US6341007B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Exposure apparatus and method
Assignee: Nikon Corp
•
Filing: 2000-11-20
•
Granted: 2002-01-22
•
Expires: 2020-11-20
Abstract
Abstract Two stages (WS1), (WS2) holding wafers can independently move between a positional information measuring section (PIS) under an alignment system (24a) and an exposing section (EPS) under a projection optical system (PL). The wafer exchange and alignment are performed on the stage (WS1), during which wafer (W2) is exposed on the stage (WS2). A position of each shot area of wafer (WS1) is obtained as a relative position with respect to a reference mark formed on the stage (WS1) in the section (PIS). Relative positional information can be used for the alignment with respect to an exposure pattern when the wafer (WS1) is moved to the section EPS to be exposed. Therefore, it is not necessary that a stage position is observed continuously in moving the stage. Exposure operations are performed in parallel by the two wafer stages (WS1) and (WS2) so as to improve the throughput.
Inventors
- 👤 Kenji Nishi
- 👤 Kazuya Ota
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 23:08
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/70; G03F7/70216; H; H10; H10P; H10P76/00; G03F7/70358; G03F7/70425; G03F7/70691; G03F7/70716; G03F7/70733; G03F9/00; G03F9/70; G03F9/7003; G03F9/7007; G03F9/7015; G03F9/7023; G03F9/7026; G03F9/7088
Claims Analysis
Total Claims: 27
Claim 1
Independent Claim
237 words
A projection exposure method for exposing sensitive substrates by projecting a pattern formed on a mask through a projection optical system onto the sensitive substrates, comprising: preparing a mask stage which is movable while holding the mask; preparing a first substrate stage and a second substrate stage, each of which is movable independently on a two-dimensional plane while holding a sensitive substrate; measuring positional information of the mask stage by using a mask interferometer system; measuring positional information of the first substrate stage by using a first interferometer system; executing a first exposure operation in which the mask stage and the first substrate stage are synchronously moved in respective scanning directions, based on the positional information measured by the mask interferometer system and the first interferometer system; performing at least one of a substrate exchange operation and a detecting operation by using the second substrate stage during said first exposure operation; measuring positional information of the second substrate stage by using a second interferometer system during at least one of said substrate exchange operation and said detecting operation; starting to measure positional information of the second substrate stage by using the first interferometer system; and executing, after the start, a second exposure operation in which the mask stage and the second substrate stage are synchronously moved in the respective scanning directions, based on the positional information measured by the mask interferometer system and the first interferometer system.
Claim 2
Dependent Claim
237 words
A projection exposure method for exposing sensitive substrates by projecting a pattern formed on a mask through a projection optical system onto the sensitive substrates, comprising: preparing a mask stage which is movable while holding the mask; preparing a first substrate stage and a second substrate stage, each of which is movable independently on a two-dimensional plane while holding a sensitive substrate; measuring positional information of the mask stage by using a mask interferometer system; measuring positional information of the first substrate stage by using a first interferometer system; executing a first exposure operation in which the mask stage and the first substrate stage are synchronously moved in respective scanning directions, based on the positional information measured by the mask interferometer system and the first interferometer system; performing at least one of a substrate exchange operation and a detecting operation by using the second substrate stage during said first exposure operation; measuring positional information of the second substrate stage by using a second interferometer system during at least one of said substrate exchange operation and said detecting operation; starting to measure positional information of the second substrate stage by using the first interferometer system; and executing, after the start, a second exposure operation in which the mask stage and the second substrate stage are synchronously moved in the respective scanning directions, based on the positional information measured by the mask interferometer system and the first interferometer system.
Claim 3
Dependent Claim
34 words
A projection exposure method according to claim 1 , wherein the mask interferometer system has measuring axes parallel to the scanning direction of the mask stage and measuring axes perpendicular to the scanning direction.
