Packaging for silicon sensors

Claim 2

A packaged integrated circuit, comprising: a substrate; an integrated circuit die positioned on said substrate, said integrated circuit die having a top surface and sides; and an adhesive surface coating applied to said substrate and said sides of said integrated circuit die for sealing said integrated circuit die to said substrate such that a substantial portion of said top surface of said die is exposed.

Claim 3

The integrated circuit of claim 1 wherein said adhesive surface coating comprises a first bead of adhesive surface coating and a second bead of adhesive surface coating, said first and second beads extending at least partially around the circumference of said integrated circuit die.

Claim 4

The integrated circuit of claim 2 wherein said first bead of adhesive surface coating extends entirely around the circumference of said integrated circuit die.

Claim 5

The integrated circuit of claim 3 wherein said first bead is applied to said substrate and said integrated circuit die and said second bead is applied to said first bead and said integrated circuit die to extend at least partially around said integrated circuit die.

Claim 6

The integrated circuit of claim 3 wherein said first bead is applied to said substrate a predetermined distance from said integrated circuit die to form a space therebetween, and further wherein said second bead is applied in said space.

Claim 7

The integrated circuit of claim 5 wherein said second bead contacts said first bead and said integrated circuit die.

Claim 8

The integrated circuit of claim 1 wherein said coating partially overlaps said top surface of said integrated circuit die.

Claim 9

The integrated circuit of claim 6 wherein said first bead is formed of a first type of adhesive surface coating material and said second bead is formed of a second type of adhesive surface coating material.

Claim 10

The integrated circuit of claim 8 wherein said first type of adhesive surface material has a lower flow rate when heated than the heated flow rate of said second type of adhesive surface coating material.

Claim 11

The integrated circuit of claim 9 wherein said second bead extends entirely around the circumference of said integrated circuit die.

Claim 12

A packaged integrated circuit, comprising: a printed circuit board having one or more electrically conductive traces formed thereon; an integrated circuit die affixed to said printed circuit board, said integrated circuit die having a top surface and sides, and a plurality of wires having a first end electrically connected to said integrated circuit die and a second end electrically connected to said traces on said printed circuit board; and an adhesive surface coating applied to said printed circuit board and said sides of said integrated circuit die to extend at least partially around the circumference of said integrated circuit die for sealing said integrated circuit die to said printed circuit board such that a substantial portion of the surface area of said top surface of said integrated circuit die is exposed.

Claim 13

A packaged integrated circuit, comprising: a printed circuit board having one or more electrically conductive traces formed thereon; an integrated circuit die affixed to said printed circuit board, said integrated circuit die having a top surface and sides, and a plurality of wires having a first end electrically connected to said integrated circuit die and a second end electrically connected to said traces on said printed circuit board; and an adhesive surface coating applied to said printed circuit board and said sides of said integrated circuit die to extend at least partially around the circumference of said integrated circuit die for sealing said integrated circuit die to said printed circuit board such that a substantial portion of the surface area of said top surface of said integrated circuit die is exposed.

Claim 14

The integrated circuit of claim 11 wherein said wires are electrically connected along only one side of said integrated circuit die.

Claim 15

The integrated circuit of claim 11 wherein said adhesive surface coating comprises a first bead of adhesive surface coating and a second bead of adhesive surface coating.

Claim 16

The integrated circuit of claim 13 wherein said first bead of adhesive surface coating extends entirely around the circumference of said integrated circuit die.

Claim 17

The integrated circuit of claim 14 wherein said first bead is applied to said printed circuit board and at least said sides of said integrated circuit die to cover at least said second end of said wires connected to said printed circuit board, and said second bead is applied to said first bead and said integrated circuit die to extend at least partially around said integrated circuit die and partially overlap said top surface to cover at least said first end of said wires connected to said integrated circuit die.

Claim 18

The integrated circuit of claim 13 wherein said first bead is applied to said printed circuit board a predetermined distance from said integrated circuit die to form a space between said first bead and said integrated circuit die, and further wherein said second bead is applied in said space.

Claim 19

The integrated circuit of claim 16 wherein said second bead contacts said first bead and at least said sides of said integrated circuit die.

Claim 20

The integrated circuit of claim 11 wherein said second bead partially overlaps said top surface of said integrated circuit die.

Claim 21

The integrated circuit of claim 17 wherein said first bead is formed of a first type of adhesive surface coating material and said second bead is formed of a second type of adhesive surface coating material.

Claim 22

The integrated circuit of claim 19 wherein said first type of adhesive surface material has a lower flow rate when heated than the heated flow rate of said second type of adhesive surface coating material.

Claim 23

The integrated circuit of claim 20 wherein said second bead extends entirely around the circumference of said integrated circuit die.

