US6316285B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Passivation layer for packaged integrated circuits
Assignee: Micron Technology Inc
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Filing: 1999-09-08
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Granted: 2001-11-13
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Expires: 2019-09-08
Abstract
Abstract Passivating layers methods for forming the same are provided for packaged integrated circuit devices. In particular, an integrated circuit die is mounted in a plastic leaded chip carrier, and a photosensitive material is then deposited over the surfaces to be passivated. Portions of the photosensitive material are then exposed to UV light, resulting in a crosslinked siloxane network. In this way, a low-temperature photodefinable passivation layer is provided for the package, with characteristics similar to conventional oxides. Advantageously, the photosensitive material can be patterned during the UV exposure, and unexposed portions selectively removed to leave the passivation layer only over desired portions of the package.
Inventors
- 👤 Tongbi Jiang
- 👤 Zhiping Yin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:03
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/701; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W72/00; H10W72/071; H10W72/075; H10W72/851; H10W72/853; H10W72/865; H10W72/90; H10W72/951; H10W74/00; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
81 words
A process for forming a passivated integrated circuit device, comprising: mounting a die onto a surface of a die carrier; reacting an organosilane precursor to form a layer of photosensitive material onto surfaces of the die and the die carrier; exposing a first portion of the photosensitive material to UV light while sheltering a second portion of the photosensitive material from the UV light; and exposing the photosensitive material to halogen-based plasma to remove the second portion of the photosensitive material.
Claim 2
Dependent Claim
81 words
A process for forming a passivated integrated circuit device, comprising: mounting a die onto a surface of a die carrier; reacting an organosilane precursor to form a layer of photosensitive material onto surfaces of the die and the die carrier; exposing a first portion of the photosensitive material to UV light while sheltering a second portion of the photosensitive material from the UV light; and exposing the photosensitive material to halogen-based plasma to remove the second portion of the photosensitive material.
Claim 3
Dependent Claim
28 words
The process of claim 1 , wherein the second portion of the photosensitive material covers a conductive contact of the die carrier prior to removing the second portion.
Claim 4
Independent Claim
71 words
A method of packaging an integrated circuit die to form a surface mount device, comprising: mounting the die onto a surface of a plastic die carrier; and depositing a photodefinable layer on the die and the die carrier after mounting the die; and converting the photodefinable layer to a passivation layer, said converting comprising exposing at least a first portion of the photodefinable layer to UV light in an oxygenated environment.
Claim 5
Independent Claim
71 words
A method of packaging an integrated circuit die to form a surface mount device, comprising: mounting the die onto a surface of a plastic die carrier; and depositing a photodefinable layer on the die and the die carrier after mounting the die; and converting the photodefinable layer to a passivation layer, said converting comprising exposing at least a first portion of the photodefinable layer to UV light in an oxygenated environment.
Claim 6
Dependent Claim
30 words
The method of claim 3 further comprising dry development of an unexposed second portion of the photodefinable layer using a chlorine-based plasma, after exposing the first portion to UV light.
Claim 7
Dependent Claim
14 words
The process of claim 1 , further comprising exposing the photosensitive material to oxygen.
Claim 8
Dependent Claim
12 words
The process of claim 1 , wherein the organosilane precursor comprises methylsilane.
Claim 9
Dependent Claim
31 words
The process of claim 6 , wherein reacting the organosilane comprises flowing between about 40 sccm and 150 sccm of methylsilane and between about 1,000 sccm and 3,000 sccm of helium.
Claim 10
Dependent Claim
14 words
The process of claim 1 , wherein the die carrier comprises a plastic substrate.
Claim 11
Dependent Claim
18 words
The process of claim 8 , wherein reacting the organosilane comprises maintaining a temperature below about 150° C.
Claim 12
Dependent Claim
14 words
The process of claim 8 , wherein the plastic substrate comprises a BT resin.
Claim 13
Dependent Claim
16 words
The process of claim 1 , wherein the die carrier comprises a plastic ball grid array.
Claim 14
Dependent Claim
21 words
The method of claim 3 , wherein depositing and converting are each conducted at temperatures of less than about 300° C.
Claim 15
Dependent Claim
22 words
The method of claim 12 , wherein depositing the photodefinable layer comprises reacting methylsilane at between about 90° C. and 140° C.
Claim 16
Dependent Claim
16 words
The method of claim 3 , wherein the die carrier comprises a plastic ball grid array.
Claim 17
Dependent Claim
17 words
The method of claim 3 , wherein the die carrier comprises a stackable integrated circuit die package.
Claim 18
Dependent Claim
14 words
The method of claim 3 , wherein the photodefinable layer comprises plasma polymerized methylsilane.
Claim 19
Dependent Claim
14 words
The method of claim 3 , wherein the die carrier comprises a printed circuit.
Claim 20
Dependent Claim
17 words
The method of claim 3 , wherein the die carrier comprises a substrate formed of BT resin.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-11-12 | 2005-05-14 | 2005-11-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-11-12 | 2009-05-14 | 2009-11-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-11-12 | 2013-05-14 | 2013-11-13 | $7700.00 | Window Closed / Lapsed |