Claim 4
Dependent Claim
46 words
A projection exposure method according to claim 2 , wherein said mask stage has corner cube mirrors corresponding to said measuring axes parallel to the scanning direction, and said mask interferometer system measures the positional information of said mask stage by using the corner cube mirrors.
Claim 5
Dependent Claim
30 words
A projection exposure method according to claim 2 , wherein said mask interferometer system measures rotation of the mask stage by using the measuring axes perpendicular to the scanning direction.
Claim 6
Dependent Claim
40 words
A projection exposure method according to claim 4 , wherein said mask stage has a reflection surface extending along the scanning direction, and said mask interferometer system measures the positional information of the mask stage by using the reflection surface.
Claim 7
Dependent Claim
18 words
A projection exposure method according to claim 2 , wherein the first interferometer system has five measuring axes.
Claim 8
Dependent Claim
48 words
A projection exposure method according to claim 6 , wherein the first interferometer system has measuring axes parallel to the scanning direction, and measures tilts of the first substrate stage during the first exposure operation and measures tilts of the second substrate stage during the second exposure operation.
Claim 9
Dependent Claim
52 words
A projection exposure method according to claim 6 , wherein the first interferometer system has measuring axes perpendicular to the scanning direction, and measures rotation and tilts of the first substrate stage during the first exposure operation and measures rotation and tilts of the second substrate stage during the second exposure operation.
Claim 10
Dependent Claim
28 words
A projection exposure method according to claim 1 , wherein alignment information of the sensitive substrate held on the second substrate stage is detected during said detecting operation.
Claim 11
Dependent Claim
47 words
A projection exposure method according to claim 1 , wherein a moving region of the first substrate stage which performs the first exposure operation overlaps a moving region of the second substrate stage which executes at least one of the substrate exchange operation and the detecting operation.
Claim 12
Dependent Claim
43 words
A projection exposure method according to claim 1 , wherein the first substrate stage which performs the first exposure operation is prevented from vibration when the second substrate is moved during at least one of the substrate exchange operation and the detecting operation.
Claim 13
Dependent Claim
36 words
A projection exposure method according to claim 1 , wherein said second interferometer system measures rotation and tilts of the second substrate stage during at least one of the substrate exchange operation and the detecting operation.
Claim 14
Dependent Claim
16 words
A device manufacturing method including an exposure process utilizing the method defined in claim 1 .
Claim 15
Dependent Claim
300 words
A projection exposure apparatus for exposing sensitive substrates by projecting a pattern image of a mask onto the sensitive substrates, comprising: a projection system, disposed in a path of an exposure beam, which projects the pattern image onto the substrate, the mask being provided on one side of the projection system and a sensitive substrate being provided on the other side of the projection system; a mask stage, disposed on the one side of the projection system, which is movable while holding the mask; a mask interferometer system, associated with the mask stage, which monitors the mask stage; a substrate stage system, disposed on the other side of the projection system, which has a first substrate stage and a second substrate stage, each of which is movable independently on a two-dimensional plane while holding a sensitive substrate; a first interferometer system which monitors the first substrate stage during a first exposure operation in which the mask stage and the first substrate stage are moved synchronously in respective scanning directions based on information obtained by the mask interferometer system and the first interferometer system to expose each of areas on the substrate held on the first substrate stage; a second interferometer system which monitors the second substrate stage to perform at least one of a substrate exchange operation and a detecting operation of the second substrate stage during the first exposure operation; and wherein, after the first exposure operation, the first interferometer system monitors the second substrate stage to execute a second exposure operation in which the mask stage and the second substrate stage are moved synchronously in the respective scanning directions based on the information measured by the mask interferometer system and the first interferometer system to expose each of areas on the substrate held on the second substrate stage.
