Shared package for VRM and processor unit

Claim 2

A component module, comprising: a packaging material within said module; a processor mounted on said packaging material; and at least a portion of a voltage regulator module mounted on said packaging material which regulates voltages being supplied to said processor, said component module providing common packaging for said processor and said portion of said voltage regulator module and utilizing high density packaging technique.

Claim 3

A component module according to claim 1 , wherein said component module is a semiconductor integrated circuit.

Claim 4

A component module according to claim 1 , wherein said component module is a processor component package.

Claim 5

A component module according to claim 3 , wherein said processor component package supplies processor capabilities to a motherboard.

Claim 6

A component module according to claim 1 , wherein said voltage regulator module is a high frequency alternating current voltage regulator module.

Claim 7

A component module according to claim 5 , wherein power is transmitted to said high frequency alternating current voltage regulator module in a high frequency alternating current domain from a power supply of an electronic system.

Claim 8

A component module according to claim 5 , wherein said high frequency alternating current voltage regulator module includes a high density transformer.

Claim 9

A component module according to claim 5 , wherein said high frequency alternating current voltage regulator module includes at least one high density capacitor.

Claim 10

A component module according to claim 5 , wherein said high frequency alternating current voltage regulator module includes at least one synchronous rectifier implemented by a silicon integrated circuit.

Claim 11

A component module according to claim 1 , wherein said processor and said voltage regulator module perform direct communication within said component package.

Claim 12

A component module according to claim 1 , wherein said processor is utilized to control functions of said voltage regulator module.

Claim 13

A semiconductor integrated circuit package, comprising: a packaging material within said package; a processor mounted on said packaging material; and a voltage regulator module mounted on said packaging material which regulates voltages being supplied to said processor; wherein said semiconductor integrated circuit package supplies processor capabilities; said package providing a common package for said processor and said voltage regulator module and utilizing high density packaging technique.

Claim 14

A semiconductor integrated circuit package, comprising: a packaging material within said package; a processor mounted on said packaging material; and a voltage regulator module mounted on said packaging material which regulates voltages being supplied to said processor; wherein said semiconductor integrated circuit package supplies processor capabilities; said package providing a common package for said processor and said voltage regulator module and utilizing high density packaging technique.

Claim 15

A semiconductor integrated circuit package, comprising: a packaging material within said package; a processor mounted on said packaging material; and a high frequency alternating current voltage regulator module mounted on said packaging material which regulates voltages being supplied to said processor; wherein said semiconductor integrated circuit package supplies processor capabilities to a motherboard; said package providing a common package for said processor and said high frequency alternating current voltage regulator module and utilizing high density packaging technique.

Claim 16

A semiconductor integrated circuit package, comprising: a packaging material within said package; a processor mounted on said packaging material; and a high frequency alternating current voltage regulator module mounted on said packaging material which regulates voltages being supplied to said processor; wherein said semiconductor integrated circuit package supplies processor capabilities to a motherboard; said package providing a common package for said processor and said high frequency alternating current voltage regulator module and utilizing high density packaging technique.

Claim 17

A semiconductor integrated circuit package according to claim 13 , wherein power is transmitted to said high frequency alternating current voltage regulator module in a high frequency alternating current domain from a power supply of an electronic system.

Claim 18

A component module comprising: a processor; and at least a portion of the voltage regulator module which regulates voltages being supplied to said processor; wherein dynamic communication between said processor and said voltage regulator module when said voltage regulator module dynamically adjusts the output voltage thereof based upon a request by said processor.

Claim 19

A component module comprising: a processor; and at least a portion of the voltage regulator module which regulates voltages being supplied to said processor; wherein dynamic communication between said processor and said voltage regulator module when said voltage regulator module dynamically adjusts the output voltage thereof based upon a request by said processor.

Claim 20

A semiconductor integrated circuit package, comprising: a processor; and a voltage regulator module which regulates voltages being supplied to said processor; wherein said semiconductor integrated circuit package supplies processor capabilities; wherein dynamic communication between said processor and said voltage regulator module when said voltage regulator module dynamically adjusts the output voltage thereof based upon a request by said processor.

Claim 21

A semiconductor integrated circuit package, comprising: a processor; and a voltage regulator module which regulates voltages being supplied to said processor; wherein said semiconductor integrated circuit package supplies processor capabilities; wherein dynamic communication between said processor and said voltage regulator module when said voltage regulator module dynamically adjusts the output voltage thereof based upon a request by said processor.

Claim 22

A semiconductor integrated circuit package, comprising: a processor; and a high frequency alternating current voltage regulator module which regulates voltages being supplied to said processor; wherein said semiconductor integrated circuit package supplies processor capabilities to a motherboard; wherein dynamic communication between said processor and said voltage regulator module when said voltage regulator module dynamically adjusts the output voltage thereof based upon a request by said processor.

Claim 23

A semiconductor integrated circuit package, comprising: a processor; and a high frequency alternating current voltage regulator module which regulates voltages being supplied to said processor; wherein said semiconductor integrated circuit package supplies processor capabilities to a motherboard; wherein dynamic communication between said processor and said voltage regulator module when said voltage regulator module dynamically adjusts the output voltage thereof based upon a request by said processor.