Projection exposure apparatus and method

Claim 2

A projection exposure method for exposing sensitive substrates by projecting a pattern formed on a mask through a projection optical system onto the sensitive substrates, comprising: preparing a first substrate stage and a second substrate stage, each of which is movable independently on a two-dimensional plane while holding a sensitive substrate; and performing, by using the first substrate stage, at least one of an exchange operation for the sensitive substrate and a detecting operation for a mark on the first stage or on the sensitive substrate held on the first stage, while executing a scanning exposure operation for the sensitive substrate held on the second substrate stage, wherein each of shot areas on the sensitive substrate held on the second substrate stage is exposed by moving the second substrate stage while projecting the pattern on the mask onto the sensitive substrate held on the second substrate stage, and wherein the two substrate stages are controlled such that the two substrate stages do not physically interfere with each other.

Claim 3

The projection exposure method according to claim 1 , wherein the operations of the two substrate stages are switched between one another when the operations of the two substrate stages are completed.

Claim 4

The projection exposure method according to claim 2 , wherein moving regions of the two substrate stages are switched between one another when the operations of the two substrate stages are completed.

Claim 5

The projection exposure method according to claim 1 , wherein the second substrate stage is prevented from vibration when the first substrate stage is moved.

Claim 6

The projection exposure method according to claim 1 , wherein a moving region of the first substrate stage which executes the at least one of the exchange operation and the detection operation overlaps a moving region of the second substrate stage which executes the scanning exposure operation.

Claim 7

A method for making a device, the method comprising performing a lithography process utilizing the method defined in claim 1 .

Claim 8

The projection exposure method according to claim 1 , wherein predetermined information is stored to prevent the two substrate stages from physically interfering with each other.

Claim 9

The projection exposure method according to claim 1 , wherein the first substrate stage is moved to sequentially detect a plurality of marks on the substrate held on the first substrate stage in the detecting operation.

Claim 10

A projection exposure method for exposing sensitive substrates by projecting an image of a pattern formed on a mask via a projection optical system onto the sensitive substrates, comprising: preparing a first substrate stage and a second substrate stage, each of which moves independently on a two-dimensional plane while holding a sensitive substrate; and successively exposing, by projection, a plurality of portions on the sensitive substrate held on the first substrate stage with the image of the pattern formed on the mask, and successively detecting a plurality of marks on the sensitive substrate held on the second substrate stage concurrently therewith, wherein an order of the detection of the marks on the sensitive substrate held on the second substrate stage is determined so that the two substrate stages do not physically interfere with each other.

Claim 11

A projection exposure method for exposing sensitive substrates by projecting an image of a pattern formed on a mask via a projection optical system onto the sensitive substrates, comprising: preparing a first substrate stage and a second substrate stage, each of which moves independently on a two-dimensional plane while holding a sensitive substrate; and successively exposing, by projection, a plurality of portions on the sensitive substrate held on the first substrate stage with the image of the pattern formed on the mask, and successively detecting a plurality of marks on the sensitive substrate held on the second substrate stage concurrently therewith, wherein an order of the detection of the marks on the sensitive substrate held on the second substrate stage is determined so that the two substrate stages do not physically interfere with each other.

Claim 12

The projection exposure method according to claim 9 , wherein each of the portions on the sensitive substrate held on the first substrate stage is exposed with a scanning exposure operation.

Claim 13

The projection exposure method according to claim 9 , wherein the first substrate stage is prevented from vibration when the second substrate stage is moved.

Claim 14

A method for making a device, the method comprising performing a lithography process utilizing the method defined in claim 2 .

Claim 15

A projection exposure method for exposing sensitive substrates by projecting a pattern formed on a mask through a projection optical system onto the sensitive substrates, comprising: preparing a first substrate stage and a second substrate stage, each of which is movable independently on a two-dimensional plane while holding a sensitive substrate; and performing, by using the first substrate stage, at least one of an exchange operation for the sensitive substrate and a detecting operation for a mark on the first substrate stage or on the sensitive substrate held on the first substrate stage, while executing an exposure operation for the sensitive substrate held on the second substrate stage, wherein a moving region of the first substrate stage which executes the at least one of the exchange operation and the detecting operation overlaps a moving region of the second substrate stage which executes the exposure operation and wherein the two substrate stages are controlled such that the two substrate stages do not physically interfere with each other.