Claim 16
Dependent Claim
300 words
A projection exposure apparatus for exposing sensitive substrates by projecting a pattern image of a mask onto the sensitive substrates, comprising: a projection system, disposed in a path of an exposure beam, which projects the pattern image onto the substrate, the mask being provided on one side of the projection system and a sensitive substrate being provided on the other side of the projection system; a mask stage, disposed on the one side of the projection system, which is movable while holding the mask; a mask interferometer system, associated with the mask stage, which monitors the mask stage; a substrate stage system, disposed on the other side of the projection system, which has a first substrate stage and a second substrate stage, each of which is movable independently on a two-dimensional plane while holding a sensitive substrate; a first interferometer system which monitors the first substrate stage during a first exposure operation in which the mask stage and the first substrate stage are moved synchronously in respective scanning directions based on information obtained by the mask interferometer system and the first interferometer system to expose each of areas on the substrate held on the first substrate stage; a second interferometer system which monitors the second substrate stage to perform at least one of a substrate exchange operation and a detecting operation of the second substrate stage during the first exposure operation; and wherein, after the first exposure operation, the first interferometer system monitors the second substrate stage to execute a second exposure operation in which the mask stage and the second substrate stage are moved synchronously in the respective scanning directions based on the information measured by the mask interferometer system and the first interferometer system to expose each of areas on the substrate held on the second substrate stage.
Claim 17
Dependent Claim
34 words
A projection exposure apparatus according to claim 14 , wherein the mask interferometer system has measuring axes parallel to the scanning direction of the mask stage and measuring axes perpendicular to the scanning direction.
Claim 18
Dependent Claim
45 words
A projection exposure apparatus according to claim 15 , wherein said mask stage has corner cube mirrors corresponding to said measuring axes parallel to the scanning direction, and said mask interferometer system measures positional information of said mask stage by using the corner cube mirrors.
Claim 19
Dependent Claim
30 words
A projection exposure apparatus according to claim 15 , wherein said mask interferometer system measures rotation of the mask stage by using the measuring axes perpendicular to the scanning direction.
Claim 20
Dependent Claim
39 words
A projection exposure apparatus according to claim 17 , wherein said mask stage has a reflection surface extending along the scanning direction, and said mask interferometer system measures positional information of the mask stage by using the reflection surface.
Claim 21
Dependent Claim
18 words
A projection exposure apparatus according to claim 15 , wherein the first interferometer system has five measuring axes.
Claim 22
Dependent Claim
48 words
A projection exposure apparatus according to claim 19 , wherein the first interferometer system has measuring axes parallel to the scanning direction, and measures tilts of the first substrate stage during the first exposure operation and measures tilts of the second substrate stage during the second exposure operation.
Claim 23
Dependent Claim
52 words
A projection exposure apparatus according to claim 19 , wherein the first interferometer system has measuring axes perpendicular to the scanning direction, and measures rotation and tilts of the first substrate stage during the first exposure operation and measures rotation and tilts of the second substrate stage during the second exposure operation.
Claim 24
Dependent Claim
47 words
A projection exposure apparatus according to claim 14 , wherein a moving region of the first substrate stage which performs the first exposure operation overlaps a moving region of the second substrate stage which executes at least one of the substrate exchange operation and the detecting operation.
Claim 25
Dependent Claim
43 words
A projection exposure apparatus according to claim 14 , wherein the first substrate stage which performs the first exposure operation is prevented from vibration when the second substrate is moved during at least one of the substrate exchange operation and the detecting operation.
Claim 26
Dependent Claim
32 words
A projection exposure apparatus according to claim 14 , wherein the first and second interferometer systems have respective measuring axes, each of which intersects with an optical axis of the projection system.
Claim 27
Dependent Claim
57 words
A projection exposure apparatus according to claim 14 , further comprising: a detecting system, disposed apart from the projection system, which detects alignment information of the substrate held on the second substrate stage; and wherein the first and second interferometer systems have respective measuring axes, each of which intersects with a detecting axis of the detecting system.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-01-21 | 2005-07-23 | 2006-01-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-01-21 | 2009-07-23 | 2010-01-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-01-21 | 2013-07-23 | 2014-01-22 | $7700.00 | Window Closed / Lapsed |