to said specified tool and product of preceding process of said specified tool is not equal to product of said wafer, and all when required materials of said specific process are available, then interrupts preceding process of said specified tool to process said wafer by said specified tool; when said wafer is assigned to said specified tool and product of preceding process of said specified tool is not equal to product of said wafer, and when required materials of said specific process are not all available, then sends a shortage warning message; when said wafer is not assigned to any specified tool and an idle tool with enough required materials of said specific process is available, then said idle tool is used to process said wafer; when said wafer is not assigned to any specified tool and an idle tool with enough required materials of said specific process is not available, and when at least one specific tool with same product as said wafer is available, then preceding process of a chose said specific tool that with lowest priority is interrupted to processed said wafer by said specific tool; when said wafer is not assigned to any specified tool and no idle tool with enough required materials of the specific process is available, and when no tool with same product as the wafer is available and when required materials of the specific process are not all available, then sends said shortage warning message; and when said wafer is not assigned to any specified tool and no idle tool with enough required materials of the specific process is available, and when no tool with same product as said wafer is available but required materials of said specific process are available, then preceding process of a chose said available tool that with lowest priority is interrupted to processed the wafer.

Claim 69

The system according to claim 50 , when a wafer that belongs to said hot run is appeared, said wafer being dispatched into one of said available tools to cause a specific process to be processed on said wafer in accordance with these rules as following: when said wafer is assigned to a specified tool and product of preceding process of said specified tool is equal to product of said wafer, then processes said wafer by said specified tool when preceding process of said specified tool is finished; when said wafer is assigned to said specified tool and product of preceding process of said specified tool is not equal to product of said wafer, and all required materials of said specific process are available, then processes said wafer by said specified tool when preceding process of said specified tool is finished; when said wafer is assigned to said specified tool and product of preceding process of said specified tool is not equal to product of said wafer, and required materials of said specific process are not all available, then sends a shortage warning message; when said wafer is not assigned to any specified tool and an idle tool with enough required materials of said specific process is available, then process said wafer by said idle tool; when said wafer is not assigned to any specified tool and no idle tool with enough required materials of said specific process is available, and when at least one first specific tool with same product as said wafer is available and preceding processes of said first specific tool can be finished in a Q-Time duration is available, then process said wafer with a chose said first specific tool that with lowest priority when preceding process of said chose first specific tool is finished; when said wafer is not assigned to any specified tool and no idle tool with enough required materials of said specific process is available, and when at least one second specific tool with same product as said wafer is available and no said second specific tool with preceding process that can not be finished in said Q-Time duration is available, then interrupts preceding process of a chose said second specific tool that with lowest priority to process said wafer; when said wafer is not assigned to any specified tool and no idle tool with enough required materials of said specific process is available, and when no tool that fabricates same product as said wafer is available and when required materials of said specific process are not all available, then sends said shortage warning message; when said wafer is not assigned to any specified tool and no idle tool with enough required materials of said specific process is available, and no said available tool with same product as said wafer is exist but all required materials of said specific process are available, and at least one third specific tool that preceding process can be finished in said Q-Time duration is available, then process said wafer by an earliest third specific tool that preceding process is finished earliest; and when said wafer is not assigned to any specified tool and no idle tool with enough required materials of said specific process is available, and no available tool with same product as said wafer is exist but all required materials of said specific process are available, and all said available tools can not finish preceding process in said Q-Time duration, then interrupt preceding process of a lowest available tool to process said wafer where said lowest available tool is one of said available tools that priority of product of preceding process is lowest.

Claim 70

The system according to claim 50 , when preceding process of a specific tool is finished and said specific tool can be used to process a succeeding process, one of said wafers that belongs to a normal run being dispatched into said specific tool in accordance with following rules: when a specified product is assigned to be fabricated by said specific tool in accordance with said exception rule and when a plurality of first specific wafers with said specified product are available, and when product of said preceding process is equal to said specified product, then said specific tool is used to process some of said first specific wafers that with highest priority to fabricated said specified product; when a specified product is assigned to be fabricated by said specific tool in accordance with said exception rule and when a plurality of second specific wafers with said specified product are available, and when product of said preceding process is not equal to said specified product but all required materials of said specific process are available, then said specific tool is used to process some of said second specific wafers that with highest priority to fabricate said specified product; when a specified product is assigned to be fabricated by said specific tool in accordance with said exception rule and when a plurality of third specific wafers with said specified product are available, and when product of said preceding process is not equal to said specified product and required materials of said specific process are not all available, then sends a shortage warning message and the assignment relation between said specific tool and said specified product is cancelled; when said specific tool is not assigned to process any specified product and scheduled output of product of said preceding process of said specific tool is not achieved, and a plurality of fourth specific wafers with same product as said preceding process are available, then said specific tool is used to process some of said fourth specific wafer that with highest priority; when said specific tool is not assigned to process any specified product and scheduled output of product of said preceding process is not achieved, and no wafer with same product as said preceding process of said specific tool is available but a plurality of fifth specific wafers with both different products and sufficient required materials of said different is products are available, then said specific tool is used to process some of said fifth specific wafers that with highest priority; when said specific tool is not assigned to process any specified product and scheduled output of product of said preceding process is not achieved, and no wafer with same product as said preceding process is available and no wafer with different product and sufficient required materials of said different product is available, then said specific tool is idle and a wafer pull-in list is sent; when said specific tool is not assigned to process any specified product and scheduled output of product of said preceding process is achieved, and when no wafer with product that scheduled output is not achieved is available and a plurality of sixth specific wafers with both same product as said preceding process and sufficient materials of product of said sixth specific wafers are available, then said specific tool is used to process part of said sixth specific wafers that with highest priority; when said specific tool is not assigned to process any specified product and scheduled output of product of said preceding process is achieved, and when no wafer with product that scheduled output is not achieved is available and no wafer with same product as said preceding process is available, and when a plurality of seventh specific wafers that corresponding product is not equal to product of said preceding process are available and sufficient required materials of said seventh specific wafers are available, then said specific tool is used to process part of said seventh specific wafers that with highest priority; when said specific tool is not assigned to process any specified product and scheduled output of product of said preceding process is achieved, and when no wafer with product that scheduled output is not achieved is available and no wafer with same product as said preceding process is available, and when no wafer with sufficient required materials is available, then said specific tool is idle and said wafer pull-in list is sent; when said specific tool is not assigned to process any specified product and scheduled output of product of said preceding process is achieved, and when a plurality of eighth specific wafers with product that scheduled output is not achieved are available and required materials of said eighth specific wafers are available, then said specific tool is used to process some of said eighth wafers that with highest priority; when said specific tool is not assigned to process any specified product and scheduled output of product of said preceding process is achieved, and when a plurality of ninth specific wafers with product that scheduled output are not achieved are available but required materials of said ninth specific wafers are not available, and when a plurality of tenth specific wafers with product that required materials are sufficient are available, then said specific tool is used to process part of said tenth specific wafers that with highest priority; and when said specific tool is not assigned to process any specified product and scheduled output of product of said preceding process is achieved, and when a plurality of eleventh specific wafers with product that scheduled output is not achieved are available but required materials of said eleventh specific wafers are not available, and also when no wafer with product that required materials is sufficient is available, then said specific tool is idle and said wafer pull-in list is sent.