Heat sink and Faraday Cage assembly for a semiconductor module and a power converter

Claim 1

A heat sink and EMI emission attenuating chamber assembly having a semiconductor module and a power converter module, said semiconductor module and said power converter module being electrically connected by power cables and sense lines comprising; a heat transfer layer, coupled to said semiconductor module and to said power converter module, said heat transfer layer having a passageway connecting electrical power between said power converter module and said semiconductor module; wherein said power converter module provides electrical power to said semiconductor module through said passageway; and wherein said heat transfer layer thermally communicates with at least one heat pipe; and at least one fin stack; and wherein said heat pipes and said fin stacks cooperate with said heat transfer layer to dissipate heat; and an EMI emission attenuating chamber enclosing said semiconductor module, said power converter module said power cables and said sense lines; wherein said chamber attenuates EMI emissions; said chamber comprises: an EMI can connected to said heat transfer layer that encloses said power converter module, a printed circuit board having a ground plane, and an EMI attenuated sleeve connected between said ground plane of said printed circuit board and said heat transfer layer that encloses said semiconductor module.