US6285550B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Sub-cooled processor and companion voltage regulator
Assignee: Hewlett Packard Development Co LP
•
Filing: 2000-03-10
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Granted: 2001-09-04
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Expires: 2020-03-10
Abstract
Abstract A compact sub cooling method and apparatus arranged for simultaneously sub cooling both a processor and it companion voltage regulator for enhanced performance. A preferred embodiment of the invention provides for advantageous arrangement of the voltage regulator and memory proximate to the processor for high speed operation. In a preferred embodiment, a circuit board arrangement includes a processor requiring at least one bias voltage, and further includes a companion voltage regulator for providing the bias voltage. The voltage regulator is arranged sufficiently proximate to the processor, so as to limit inductance of electrical coupling therebetween. In a preferred embodiment, a piggy-back design is utilized, wherein the voltage regulator is stacked on top of the processor. Furthermore, a sub cooling module is utilized to simultaneously sub cool both the processor and the voltage regulator below ambient temperature, thereby potentially enhancing the performance of both components. In a preferred embodiment, an evaporator module is sandwiched between the voltage regulator and processor, and the evaporator module interoperates with a compressor and condenser to accomplish sub cooling of the voltage regulator and processor components.
Inventors
- 👤 Christian L Belady
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:54
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/40; H10W40/43
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
111 words
An apparatus comprising; a semiconductor module requiring at least one bias voltage; a companion power supply module for providing the at least one bias voltage; electrical coupling between the power supply module and the semiconductor module for conducting the at least one bias voltage thereto; at least one sub cooling module between the semiconductor module and the power supply module arranged to simultaneously sub cool the semiconductor module and the power supply module below ambient temperature; a condenser module; and a compressor module; wherein said semiconductor module, said companion power supply, said at least one sub cooling module, said condenser module, and said compressor module are included on a circuit board.
Claim 2
Independent Claim
111 words
An apparatus comprising; a semiconductor module requiring at least one bias voltage; a companion power supply module for providing the at least one bias voltage; electrical coupling between the power supply module and the semiconductor module for conducting the at least one bias voltage thereto; at least one sub cooling module between the semiconductor module and the power supply module arranged to simultaneously sub cool the semiconductor module and the power supply module below ambient temperature; a condenser module; and a compressor module; wherein said semiconductor module, said companion power supply, said at least one sub cooling module, said condenser module, and said compressor module are included on a circuit board.
Claim 3
Dependent Claim
32 words
An apparatus as in claim 1 , wherein there is sufficiently proximate arrangement of the power supply module with the semiconductor module, so as to limit inductance of the electrical coupling therebetween.
Claim 4
Dependent Claim
32 words
An apparatus as in claim 2 , wherein the proximate arrangement of the power supply module with the semiconductor module is within the range of approximately two millimeters to approximately twenty-five millimeters.
Claim 5
Dependent Claim
33 words
An apparatus as in claim 1 , wherein the sub cooling module actively sub cools the semiconductor module and the power supply module to a temperature below approximately 20 degrees Centigrade (20 C.).
Claim 6
Dependent Claim
43 words
An apparatus as in claim 1 , wherein the sub cooling module actively sub cools the semiconductor module and the power supply module to temperatures within a range of approximately 20 degrees Centigrade (20 C.) to approximately minus 40 degrees Centigrade (−40 C.).
Claim 7
Dependent Claim
58 words
An apparatus as in claim 1 , wherein: the apparatus further comprises a memory module; electrical coupling between the memory module and the semiconductor module for conducting signals therebetween; and wherein there is a sufficiently proximate arrangement of the memory module with the semiconductor module, so as to limit propagation delay of the signals through the electrical coupling.
Claim 8
Dependent Claim
26 words
An apparatus as in claim 6 , wherein the proximate arrangement of the memory module with the semiconductor module is substantially less than approximately forty centimeters.
Claim 9
Dependent Claim
24 words
An apparatus as in claim 7 , wherein the proximate arrangement of the memory module with the semiconductor module is within approximately thirty-eight centimeters.
Claim 10
Dependent Claim
32 words
An apparatus as in claim 1 , wherein the semiconductor module is a processor, the companion power supply module is a companion voltage regulator, and the sub cooling module is an evaporator.
