US6307264B1
Expired / Lapsed
US
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Semiconductor device, active matrix substrate and process for production thereof
Assignee: Canon Inc
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Filing: 1996-09-16
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Granted: 2001-10-23
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Expires: 2016-09-16
Abstract
Abstract A process for producing a semiconductor device comprises a step of polishing of a region of an electroconductive material serving as an electrode or a wiring line in an insulating layer formed on a semiconductor region, the region of the electroconductive material being electrically connected to the semiconductor region, wherein a region of another material is formed within the region of the electroconductive material to be polished. Also a semiconductor device having the region is provided. A process for producing an active matrix substrate comprises a step of polishing of picture element electrodes made of a metal provided on crossing portions of plural signal lines and plural scanning lines and a means for applying voltage to the picture elements, wherein a region of another material is formed within the region of the picture element electrode to be polished. An active matrix substrate has such picture element electrodes as mentioned above.
Inventors
- 👤 Yoshihiko Fukumoto
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:53
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/062; G; G02; G02F; G02F1/00; G02F1/01; G02F1/13; G02F1/133; G02F1/1333; G02F1/1335; G02F1/133553; H10P; H10P52/00; H10P52/40; H10P52/403; H10P70/00; H10P70/20; H10P70/27; H10P70/277; G02F1/136; G02F1/1362; G02F2201/00; G02F2201/48
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
113 words
A semiconductor device comprising: a first insulator, a metal film formed on the first insulator and a second insulator formed on the first insulator in the region of the metal film, wherein the surface of the metal film and the surface of the second insulator substantially form the same plane and the second insulator comprises a different material from that of the first insulator, and wherein said metal film provides dishing not more than 200 Å caused by CMP polishing, the shortest distance between a wall of said metal film and said second insulator is not more than 100 μm, and said second insulator is formed as an island in said metal film.
Claim 2
Dependent Claim
113 words
A semiconductor device comprising: a first insulator, a metal film formed on the first insulator and a second insulator formed on the first insulator in the region of the metal film, wherein the surface of the metal film and the surface of the second insulator substantially form the same plane and the second insulator comprises a different material from that of the first insulator, and wherein said metal film provides dishing not more than 200 Å caused by CMP polishing, the shortest distance between a wall of said metal film and said second insulator is not more than 100 μm, and said second insulator is formed as an island in said metal film.
Claim 3
Dependent Claim
21 words
The semiconductor device according to claim 1 , wherein the conductive film comprises aluminum and the second insulator comprises silicon oxide.
Claim 4
Dependent Claim
27 words
The semiconductor device according to claim 1 , wherein the conductive film comprises aluminum, the second insulator comprises silicon oxide and the first insulator comprises silicon nitride.
Claim 5
Dependent Claim
38 words
The semiconductor device according to claim 1 , wherein said second insulator defines an opening region retaining a portion of the second insulator within that opening region and said portion of said second insulator has a columnar shape.
Claim 6
Dependent Claim
111 words
A process for producing a semiconductor device according to claim 1 , comprising: a first step of forming said first insulator on a semiconductor, a second step of forming said second insulator on the first insulator, a third step of forming an opening region in the second insulator retaining a portion of the second insulator within that opening region, a fourth step of forming said metal film on the second insulator, the opening region and the portion of the second insulator within said opening region, and a fifth step of polishing the metal film and the second insulator, thereby forming the flat region of the conductive film on the semiconductor substrate.
Claim 7
Dependent Claim
20 words
The process according to claim 5 , wherein the conductive film comprises aluminum and the second insulator comprises silicon oxide.
Claim 8
Dependent Claim
26 words
The process according to claim 5 , wherein the conductive film comprises aluminum, the second insulator comprises silicon oxide and the first insulator comprises silicon nitride.
Claim 9
Dependent Claim
17 words
The process according to claim 5 , wherein the step of polishing comprises using chemical mechanical polishing.
Claim 10
Dependent Claim
12 words
The process according to claim 5 , wherein the semiconductor comprises polysilicon.
Claim 11
Dependent Claim
22 words
The process according to claim 5 , wherein said portion of the second insulator within said opening region has a columnar shape.
Claim 12
Dependent Claim
148 words
An active matrix substrate having a metal picture element electrode provided corresponding to intersecting points of plural signal lines and plural scanning lines, and means for applying voltage to the picture elements, comprising: a first insulator, a metal film which acts as picture elements formed on the first insulator and a second insulator formed on the first insulator in the region of the metal film, wherein the surface of the metal film and the surface of the second insulator substantially form the same plane and the second insulator comprises a different material from that of the first insulator, and wherein said metal film provides dishing not more than 200 Å caused by CMP polishing, the shortest distance between a wall of said metal film and said second insulator is not more than 100 μm and said second insulator is formed as an isolated moiety in said metal film.
Claim 13
Dependent Claim
148 words
An active matrix substrate having a metal picture element electrode provided corresponding to intersecting points of plural signal lines and plural scanning lines, and means for applying voltage to the picture elements, comprising: a first insulator, a metal film which acts as picture elements formed on the first insulator and a second insulator formed on the first insulator in the region of the metal film, wherein the surface of the metal film and the surface of the second insulator substantially form the same plane and the second insulator comprises a different material from that of the first insulator, and wherein said metal film provides dishing not more than 200 Å caused by CMP polishing, the shortest distance between a wall of said metal film and said second insulator is not more than 100 μm and said second insulator is formed as an isolated moiety in said metal film.
Claim 14
Dependent Claim
22 words
The active matrix substrate according to claim 11 , wherein the metal film comprises aluminum and the second insulator comprises silicon oxide.
Claim 15
Dependent Claim
28 words
The active matrix substrate according to claim 11 , wherein the metal film comprises aluminum, the second insulator comprises silicon oxide and the first insulator comprises silicon nitride.
Claim 16
Dependent Claim
39 words
The active matrix substrate according to claim 11 , wherein said second insulator defines an opening region retaining a portion of the second insulator within that opening region and said portion of said second insulator has a columnar shape.
Claim 17
Dependent Claim
112 words
A process for producing an active matrix substrate according to claim 11 , comprising: a first step of forming said first insulator on a semiconductor, a second step of forming said second insulator on the first insulator, a third step of forming an opening region in the second insulator retaining a portion of the second insulator within that opening region, a fourth step of forming said metal film on the first insulator, the opening region and the portion of the second insulator within said opening region, and a fifth step of polishing the conductive film and the second insulator, thereby forming the flat region of the conductive film on the semiconductor substrate.
Claim 18
Dependent Claim
20 words
The process according to claim 15 , wherein the metal film comprises aluminum and the second insulator comprises silicon oxide.
Claim 19
Dependent Claim
26 words
The process according to claim 15 , wherein the conductive film comprises aluminum, the second insulator comprises silicon oxide and the first insulator comprises silicon nitride.
Claim 20
Dependent Claim
16 words
The process according to claim 15 , wherein the step of polishing comprises chemical mechanical polishing.
Claim 21
Dependent Claim
12 words
The process according to claim 15 , wherein the semiconductor comprises polysilicon.
Claim 22
Dependent Claim
22 words
The process according to claim 15 , wherein said portion of the second insulator within said opening region has a columnar shape.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-10-22 | 2005-04-23 | 2005-10-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-10-22 | 2009-04-23 | 2009-10-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-10-22 | 2013-04-23 | 2013-10-23 | $7700.00 | Window Closed / Lapsed |