US5926694A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device and a manufacturing method thereof
Assignee: PFU Ltd
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Filing: 1997-07-11
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Granted: 1999-07-20
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Expires: 2017-07-11
Abstract
Abstract A manufacturing method of a semiconductor device for mounting an LSI bare-chip component, or a bare chip, on a printed circuit board, or a substrate, with flip-chip bonding technology, that includes a recess forming step of forming recesses on substrate pads of the substrate, an adhesive coating step of applying adhesive to a location on the substrate at which the bare chip is to be placed, a chip mounting step of placing the bare chip on the substrate while aligning positions of the bumps formed on the chip pads of the bare chip and the substrate pads of the substrate, and an adhesive hardening step of hardening the applied adhesive.
Inventors
- 👤 Yasuhide Chigawa
- 👤 Ippei Fujiyama
- 👤 Kenji Matsuda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 17:02
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W72/00; H10W72/30; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H10W70/681; H10W72/01; H10W72/012; H10W72/01221; H10W72/01225; H10W72/071; H10W72/072; H10W72/073; H10W72/20; H10W72/241; H10W72/251; H10W72/252; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/853; H10W72/856; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
127 words
A manufacturing method of a semiconductor device comprising a bare chip having a plurality of chip pads and a substrate having a plurality of substrate pads, said method comprising: a recess forming step for forming a recess by exerting a pushing force at a location of a substrate pad of said substrate corresponding to one or a plurality of chip pads of said bare chip; an adhesive coating step for applying adhesive to a location of said substrate at which said bare chip is disposed; a bare chip mounting step for placing said bare chip on said substrate by positioning bumps formed on said chip pads of said bare chip on said substrate pad of said substrate; and an adhesive hardening step for hardening said applied adhesive.
Claim 2
Dependent Claim
127 words
A manufacturing method of a semiconductor device comprising a bare chip having a plurality of chip pads and a substrate having a plurality of substrate pads, said method comprising: a recess forming step for forming a recess by exerting a pushing force at a location of a substrate pad of said substrate corresponding to one or a plurality of chip pads of said bare chip; an adhesive coating step for applying adhesive to a location of said substrate at which said bare chip is disposed; a bare chip mounting step for placing said bare chip on said substrate by positioning bumps formed on said chip pads of said bare chip on said substrate pad of said substrate; and an adhesive hardening step for hardening said applied adhesive.
Claim 3
Dependent Claim
98 words
A manufacturing method of a semiconductor device according to claim 1, further comprising: a composite step for placing said bare chip on said substrate to which said adhesive has been applied while positioning said bumps on said substrate pads of said substrate, forcing said placed bare chip onto said substrate until each of said substrate pads of said substrate is recessed, and hardening said applied adhesive during said pushing process, wherein after said adhesive coating step, said recess forming step, said bare chip mounting step, and said adhesive hardening step are carried out simultaneously in said composite step.
Claim 4
Dependent Claim
66 words
A manufacturing method of a semiconductor device according to claim 1, wherein said recess is formed on said substrate pads in said recess forming step by forcing said bare chip on which said bumps have been formed onto said substrate pads, and wherein said adhesive coating step, said bare chip mounting step, and said adhesive hardening step are sequentially carried out after said recess forming step.
Claim 5
Dependent Claim
75 words
A manufacturing method of a semiconductor device according to claim 1, wherein said recess is formed on said substrate pads in said recess forming step using a jig having projections corresponding to locations of said bumps of said bare chip, and forcing said jig onto said substrate pads of said substrate, and wherein said adhesive coating step, said chip mounting step, and said adhesive hardening step are sequentially carried out after said recess forming step.
Claim 6
Dependent Claim
34 words
A manufacturing method of a semiconductor device according to claim 4, wherein said jig includes a projection having a ridge of a predetermined length, and is forced onto said substrate pads of said substrate.
Claim 7
Dependent Claim
33 words
A manufacturing method of a semiconductor device according to claim 4, wherein said jig includes a plurality of projections arranged at certain intervals, and is forced onto said substrate pads of said substrate.
Claim 8
Dependent Claim
39 words
A manufacturing method of a semiconductor device according to claim 4, wherein said jig is kept at a high temperature so that said jig is prevented from cooling below a predetermined temperature between recess forming steps using said jig.