Claim 26

The method of claim 22 wherein said step of applying an adhesive surface coating comprises applying a first bead of adhesive surface coating at least partially around the circumference of the integrated circuit die and applying a second bead of an adhesive surface coating at least partially around the circumference of the integrated circuit die.

Claim 27

The method of claim 23 wherein the first bead is applied to the substrate and the integrated circuit die, and the second bead is applied to the integrated circuit die and the first bead.

Claim 28

The method of claim 24 wherein the first bead is applied around the entire circumference of the integrated circuit die.

Claim 29

The method of claim 23 wherein the first bead is applied to the substrate and positioned a predetermined distance from the integrated circuit die to form a space between the first bead and the integrated circuit die, and the second bead is applied to fill in the space.

Claim 30

The method of claim 26 wherein the second bead fills the space between the first bead and the integrated circuit die and flows partially onto the top surface of the integrated surface die when heated.

Claim 31

The method of claim 27 wherein the second bead extends around the entire circumference of the integrated circuit die.

Claim 34

The method of claim 29 wherein the wires are attached to only a single side of the integrated circuit die.

Claim 35

The method of claim 29 wherein said step of applying an adhesive surface coating comprises applying a first bead of adhesive surface coating at least partially around the circumference of the integrated circuit die and applying a second bead of an adhesive surface coating at least partially around the circumference of the integrated circuit die.

Claim 36

The method of claim 31 wherein the first bead is applied to the printed circuit board and the integrated circuit die to cover at least the second ends of the wires, and the second bead is applied to the integrated circuit die to cover at least the first ends of the wires.

Claim 37

The method of claim 32 wherein the first bead is applied around the entire circumference of the integrated circuit die.

Claim 38

The method of claim 33 wherein the first bead is applied to the printed circuit board and positioned a predetermined distance from the integrated circuit die to form a space between the first bead and the integrated circuit die, and the second bead is applied in the space formed between the first bead and the integrated circuit die.

Claim 39

The method of claim 34 wherein the second bead fills the space between the first bead and the integrated circuit die and flows partially onto the top surface of the integrated surface die when heated.

Claim 40

The method of claim 35 wherein the second bead extends around the entire circumference of the integrated circuit die.

Claim 41

The method of claim 33, wherein the second bead is positioned a predetermined distance from the first bead to create a spare there between.

Claim 42

The method of claim 37 wherein a third bead is applied in the space between the second bead and the first bead.

Claim 43

The method of claim 38 wherein said third bead overlaps said first bead and extends around the entire circumference of the integrated circuit die.

Claim 44

A packaged integrated circuit, comprising: a substrate; an integrated circuit die positioned on said substrate, said integrated circuit die having a top surface and sides; and an adhesive surface coating applied to said substrate and said sides of said integrated circuit die for sealing said integrated circuit die to said substrate such that a substantial portion of said top surface of said die is exposed, said adhesive surface coating comprising a first bead of adhesive surface coating applied to said substrate a predetermined distance from said integrated circuit and at least partially around the circumference of said integrated circuit die to form a space therebetween, and a second bead of adhesive surface coating applied in said space to contact said first bead and said integrated circuit die and to extend at least partially around the circumference of said integrated circuit die.

Claim 45

A packaged integrated circuit, comprising: a substrate; an integrated circuit die positioned on said substrate, said integrated circuit die having a top surface and sides; and an adhesive surface coating applied to said substrate and said sides of said integrated circuit die for sealing said integrated circuit die to said substrate such that a substantial portion of said top surface of said die is exposed, said adhesive surface coating comprising a first bead of adhesive surface coating applied to said substrate a predetermined distance from said integrated circuit and at least partially around the circumference of said integrated circuit die to form a space therebetween, and a second bead of adhesive surface coating applied in said space to contact said first bead and said integrated circuit die and to extend at least partially around the circumference of said integrated circuit die.

Claim 46

The packaged integrated circuit of claim 40 wherein said second bead partially overlaps said top surface of said integrated circuit die.

Claim 47

A packaged integrated circuit, comprising: a substrate; an integrated circuit die positioned on said substrate, said integrated circuit die having a top surface and sides; and an adhesive surface coating applied to said substrate and said sides of said integrated circuit die for sealing said integrated circuit die to said substrate such that a substantial portion of said top surface of said die is exposed, said adhesive surface coating comprising a first bead of adhesive surface coating applied to said substrate and at least partially around the circumference of said integrated circuit die and a second bead of adhesive surface coating applied to contact said first bead and said integrated circuit die and to extend at least partially around the circumference of said integrated circuit die, said first bead formed of a first type of adhesive surface coating material and said second bead formed of a second type of adhesive surface coating material.

