Abstract A multi-chip type image sensor includes, a base, a plurality of sensor chips arranged on the base so as to be staggered so that adjacent sensor chips among the sensor chips partially overlap with each other in the direction perpendicular to a direction in which the sensor chips are arranged. The sensor chips are fastened to the base by an adhesive for use in die bonding. Each of the sensor chips has a plurality of light receiving elements arranged into a line at a predetermined pixel pitch Pd. Each of the sensor chip contains silicon. Therminal pins are supported on the base and electrically coupled to the sensor chips. The following formula is satisfied: Pc=Pdx[1+(Tc-Ta)( alpha B- alpha Si)] where Tc [ DEG C.] is a curing temperature of the adhesive, Ta [ DEG C.] is an environment temperature at which the image sensor is to be used, alpha Si is a thermal expansion coefficient of each of the sensor chips comprising silicon, alpha B is a thermal expansion coefficient of the base, and Pc is a pixel pitch at which the light receiving elements are arranged in each of the sensor chips before the adhesive is cured by die bonding.
A multi-chip type image sensor comprising: a base; a plurality of sensor chips arranged on said base so as to be staggered so that adjacent sensor chips among said sensor chips partially overlap with each other in the direction perpendicular to a direction in which said sensor chips are arranged, said sensor chips being fastened to said base by an adhesive for use in die bonding, each of said sensor chips having a plurality of light receiving elements arranged into a line at a predetermined pixel pitch Pd, each of said sensor chip comprising silicon; and terminal pins supported on said base and electrically coupled to said sensor chips, the following formula being satisfied: Pc=Pd×[1+(Tc-Ta)(α.sub.B -α.sub.Si)] where Tc [°C.] is a curing temperature of said adhesive, Ta [°C.] is an enviroment temperature at which said image sensor is to be used, α Si is a thermal expansion coefficient of each of said sensor chips comprising silicon, α B is a thermal expansion coefficient of said base, and Pc is a pixel pitch at which said light receiving elements are arranged in each of said sensor chips before said adhesive is cured by die bonding.
Claim 2
Dependent Claim
194 words
A multi-chip type image sensor comprising: a base; a plurality of sensor chips arranged on said base so as to be staggered so that adjacent sensor chips among said sensor chips partially overlap with each other in the direction perpendicular to a direction in which said sensor chips are arranged, said sensor chips being fastened to said base by an adhesive for use in die bonding, each of said sensor chips having a plurality of light receiving elements arranged into a line at a predetermined pixel pitch Pd, each of said sensor chip comprising silicon; and terminal pins supported on said base and electrically coupled to said sensor chips, the following formula being satisfied: Pc=Pd×[1+(Tc-Ta)(α.sub.B -α.sub.Si)] where Tc [°C.] is a curing temperature of said adhesive, Ta [°C.] is an enviroment temperature at which said image sensor is to be used, α Si is a thermal expansion coefficient of each of said sensor chips comprising silicon, α B is a thermal expansion coefficient of said base, and Pc is a pixel pitch at which said light receiving elements are arranged in each of said sensor chips before said adhesive is cured by die bonding.
Claim 3
Dependent Claim
15 words
A multi-chip type image sensor as claimed in claim 1, wherein said base comprises alumina.
Claim 4
Dependent Claim
16 words
A multi-chip type image sensor as claimed in claim 1, wherein said adhesive is electrically conductive.
Claim 5
Dependent Claim
28 words
A multi-chip type image sensor as claimed in claim 1, further comprising a cover glass which is mounted on said base so as to cover said sensor chips.