Claim 16

A projection exposure method for exposing sensitive substrates by projecting a pattern formed on a mask through a projection optical system onto the sensitive substrates, comprising: preparing a first substrate stage and a second substrate stage, each of which is movable independently on a two-dimensional plane while holding a sensitive substrate; and performing, by using the first substrate stage, at least one of an exchange operation for the sensitive substrate and a detecting operation for a mark on the first substrate stage or on the sensitive substrate held on the first substrate stage, while executing an exposure operation for the sensitive substrate held on the second substrate stage, wherein a moving region of the first substrate stage which executes the at least one of the exchange operation and the detecting operation overlaps a moving region of the second substrate stage which executes the exposure operation and wherein the two substrate stages are controlled such that the two substrate stages do not physically interfere with each other.

Claim 17

The projection exposure method according to claim 13 , wherein the second substrate stage is prevented from vibration when the first substrate stage is moved.

Claim 18

The projection exposure method according to claim 13 , wherein predetermined information is stored to prevent the two substrate stages from physically interfering with each other.

Claim 19

The projection exposure method according to claim 13 , wherein the first substrate stage is moved to sequentially detect a plurality of marks on the substrate held on the first substrate stage in the detecting operation.

Claim 20

The projection exposure method according to claim 13 , wherein the operations of the two substrate stages are switched between one another when the operations of the two substrate stages are completed.

Claim 21

The projection exposure method according to claim 17 , wherein moving regions of the two substrate stages are switched between one another when the operations of the two substrate stages are completed.

Claim 22

A method for making a device, the method comprising performing a lithography process utilizing the method defined in claim 13 .

Claim 23

A projection exposure apparatus for sequentially exposing sensitive substrates by projecting a pattern formed on a mask illuminated with an exposure beam, the apparatus comprising: a projection system, disposed in a path of the exposure beam, which projects the pattern onto a sensitive substrate; a stage system, disposed on an image plane side of the projection system, which has a first substrate stage and a second substrate stage, each of which is movable independently in a plane while holding a sensitive substrate; and a control system, functionally associated with the stage system, which controls the stage system to perform, by controlling the first substrate stage, at least one of an exchange operation for the sensitive substrate and a detecting operation for a mark on the first substrate stage or on the sensitive substrate held on the first substrate stage, while executing a scanning exposure operation for the sensitive substrate held on the second substrate stage, wherein each of shot areas on the sensitive substrate held on the second substrate stage is exposed while moving the second substrate stage, and wherein the control system controls the two substrate stages such that the two substrate stages do not physically interfere with each other.

Claim 24

A projection exposure apparatus for sequentially exposing sensitive substrates by projecting a pattern formed on a mask illuminated with an exposure beam, the apparatus comprising: a projection system, disposed in a path of the exposure beam, which projects the pattern onto a sensitive substrate; a stage system, disposed on an image plane side of the projection system, which has a first substrate stage and a second substrate stage, each of which is movable independently in a plane while holding a sensitive substrate; and a control system, functionally associated with the stage system, which controls the stage system to perform, by controlling the first substrate stage, at least one of an exchange operation for the sensitive substrate and a detecting operation for a mark on the first substrate stage or on the sensitive substrate held on the first substrate stage, while executing a scanning exposure operation for the sensitive substrate held on the second substrate stage, wherein each of shot areas on the sensitive substrate held on the second substrate stage is exposed while moving the second substrate stage, and wherein the control system controls the two substrate stages such that the two substrate stages do not physically interfere with each other.

Claim 25

The projection exposure apparatus according to claim 20 , further comprising: a detecting system, functionally connected with the control system, which detects the mark on the first substrate stage or on the sensitive substrate held on the first substrate stage, wherein the detecting system sequentially detects a plurality of marks on the sensitive substrate held on the first substrate stage.

Claim 26

The projection exposure apparatus according to claim 21 , wherein the control system performs statistical calculation based on information detected by the detecting system to obtain positional information of shot areas on the sensitive substrate held on the first substrate stage.

Claim 27

The projection exposure apparatus according to claim 21 , wherein the detecting system includes a first detector to detect the marks on the sensitive substrate held on the first substrate stage and a second detector to detect a plurality of marks on the sensitive substrate held on the second substrate stage.

Claim 28

The projection exposure apparatus according to claim 20 , further comprising: an interferometer system, functionally associated with the stage system and the control system, which has a plurality of measurement axes and measures positions of the two substrate stages; and a linear motor system, magnetically connected to the two substrate stages, which moves the two substrate stages based on the positions measured by the interferometer system.

