US5596230A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Interconnection with self-aligned via plug
Assignee: United Microelectronics Corp
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Filing: 1996-01-04
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Granted: 1997-01-21
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Expires: 2016-01-04
Abstract
Abstract A device and a method of formation on a substrate of a semiconductor interconnection via structure for semiconductor devices is provided. Initially, form a first metal layer on the substrate, a first dielectric layer upon the first metal layer, and a mask upon the dielectric layer with a metal etching pattern therein. Then, etch through the first dielectric layer and the first metal layer to the substrate forming trenches between metal lines formed from the first metal layer covered with the dielectric layer. Next, form a first etch stop layer upon the surface of the the first dielectric layer and planarize it, a second dielectric layer above the etch stop layer, and a second etch stop layer on the second dielectric layer. Then, pattern the second dielectric and the second etch stop layer and etch to form a via hole down to a surface of the first metal layer. Then, form a second metal layer and a metal plug in the via hole extending into contact with the first metal layer.
Inventors
- 👤 Gary Hong
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 19:11
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/01; H10W20/071; H10W20/031; H10W20/063; H10W20/0633; H10W20/069; H10W20/0693; H10W20/40; H10W20/41; H10W20/42
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
242 words
A semiconductor device having an interconnection structure comprising: a first layer of a first dielectric material above a semiconductor substrate; first metal lines on the first layer of the first dielectric material; a second layer of a second dielectric material on the first layer of the first dielectric material between the first metal lines and covering at least portions of the first metal lines, the second layer of the second dielectric material having a surface above the first metal lines, the second dielectric material being different from the first dielectric material; a first plurality of vias in the second layer of the second dielectric material extending from the surface of the second layer of the second dielectric material to surfaces of a first corresponding plurality of the first metal lines, the first plurality of vias filled with plugs formed from the first dielectric material; a second plurality of vias in the second layer of the second dielectric material extending from the surface of the second layer of the second dielectric material to surfaces of a second corresponding plurality of the first metal lines, the second plurality of vias filled with metal plugs; a third layer of the first dielectric material on the second layer of the second dielectric material and on the first plurality of vias; and second metal lines on the second layer of the second dielectric material and in contact with the metal plugs within the second plurality of vias.
Claim 2
Dependent Claim
242 words
A semiconductor device having an interconnection structure comprising: a first layer of a first dielectric material above a semiconductor substrate; first metal lines on the first layer of the first dielectric material; a second layer of a second dielectric material on the first layer of the first dielectric material between the first metal lines and covering at least portions of the first metal lines, the second layer of the second dielectric material having a surface above the first metal lines, the second dielectric material being different from the first dielectric material; a first plurality of vias in the second layer of the second dielectric material extending from the surface of the second layer of the second dielectric material to surfaces of a first corresponding plurality of the first metal lines, the first plurality of vias filled with plugs formed from the first dielectric material; a second plurality of vias in the second layer of the second dielectric material extending from the surface of the second layer of the second dielectric material to surfaces of a second corresponding plurality of the first metal lines, the second plurality of vias filled with metal plugs; a third layer of the first dielectric material on the second layer of the second dielectric material and on the first plurality of vias; and second metal lines on the second layer of the second dielectric material and in contact with the metal plugs within the second plurality of vias.
Claim 3
Dependent Claim
20 words
The semiconductor device of claim 1, wherein the first dielectric material has different etch properties than the second dielectric material.
Claim 4
Dependent Claim
23 words
The semiconductor device of claim 1, wherein the first dielectric material is silicon dioxide and the second dielectric material is silicon rich oxide.
Claim 5
Dependent Claim
20 words
The semiconductor device of claim 1, wherein the surface of the second layer of the second dielectric material is planarized.
Claim 6
Dependent Claim
37 words
The semiconductor device of claim 4, wherein surfaces of the plugs formed from the first dielectric material and surfaces of the metal plugs are planar with the surface of the second layer of the second dielectric material.
Claim 7
Dependent Claim
214 words
A semiconductor device having an interconnection structure comprising: a first layer of dielectric material above a semiconductor substrate; first metal lines on the first layer of dielectric material; a second layer of silicon rich oxide on the first layer of dielectric material between the first metal lines and covering at least portions of the first metal lines, the second layer of silicon rich oxide having a surface above the first metal lines; a first plurality of vias in the second layer of silicon rich oxide extending from the surface of the second layer of silicon rich oxide to surfaces of a first corresponding plurality of the first metal lines, the first plurality of vias filled with plugs formed from a dielectric material; a second plurality of vias in the second layer of silicon rich oxide extending from the surface of the second layer of silicon rich oxide to surfaces of a second corresponding plurality of the first metal lines, the second plurality of vias filled with metal plugs; a third layer of dielectric material on the second layer of silicon rich oxide and on the first plurality of vias; and second metal lines on the second layer of silicon rich oxide and in contact with the metal plugs within the second plurality of vias.
Claim 8
Dependent Claim
214 words
A semiconductor device having an interconnection structure comprising: a first layer of dielectric material above a semiconductor substrate; first metal lines on the first layer of dielectric material; a second layer of silicon rich oxide on the first layer of dielectric material between the first metal lines and covering at least portions of the first metal lines, the second layer of silicon rich oxide having a surface above the first metal lines; a first plurality of vias in the second layer of silicon rich oxide extending from the surface of the second layer of silicon rich oxide to surfaces of a first corresponding plurality of the first metal lines, the first plurality of vias filled with plugs formed from a dielectric material; a second plurality of vias in the second layer of silicon rich oxide extending from the surface of the second layer of silicon rich oxide to surfaces of a second corresponding plurality of the first metal lines, the second plurality of vias filled with metal plugs; a third layer of dielectric material on the second layer of silicon rich oxide and on the first plurality of vias; and second metal lines on the second layer of silicon rich oxide and in contact with the metal plugs within the second plurality of vias.
References Cited (Backward Citations)
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| 3.5 Years (Year 4) | 2000-01-21 | 2000-07-22 | 2001-01-21 | $2000.00 | Window Closed / Lapsed |
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