Patent US6414384B1 successfully refreshed from Google Patents.
US6414384B1
Expired / Lapsed
US
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Package structure stacking chips on front surface and back surface of substrate
Assignee: Siliconware Precision Industries Co Ltd
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Filing: 2000-12-22
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Granted: 2002-07-02
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Expires: 2020-12-22
Abstract
Abstract A package structure stacking chips on a front surface and a back surface of a substrate including at least a substrate, a plurality of chip sets, a plurality of support members, a plurality of glue layers, a plurality of wires, and a mold compound. The substrate has a front surface and a back surface opposite to the front surface. Each chip set has one or more chips, each chip having a plurality of bonding pads. The chip sets are stacked as a laminate on the front surface of the substrate, respectively. A plurality of support members are arranged between each two adjacent chip sets. A glue layers are used to connect the support members, the chip sets, and the substrate. The chip in the same chip sets is electrically connected to each other or to the substrate by the bonding pads. Finally, the front surface of the substrate, the support members, the chip sets, and the glue layers are encapsulated with a mold compound. Moreover, a plurality of flip chips are deposited on the back surface of the substrate.
Inventors
- 👤 Randy H. Y. Lo
- 👤 Chien-Ping Huang
- 👤 Chi-Chuan Wu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 12:31
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W90/00; H10W72/00; H10W72/071; H10W72/075; H10W72/30; H10W72/381; H10W72/50; H10W72/541; H10W72/5445; H10W72/551; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W72/932; H10W72/951; H10W74/15; H10W90/20; H10W90/231; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/732; H10W90/734; H10W90/751; H10W90/753; H10W90/754
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
191 words
A package structure with chips stacked on a front surface and a back surface of a substrate, comprising: a substrate having a front surface and a back surface opposite to the front surface; a plurality of chip sets, each chip set including one or more chips, each chip comprising a plurality of bonding pads, and the chip sets being stacked according to a lamination manner on the front surface of the substrate, wherein the chips of each chip set are arranged side by side in the same plane and an upper chip set and a lower chip set in the stack have substantially the same size within a deviation range of 0.3 mm; a plurality of support members arranged between every two adjacent chip sets, respectively; a plurality of glue layers arranged between the support members, the chip sets, and the substrate; a plurality of wires electrically connecting the chips to one another and to the substrate; a mold compound covering the front surface of the substrate, the support members, the chip sets, and the glue layers; and a plurality of flip chips deposited on the back surface of the substrate.
Claim 2
Dependent Claim
191 words
A package structure with chips stacked on a front surface and a back surface of a substrate, comprising: a substrate having a front surface and a back surface opposite to the front surface; a plurality of chip sets, each chip set including one or more chips, each chip comprising a plurality of bonding pads, and the chip sets being stacked according to a lamination manner on the front surface of the substrate, wherein the chips of each chip set are arranged side by side in the same plane and an upper chip set and a lower chip set in the stack have substantially the same size within a deviation range of 0.3 mm; a plurality of support members arranged between every two adjacent chip sets, respectively; a plurality of glue layers arranged between the support members, the chip sets, and the substrate; a plurality of wires electrically connecting the chips to one another and to the substrate; a mold compound covering the front surface of the substrate, the support members, the chip sets, and the glue layers; and a plurality of flip chips deposited on the back surface of the substrate.
Claim 3
Dependent Claim
21 words
The structure according to claim 1 , wherein the back surface of the substrate further includes a plurality of solder balls.
Claim 4
Dependent Claim
17 words
The structure according to claim 1 , wherein the material used for the support member is silicon.
Claim 5
Dependent Claim
15 words
The structure according to claim 1 , wherein the support member is a dummy chip.
Claim 6
Dependent Claim
34 words
The structure according to claim 1 , wherein the material used for the support member is metal, and the coefficient of thermal expansion of the support member is close to that of the chip.
Claim 7
Dependent Claim
18 words
The structure according to claim 1 , wherein the material used for the glue layer is silver paste.
Claim 8
Dependent Claim
22 words
The structure according to claim 1 , wherein the material used for the glue layer is thermally conductive but not electrically conductive.
Claim 9
Dependent Claim
14 words
The structure according to claim 1 , wherein the mold compound is epoxy resin.
Claim 10
Dependent Claim
17 words
The structure according to claim 1 , wherein the flip chips are Application Specific Integrated Circuits (ASICs).
Claim 11
Dependent Claim
151 words
A package structure with chips stacked on a front surface and a back surface of a substrate, comprising: a substrate having a front surface and a back surface opposite to the front surface of the substrate; a plurality of chip sets, each chip set including one or more chips, each chip comprising a plurality of bonding pads, and the chip sets being stacked according to a lamination manner on the front surface of the substrate; a plurality of support members arranged between every two adjacent chip sets, respectively; a plurality of glue layers arranged between the support members, the chip sets, and the substrate; a plurality of wires electrically connecting the chips to one another and to the substrate; a mold compound covering the front surface of the substrate, the support members, the chip sets, and the glue layers; and a flip chip deposited on the back surface of the substrate.
Claim 12
Dependent Claim
151 words
A package structure with chips stacked on a front surface and a back surface of a substrate, comprising: a substrate having a front surface and a back surface opposite to the front surface of the substrate; a plurality of chip sets, each chip set including one or more chips, each chip comprising a plurality of bonding pads, and the chip sets being stacked according to a lamination manner on the front surface of the substrate; a plurality of support members arranged between every two adjacent chip sets, respectively; a plurality of glue layers arranged between the support members, the chip sets, and the substrate; a plurality of wires electrically connecting the chips to one another and to the substrate; a mold compound covering the front surface of the substrate, the support members, the chip sets, and the glue layers; and a flip chip deposited on the back surface of the substrate.
Claim 13
Dependent Claim
22 words
The structure according to claim 10 , further comprising one or more flip chips deposited on the back surface of the substrate.
Claim 14
Dependent Claim
47 words
The structure according to claim 10 , wherein the chips of each chip set are arranged side by side in the same plane and the upper chip set and the lower chip set in the laminate have substantially the same size with a deviation within 0.3 mm.
Claim 15
Dependent Claim
20 words
The structure according to claim 10 , further comprising a plurality of solder balls on the back of the substrate.
Claim 16
Dependent Claim
16 words
The structure according to claim 10 , wherein the material for the support member is silicon.
Claim 17
Dependent Claim
14 words
The structure according to claim 10 , the support member is a dummy chip.
Claim 18
Dependent Claim
34 words
The structure according to claim 10 , wherein the material used for the support member is metal, and the coefficient of thermal expansion of the support member is close to that of the chip.
Claim 19
Dependent Claim
18 words
The structure according to claim 10 , wherein the material used for the glue layer is silver paste.
Claim 20
Dependent Claim
22 words
The structure according to claim 10 , wherein the material used for the glue layer is thermally conductive but not electrically conductive.
Claim 21
Dependent Claim
14 words
The structure according to claim 10 , wherein the mold compound is epoxy resin.
Claim 22
Dependent Claim
17 words
The structure according to claim 10 , wherein the flip chip is Application Specific Integrated Circuits (ASICs).
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-07-01 | 2005-12-31 | 2006-07-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-07-01 | 2009-12-31 | 2010-07-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-07-01 | 2013-12-31 | 2014-07-02 | $7700.00 | Window Closed / Lapsed |