Semiconductor device and method for making the same

Claim 1

A method for making a semiconductor device which includes a substrate formed with a terminal, a first semiconductor chip mounted on the substrate and having a main surface formed with an inner electrode pad and an outer electrode, a second semiconductor chip having a main surface facing the first semiconductor chip and formed with an electrode pad opposed to the inner electrode pad of the first semiconductor chip, and a package containing the first and the second semiconductor chips, the first and the second semiconductor chips being electrically connected with each other within the package, the method comprising steps of; forming a gold bump on the electrode pad of the first semiconductor chip, forming a gold bump on the electrode pad of the second semiconductor chip, electrically connecting the terminal of the substrate to the outer electrode pad of the first semiconductor chip through a gold wire which is supplied from a capillary; forming an easily deformable gold stud bump on the gold bump of the first semiconductor chip or on the gold bump of the second semiconductor chip, the stud bump being formed by using the same capillary as previously used for electrically connecting the terminal of the substrate to the outer electrode pad of the first semiconductor chip; causing the first and the second semiconductor chips to face each other so that the electrode pad on the first semiconductor chip faces the electrode pad on the second semiconductor chip, and pressing the semiconductor chips to each other.

Claim 2

A method for making a semiconductor device which includes a substrate formed with a terminal, a first semiconductor chip mounted on the substrate and having a main surface formed with an inner electrode pad and an outer electrode, a second semiconductor chip having a main surface facing the first semiconductor chip and formed with an electrode pad opposed to the inner electrode pad of the first semiconductor chip, and a package containing the first and the second semiconductor chips, the first and the second semiconductor chips being electrically connected with each other within the package, the method comprising steps of; forming a gold bump on the electrode pad of the first semiconductor chip, forming a gold bump on the electrode pad of the second semiconductor chip, electrically connecting the terminal of the substrate to the outer electrode pad of the first semiconductor chip through a gold wire which is supplied from a capillary; forming an easily deformable gold stud bump on the gold bump of the first semiconductor chip or on the gold bump of the second semiconductor chip, the stud bump being formed by using the same capillary as previously used for electrically connecting the terminal of the substrate to the outer electrode pad of the first semiconductor chip; causing the first and the second semiconductor chips to face each other so that the electrode pad on the first semiconductor chip faces the electrode pad on the second semiconductor chip, and pressing the semiconductor chips to each other.