Claim 48

A packaged integrated circuit, comprising: a substrate; an integrated circuit die positioned on said substrate, said integrated circuit die having a top surface and sides; and an adhesive surface coating applied to said substrate and said sides of said integrated circuit die for sealing said integrated circuit die to said substrate such that a substantial portion of said top surface of said die is exposed, said adhesive surface coating comprising a first bead of adhesive surface coating applied to said substrate and at least partially around the circumference of said integrated circuit die and a second bead of adhesive surface coating applied to contact said first bead and said integrated circuit die and to extend at least partially around the circumference of said integrated circuit die, said first bead formed of a first type of adhesive surface coating material and said second bead formed of a second type of adhesive surface coating material.

Claim 49

The packaged integrated circuit of claim 42 wherein said first type of adhesive surface coating material has a lower flow rate when heated than the heated flow rate of said second type of adhesive surface coating material.

Claim 50

The packaged integrated circuit of claim 42 wherein said second bead extends entirely around the circumference of said integrated circuit die.

Claim 51

A packaged integrated circuit, comprising: a printed circuit board having one or more electrically conductive traces formed thereon; an integrated circuit die affixed to said printed circuit board, said integrated circuit die having a top surface and sides, and a plurality of wires having a first end electrically connected to said integrated circuit die and a second end electrically connected to said traces on said printed circuit board; and an adhesive surface coating applied to said printed circuit board and said integrated circuit die for sealing said integrated die to said printed circuit board such that a substantial portion of the surface area of said top surface of said integrated circuit die is exposed, said adhesive surface coating comprising a first bead of adhesive surface coating applied to said printed circuit board a predetermined distance from said integrated circuit die to form a space between said first bead and said integrated circuit die, and a second bead of adhesive surface coating applied in said space and in contact with said first bead and said sides of said integrated circuit die.

Claim 52

A packaged integrated circuit, comprising: a printed circuit board having one or more electrically conductive traces formed thereon; an integrated circuit die affixed to said printed circuit board, said integrated circuit die having a top surface and sides, and a plurality of wires having a first end electrically connected to said integrated circuit die and a second end electrically connected to said traces on said printed circuit board; and an adhesive surface coating applied to said printed circuit board and said integrated circuit die for sealing said integrated die to said printed circuit board such that a substantial portion of the surface area of said top surface of said integrated circuit die is exposed, said adhesive surface coating comprising a first bead of adhesive surface coating applied to said printed circuit board a predetermined distance from said integrated circuit die to form a space between said first bead and said integrated circuit die, and a second bead of adhesive surface coating applied in said space and in contact with said first bead and said sides of said integrated circuit die.

Claim 53

The packaged integrated circuit of claim 45 wherein said second bead partially overlaps said top surface of said integrated circuit die.

Claim 54

A packaged integrated circuit comprising: a printed circuit board having one or more electrically conductive traces formed thereon; an integrated circuit die affixed to said printed circuit board, said integrated circuit die having a top surface and sides, and a plurality of wires having a first end electrically connected to said integrated circuit die and a second end electrically connected to said traces on said printed circuit board; and an adhesive surface coating applied to said printed circuit board and said integrated circuit die for sealing said integrated circuit die to said printed circuit board such that a substantial portion of the surface area of said top surface of said integrated die is exposed, said adhesive surface coating comprising a first bead of adhesive surface coating formed of a first type of adhesive surface coating material and applied to said printed circuit board, and a second bead of adhesive surface coating formed of a second type of adhesive surface coating material and applied in contact with said first bead and said sides of said integrated circuit die.

Claim 55

A packaged integrated circuit comprising: a printed circuit board having one or more electrically conductive traces formed thereon; an integrated circuit die affixed to said printed circuit board, said integrated circuit die having a top surface and sides, and a plurality of wires having a first end electrically connected to said integrated circuit die and a second end electrically connected to said traces on said printed circuit board; and an adhesive surface coating applied to said printed circuit board and said integrated circuit die for sealing said integrated circuit die to said printed circuit board such that a substantial portion of the surface area of said top surface of said integrated die is exposed, said adhesive surface coating comprising a first bead of adhesive surface coating formed of a first type of adhesive surface coating material and applied to said printed circuit board, and a second bead of adhesive surface coating formed of a second type of adhesive surface coating material and applied in contact with said first bead and said sides of said integrated circuit die.

Claim 56

The packaged integrated circuit die of claim 47 wherein said first type of adhesive surface material has a lower flow rate when heated than the heated flow rate of said second type of adhesive surface coating material.

Claim 57

The packaged integrated circuit die of claim 47 wherein said second bead extends entirely around the circumference of said integrated circuit die.