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US5387814A Expired / Lapsed US ⏱️ 0.0 years remaining

Integrated circuit with supports for mounting an electrical component

Assignee: Texas Instruments Inc
•
Filing: 1993-06-30
•
Granted: 1995-02-07
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Expires: 2013-06-30
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Abstract

Abstract A packaged integrated circuit device (2) has exposed contacts (8a, 8b) for electrical connection to terminals of an electrical component, such as a bypass capacitor (10), mounted externally from packaging material (4). The contacts (8a, 8b) are electrically connected to power and ground leads (6) extending from packaging material (4).

Inventors

  • 👤 Daniel Baudouin
  • 👤 James Wallace
  • 👤 Ernie Russell

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-08 17:36
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0216; H05K1/023; H05K1/0231; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W70/475; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0388; H05K2201/0397; H05K2201/10; H05K2201/10431; H05K2201/10507; H05K2201/1053; H05K2201/10613; H05K2201/10621; H05K2201/10636; H05K2201/10689; H10W72/00; H10W72/50; H10W72/59; H10W72/851; H10W72/853; H10W72/865; H10W72/90; H10W72/931; H10W72/932; H10W72/941; H10W72/944; H10W72/9445; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756; Y; Y02; Y02P; Y02P70/00; Y02P70/50

Claims Analysis

Total Claims: 10
Claim 1
Independent Claim 93 words
An integrated circuit device, comprising: a semiconductor die; first and second contacts electrically connected to said semiconductor die; packaging material encapsulating said die, said packaging material having an outer periphery, said first and second contacts extending from said packaging material beyond said outer periphery for supporting an electrical component externally from the outer periphery of said packaging material, at least one of said first and second contacts arranged so as to contact one of first and second spaced apart terminals of said electrical component on a plurality of sides of said electrical component.
Claim 2
Dependent Claim 93 words
An integrated circuit device, comprising: a semiconductor die; first and second contacts electrically connected to said semiconductor die; packaging material encapsulating said die, said packaging material having an outer periphery, said first and second contacts extending from said packaging material beyond said outer periphery for supporting an electrical component externally from the outer periphery of said packaging material, at least one of said first and second contacts arranged so as to contact one of first and second spaced apart terminals of said electrical component on a plurality of sides of said electrical component.
Claim 3
Dependent Claim 42 words
The integrated circuit device of claim 1, in which both of said first and second contacts are arranged so as to contact said first and second spaced apart terminals of said electrical component on a plurality of sides of said electrical component.
Claim 4
Dependent Claim 71 words
An integrated circuit device, comprising: a semiconductor die; first and second contacts electrically connected to said semiconductor die; packaging material encapsulating said die, said packaging material having an outer periphery, said first and second contacts extending from said packaging material beyond said outer periphery for supporting an electrical component externally from the outer periphery of said packaging material, wherein said first and second contacts hold said electrical component with spring tension.
Claim 5
Dependent Claim 71 words
An integrated circuit device, comprising: a semiconductor die; first and second contacts electrically connected to said semiconductor die; packaging material encapsulating said die, said packaging material having an outer periphery, said first and second contacts extending from said packaging material beyond said outer periphery for supporting an electrical component externally from the outer periphery of said packaging material, wherein said first and second contacts hold said electrical component with spring tension.
Claim 6
Dependent Claim 129 words
An integrated circuit device, comprising: a semiconductor die; first and second contacts electrically connected to said semiconductor die, each of said first and second contacts having first and second opposing surfaces; third and fourth contacts electrically connected to said semiconductor die: packaging material encapsulating said die, said packaging material having an outer periphery, said first and second opposing surfaces of said first and second contacts extending from said packaging material beyond said outer periphery for supporting an electrical component externally from the outer periphery of said packaging material, said third and fourth contacts extending from said packaging material beyond said outer periphery for electrical connection to terminals of said electrical component, said third contact electrically connected to said first contact, said fourth contact electrically connected to said second contact.
Claim 7
Dependent Claim 129 words
An integrated circuit device, comprising: a semiconductor die; first and second contacts electrically connected to said semiconductor die, each of said first and second contacts having first and second opposing surfaces; third and fourth contacts electrically connected to said semiconductor die: packaging material encapsulating said die, said packaging material having an outer periphery, said first and second opposing surfaces of said first and second contacts extending from said packaging material beyond said outer periphery for supporting an electrical component externally from the outer periphery of said packaging material, said third and fourth contacts extending from said packaging material beyond said outer periphery for electrical connection to terminals of said electrical component, said third contact electrically connected to said first contact, said fourth contact electrically connected to said second contact.
Claim 8
Dependent Claim 38 words
The integrated circuit device of claim 4, in which said first and second contacts are positioned so as to contact first and second spaced apart terminals of said electrical component on a same side of said electrical component.
Claim 9
Dependent Claim 37 words
The integrated circuit device of claim 4, in which said third and fourth contacts are positioned so as to contact first and second spaced apart terminals of said electrical component on opposing sides of said electrical component.
Claim 10
Dependent Claim 21 words
The integrated circuit device of claim 6, in which said third and fourth contacts hold said electrical component with spring tension.

References Cited (Backward Citations)

US4598307A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1998-02-06 1998-08-08 1999-02-07 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2002-02-06 2002-08-08 2003-02-07 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2006-02-06 2006-08-08 2007-02-07 $7700.00 Window Closed / Lapsed

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