Patent US6307256B1 successfully refreshed from Google Patents.
US6307256B1
Expired / Lapsed
US
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Semiconductor package with a stacked chip on a leadframe
Assignee: Apack Technologies Inc
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Filing: 1998-10-26
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Granted: 2001-10-23
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Expires: 2018-10-26
Abstract
Abstract The present invention provides a leadframe package formed by flip chip on leadframe technique. The chips are face to face attached on both sides of the leadframe surface. Another embodiment according to the present invention is that the chips are back to back attached on a leadframe. A chip with smaller size is stacked on a further chip with larger size. The smaller chip is connected to the leadframe by wire bonding. The present invention includes a first chip attached on the leadframe by using flip chip technology. The first chip has a plurality of conductive bump for electrically transferring signal to external. The tape has a plurality of openings or slots through the tape. Each opening exposes the terminal of the inner leads. Thus, a further chip can be set on the opposite major surface of the leadframe by means of the openings or slots. The second chip can be optionally face to face formed on the other side of the leadframe or back to back stacked on the first chip. The second chip is connected to the leadframe by wire bounding under this structure.
Inventors
- 👤 Cheng-Lien Chiang
- 👤 Shyi-Ching Liau
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:18
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/464; H10W70/466; H10W70/468; H10W70/475; H10W90/00; H10W90/811; H10W72/00; H10W72/071; H10W72/0711; H10W72/072; H10W72/07231; H10W72/07236; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/853; H10W72/865; H10W72/874; H10W72/884; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
131 words
A semiconductor package, said semiconductor package comprising: a leadframe having a plurality of leads; adhesive material attached to an area under said leads, wherein said adhesive material has a plurality of openings to expose terminal portions of said leads; a first chip connected to the upper surface of said leadframe by first conductive bumps for electrically coupling to said leads, wherein said adhesive material has an area larger than that of said first chip; a second chip connected to the lower surface of said leadframe through said plurality of openings by second conductive bumps for electrically coupling to said leads, wherein said second chip is face to face to said first chip; and a first compound filled in the space among said first chip, said leadframe and said first conductive bumps.
Claim 2
Dependent Claim
131 words
A semiconductor package, said semiconductor package comprising: a leadframe having a plurality of leads; adhesive material attached to an area under said leads, wherein said adhesive material has a plurality of openings to expose terminal portions of said leads; a first chip connected to the upper surface of said leadframe by first conductive bumps for electrically coupling to said leads, wherein said adhesive material has an area larger than that of said first chip; a second chip connected to the lower surface of said leadframe through said plurality of openings by second conductive bumps for electrically coupling to said leads, wherein said second chip is face to face to said first chip; and a first compound filled in the space among said first chip, said leadframe and said first conductive bumps.
Claim 3
Dependent Claim
22 words
The semiconductor package of claim 1 , further comprising a decoupling capacitor on said leadframe and connected to two of said leads.
Claim 4
Dependent Claim
14 words
The semiconductor package of claim 1 , wherein said adhesive material comprises a tape.
Claim 5
Dependent Claim
16 words
The semiconductor package of claim 1 , further comprising a cover formed on said first chip.
Claim 6
Dependent Claim
26 words
The semiconductor package of claim 1 , further comprising second compound filled in the space among said second chip, said leadframe and said second conductive bumps.
Claim 7
Dependent Claim
51 words
The semiconductor package of claim 1 , further comprising: a third chip attached on said first chip by attaching material; bounding wires electrically coupling to said leads, wherein said third chip is back to back to said first chip; and encapsulating material formed on said first chip and said third chip.
Claim 8
Dependent Claim
163 words
A semiconductor package, said semiconductor package comprising: a first leadframe having first leads; first adhesive material attached on an area under said first leads; a first chip connected to said first leadframe by first conductive bumps for electrically coupling to said first leads, wherein said first adhesive material has a surface at least larger than that of said first chip; a first compound filled in the space among said first chip, said first leadframe and said first conductive bumps; a second leadframe having second leads, wherein said first leads are connected to said second leads; a second adhesive material attached IQ an area under said second leads; a second chip connected to said second leadframe by second conductive bumps for electrically coupling to said second leads, wherein said second adhesive material has a surface at least larger than that of said second chip; and a second compound filled in the space among said second chip, said second leadframe and said second conductive bumps.
Claim 9
Dependent Claim
163 words
A semiconductor package, said semiconductor package comprising: a first leadframe having first leads; first adhesive material attached on an area under said first leads; a first chip connected to said first leadframe by first conductive bumps for electrically coupling to said first leads, wherein said first adhesive material has a surface at least larger than that of said first chip; a first compound filled in the space among said first chip, said first leadframe and said first conductive bumps; a second leadframe having second leads, wherein said first leads are connected to said second leads; a second adhesive material attached IQ an area under said second leads; a second chip connected to said second leadframe by second conductive bumps for electrically coupling to said second leads, wherein said second adhesive material has a surface at least larger than that of said second chip; and a second compound filled in the space among said second chip, said second leadframe and said second conductive bumps.
Claim 10
Dependent Claim
15 words
The structure of claim 7 , further comprising a cover formed on said second chip.
Claim 11
Dependent Claim
110 words
A semiconductor package, said semiconductor package comprising: a leadframe having a plurality of leads; adhesive material attached to an area under said leads, wherein said adhesive material has slots formed therein to expose terminal portions of said leads; a first chip connected to the upper surface of said leadframe by first conductive bumps for electrically coupling to said leads, wherein said adhesive material has an area larger than that of said first chip; and a second chip connected to the lower surface of said leadframe through said slots by second conductive bumps for electrically coupling to said leads, wherein said second chip is face to face to said first chip.
Claim 12
Dependent Claim
110 words
A semiconductor package, said semiconductor package comprising: a leadframe having a plurality of leads; adhesive material attached to an area under said leads, wherein said adhesive material has slots formed therein to expose terminal portions of said leads; a first chip connected to the upper surface of said leadframe by first conductive bumps for electrically coupling to said leads, wherein said adhesive material has an area larger than that of said first chip; and a second chip connected to the lower surface of said leadframe through said slots by second conductive bumps for electrically coupling to said leads, wherein said second chip is face to face to said first chip.
Claim 13
Dependent Claim
40 words
The semiconductor package of claim 9 , further comprising a compound filled in the space among said first chip, said leadframe and said first conductive bumps and the space among said second chip, said leadframe and said second conductive bumps.
Claim 14
Dependent Claim
51 words
The semiconductor package of claim 9 , further comprising: a third chip attached on said first chip by attaching material; bounding wires electrically coupling to said leads, wherein said third chip is back to back to said first chip; and encapsulating material formed on said first chip and said third chip.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-10-22 | 2005-04-23 | 2005-10-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-10-22 | 2009-04-23 | 2009-10-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-10-22 | 2013-04-23 | 2013-10-23 | $7700.00 | Window Closed / Lapsed |