Claim 29

The projection exposure apparatus according to claim 20 , further comprising: an exchange system, functionally associated with the stage system and the control system, which includes a first exchanger which performs substrate transfer between itself and the first substrate stage and a second exchanger which performs substrate transfer between itself and the second substrate stage.

Claim 30

The projection exposure apparatus according to claim 20 , wherein the control system stores information to prevent the two substrate stages from interfering with each other.

Claim 31

The projection exposure apparatus according to claim 20 , wherein a moving region of the first substrate stage which executes the at least one of the exchange operation and the detecting operation overlaps a moving region of the second substrate stage which executes the scanning exposure operation.

Claim 32

The projection exposure apparatus according to claim 20 , wherein the second substrate stage is prevented from vibration when the first substrate stage is moved.

Claim 33

A projection exposure apparatus for sequentially exposing sensitive substrates by projecting a pattern formed on a mask illuminated with an exposure beam, the apparatus comprising: a projection system, disposed in a path of the exposure beam, which projects the pattern onto a sensitive substrate; a stage system, disposed on an image plane side of the projection system, which has a first substrate stage and a second substrate stage, each of which is movable independently in a plane while holding a sensitive substrate; and a control system, functionally associated with the stage system, which controls the stage system to perform, by controlling the first substrate stage, at least one of an exchange operation for the sensitive substrate and a detecting operation for a mark on the first substrate stage or on the sensitive substrate held on the first substrate stage, while executing an exposure operation for the sensitive substrate held on the second substrate stage, wherein a moving region of the first substrate stage during the at least one of the exchange operation and the detecting operation overlaps a moving region of the second substrate stage of the two substrate stages during the exposure operation, and wherein the control system controls the two substrate stages such that the two substrate stages do not physically interfere with each other.

Claim 34

A projection exposure apparatus for sequentially exposing sensitive substrates by projecting a pattern formed on a mask illuminated with an exposure beam, the apparatus comprising: a projection system, disposed in a path of the exposure beam, which projects the pattern onto a sensitive substrate; a stage system, disposed on an image plane side of the projection system, which has a first substrate stage and a second substrate stage, each of which is movable independently in a plane while holding a sensitive substrate; and a control system, functionally associated with the stage system, which controls the stage system to perform, by controlling the first substrate stage, at least one of an exchange operation for the sensitive substrate and a detecting operation for a mark on the first substrate stage or on the sensitive substrate held on the first substrate stage, while executing an exposure operation for the sensitive substrate held on the second substrate stage, wherein a moving region of the first substrate stage during the at least one of the exchange operation and the detecting operation overlaps a moving region of the second substrate stage of the two substrate stages during the exposure operation, and wherein the control system controls the two substrate stages such that the two substrate stages do not physically interfere with each other.

Claim 35

The projection exposure apparatus according to claim 29 , further comprising: a detecting system, functionally connected with the control system, which detects the mark on the first substrate stage or on the sensitive substrate held on the first substrate stage, wherein the detecting system sequentially detects a plurality of marks on the sensitive substrate held on the first substrate stage.

Claim 36

The projection exposure apparatus according to claim 30 , wherein the control system performs statistical calculation based on information detected by the detecting system to obtain positional information of shot areas on the sensitive substrate held on the first substrate stage.

Claim 37

The projection exposure apparatus according to claim 30 , wherein the detecting system includes a first detector to detect the marks on the sensitive substrate held on the first substrate stage and a second detector to detect a plurality of marks on the sensitive substrate held on the second substrate stage.

Claim 38

The projection exposure apparatus according to claim 29 , further comprising: an interferometer system, functionally associated with the stage system and the control system, which has a plurality of measurement axes and measures positions of the two substrate stages; and a linear motor system, magnetically connected to the two substrate stages, which moves the two substrate stages based on the positions measured by the interferometer system.

Claim 39

The projection exposure apparatus according to claim 29 , further comprising: an exchange system, functionally connected with the control system, which includes a first exchanger which performs substrate transfer between itself and the first substrate stage and a second exchanger which performs substrate transfer between itself and the second substrate stage.

Claim 40

The projection exposure apparatus according to claim 29 , wherein the control system stores information to prevent the two substrate stages from interfering with each other.

Claim 41

The projection exposure apparatus according to claim 29 , wherein the second substrate stage is prevented from vibration when the first substrate stage is moved.