Claim 11
Independent Claim
115 words
A method of providing a sub cooled semiconductor module and companion power supply module that minimizes space required on a circuit board, the method comprising: providing a semiconductor module, a companion power supply module, and electrical coupling for conducting voltage therebetween on said circuit board; sandwiching an evaporator between the semiconductor module and the power supply module; providing a condenser and a compressor on said circuit board, wherein said semiconductor module, power supply module, evaporator, condenser, and compressor are included on said circuit board; and using the evaporator to simultaneously sub cool the semiconductor module and the power supply module to a temperature below the ambient temperature of the semiconductor module and power supply module.
Claim 12
Independent Claim
115 words
A method of providing a sub cooled semiconductor module and companion power supply module that minimizes space required on a circuit board, the method comprising: providing a semiconductor module, a companion power supply module, and electrical coupling for conducting voltage therebetween on said circuit board; sandwiching an evaporator between the semiconductor module and the power supply module; providing a condenser and a compressor on said circuit board, wherein said semiconductor module, power supply module, evaporator, condenser, and compressor are included on said circuit board; and using the evaporator to simultaneously sub cool the semiconductor module and the power supply module to a temperature below the ambient temperature of the semiconductor module and power supply module.
Claim 13
Dependent Claim
23 words
A method as in claim 10 , wherein the semiconductor module is a processor and the power supply module is a voltage regulator.
Claim 14
Dependent Claim
53 words
A method as in claim 10 , further comprising: providing a memory module and electrical coupling between the memory module and the semiconductor module for conducting signals therebetween; and arranging of the memory module sufficiently proximate to the semiconductor module, so as to limit propagation delay of the signals through the electrical coupling.
Claim 15
Dependent Claim
100 words
A computer system comprising: a circuit board; a processor; a companion voltage regulator electrically coupled to said processor with electrical coupling therebetween, wherein the companion voltage regulator provides electrical power to the processor; at least one evaporator sandwiched between the processor and the companion voltage regulator to actively sub cool the processor and companion voltage regulator simultaneously; a condenser; and a compressor; wherein the condenser and compressor interoperate with the evaporator to achieve sub cooling of the processor and voltage regulator; wherein said processor, at least one evaporator, companion voltage regulator, condenser, and compressor are included on said circuit board.
Claim 16
Dependent Claim
100 words
A computer system comprising: a circuit board; a processor; a companion voltage regulator electrically coupled to said processor with electrical coupling therebetween, wherein the companion voltage regulator provides electrical power to the processor; at least one evaporator sandwiched between the processor and the companion voltage regulator to actively sub cool the processor and companion voltage regulator simultaneously; a condenser; and a compressor; wherein the condenser and compressor interoperate with the evaporator to achieve sub cooling of the processor and voltage regulator; wherein said processor, at least one evaporator, companion voltage regulator, condenser, and compressor are included on said circuit board.
Claim 17
Dependent Claim
33 words
A computer system as in claim 13 , wherein said at least one evaporator simultaneously maintains the processor and the companion voltage regulator at a temperature below approximately 20 degrees Centigrade (20 C.).
Claim 18
Dependent Claim
19 words
A computer system as in claim 13 , wherein said circuit board is hot swappable within the computer system.
Claim 19
Dependent Claim
42 words
The computer system of claim 13 wherein said at least one evaporator simultaneously maintains the processor and the companion voltage regulator at a temperature with a range of approximately 20 degrees Centigrade (20 C.) to approximately minus 40 degrees Centigrade (−40 C.).
Claim 20
Dependent Claim
57 words
The computer system of claim 13 further comprising: a memory module included on said circuit board; electrical coupling between the memory module and the processor for conducting signals therebetween; and wherein there is a sufficiently proximate arrangement of the memory module with the processor, so as to limit propagation delay of the signals through the electrical coupling.
Claim 21
Dependent Claim
24 words
The computer system of claim 17 wherein the sufficiently proximate arrangement of the memory module and the processor is substantially less than forty centimeters.
Claim 22
Dependent Claim
16 words
The apparatus of claim 1 wherein the circuit board is hot swappable within a computer system.
Claim 23
Dependent Claim
16 words
The method of claim 13 wherein said circuit board is hot swappable within a computer system.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-09-03 | 2005-03-05 | 2005-09-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-09-03 | 2009-03-05 | 2009-09-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-09-03 | 2013-03-05 | 2013-09-04 | $7700.00 | Window Closed / Lapsed |