Claim 9
Dependent Claim
46 words
A manufacturing method of a semiconductor device according to claim 1, wherein a pushing force is exerted after said substrate is heated above a temperature at which an elasticity modulus of said substrate is lowered in said recess forming step, and then said substrate is cooled.
Claim 10
Dependent Claim
22 words
A manufacturing method of a semiconductor device according to claim 8, wherein said substrate is heated before said pushing force is applied.
Claim 11
Dependent Claim
25 words
A manufacturing method of a semiconductor device according to claim 8, wherein a pushing force is removed from said substrate before said cooling is completed.
Claim 12
Dependent Claim
55 words
A manufacturing method of a semiconductor device according to claim 1, wherein said bare chip is placed on said substrate under pressure in said bare chip mounting step, and said adhesive hardening step is carried out by applying pressure and heat to harden said adhesive using a process different from said bare chip mounting step.
Claim 13
Dependent Claim
23 words
A manufacturing method of a semiconductor device according to claim 1, wherein a material having high elastic deformability is used for said substrate.
Claim 14
Dependent Claim
29 words
A manufacturing method of a semiconductor device according to claim 2, wherein said applied adhesive is hardened by by being heated to a predetermined temperature in said composite step.
Claim 15
Dependent Claim
33 words
A manufacturing method of a semiconductor device according to claim 4, wherein said substrate is heated above a temperature at which an elasticity modulus of said substrate is lowered in said composite step.
Claim 16
Dependent Claim
29 words
A manufacturing method of a semiconductor device according to claim 2, wherein said bare chip is forced onto said substrate with a predetermined pushing force in said composite step.
Claim 17
Dependent Claim
38 words
A manufacturing method of a semiconductor device according to claim 2, wherein air bubbles contained in adhesive to be applied in said composite step are removed by rotating said adhesive in a vacuum in said adhesive coating step.
Claim 18
Dependent Claim
30 words
A manufacturing method of a semiconductor device according to claim 1, wherein said substrate is heated so that viscosity of said adhesive applied in said adhesive coating step is lowered.
Claim 19
Dependent Claim
76 words
A manufacturing method of a semiconductor device according to claim 1, wherein a plurality of locations, including a center point and corner points of areas at which said bare chip is to be placed, are set as locations to which said adhesive is applied, and said adhesive is applied to said locations with predetermined coating amounts of said adhesive which are gradually reduced as a distance from said center point increases in said adhesive coating step.
Claim 20
Dependent Claim
23 words
A manufacturing method of a semiconductor device according to claim 1, wherein a surface of said substrate pads of said substrate is roughened.
Claim 21
Dependent Claim
53 words
A manufacturing method of a semiconductor device according to claim 1, wherein dimensional values of said substrate pads of said substrate are measured, and the pushing force of said recess forming step is determined based on said measured dimensional values, so that said substrate is forced in accordance with said determined pushing force.
Claim 22
Dependent Claim
60 words
A manufacturing method of a semiconductor device according to claim 2, wherein said bare chip is initially forced onto said substrate by setting said pushing force to a smaller value, and said pushing force is increased to a predetermined value and said bare chip is forced onto said substrate prior to the hardening of said adhesive in said composite step.
Claim 23
Dependent Claim
54 words
A manufacturing method of a semiconductor device according to claim 2, wherein a recessed amount corresponding to the recess of said substrate pads in said composite step is measured allowing for a collapsed amount of said bumps, and said bare chip is forced onto said substrate until said recessed amount reaches a predetermined value.
Claim 24
Dependent Claim
37 words
A manufacturing method of a semiconductor device according to claim 22, wherein a pushing force is applied to each of said bumps prior to said composite step, whereby a height of each of said bumps prevents deforming.
Claim 25
Dependent Claim
52 words
A manufacturing method of a semiconductor device according to claim 22, wherein said bare chip is forced onto said substrate in said composite step while increasing said pushing force by stages in accordance with increases in temperature of said substrate until the recessed amount of said substrate pads reaches a predetermined value.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-07-19 | 2003-01-18 | 2003-07-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-07-19 | 2007-01-18 | 2007-07-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-07-19 | 2011-01-18 | 2011-07-20 | $7700.00 | Window Closed / Lapsed |