Patent US6285081B1 successfully refreshed from Google Patents.
US6285081B1
Expired / Lapsed
US
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Deflectable interconnect
Assignee: Micron Technology Inc
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Filing: 1999-07-13
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Granted: 2001-09-04
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Expires: 2019-07-13
Abstract
Abstract A package for connecting an integrated circuit to a printed circuit board. The package includes an interconnect having a deflectable cantilever and a solder bump. When the integrated circuit is affixed to the interconnect, the solder bump deflects the cantilever. When the solder bump is heated such that the solder reflows, the cantilever springs toward its non-deflected position and is at least partially absorbed by the reflowing solder.
Inventors
- 👤 Timothy L. Jackson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 18:10
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/325; H05K3/326; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/688; H10W90/00; H10W90/701; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H05K3/40; H05K3/4092; H10W72/00; H10W72/20; H10W72/251; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
156 words
A ball grid array package for an integrated circuit, the ball grid array package interconnecting a plurality of solder bumps on an integrated circuit with a plurality of solder balls located on the exterior of the ball grid array package, the ball grid array package comprising: at least one solder bump attached to an integrated circuit; at least one solder ball which is configured to interface with a printed circuit board; an interposer with at least one pocket and at least one via, wherein the pocket is configured to receive the solder bump and wherein the via is configured to receive the solder ball; and a conductive interconnect circuit which electrically interconnects the solder ball in the via with the solder bump in the pocket, the conductive interconnect circuit further comprising at least one deflectable cantilever which extends into the pocket such that the deflectable cantilever is partially absorbed by the solder bump in the pocket.
Claim 2
Dependent Claim
156 words
A ball grid array package for an integrated circuit, the ball grid array package interconnecting a plurality of solder bumps on an integrated circuit with a plurality of solder balls located on the exterior of the ball grid array package, the ball grid array package comprising: at least one solder bump attached to an integrated circuit; at least one solder ball which is configured to interface with a printed circuit board; an interposer with at least one pocket and at least one via, wherein the pocket is configured to receive the solder bump and wherein the via is configured to receive the solder ball; and a conductive interconnect circuit which electrically interconnects the solder ball in the via with the solder bump in the pocket, the conductive interconnect circuit further comprising at least one deflectable cantilever which extends into the pocket such that the deflectable cantilever is partially absorbed by the solder bump in the pocket.
Claim 3
Dependent Claim
15 words
The ball grid array package of claim 1 wherein the interposer comprises a polymide tape.
Claim 4
Dependent Claim
24 words
The ball grid array package of claim 1 wherein the interposer comprises a top and a bottom, and wherein the top includes the pocket.
Claim 5
Dependent Claim
37 words
The ball grid array package of claim 1 wherein the conductive interconnect circuit further comprises a second deflectable cantilever that extends into the pocket such that the second deflectable cantilever is partially absorbed by the solder bump.
Claim 6
Dependent Claim
22 words
The ball grid array package according to claim 1 wherein the deflectable cantilever comprises a plurality of flaps extending into the pocket.
Claim 7
Dependent Claim
63 words
An integrated circuit package comprising: at least one solder connection attached to an integrated circuit; a substrate with an opening which is configured to receive the solder connection attached to the integrated circuit; and a resilient cantilever which extends into the opening such that the resilient cantilever applies pressure to the solder connection during reflow, wherein the resilient cantilever comprises gold plated copper.
Claim 8
Dependent Claim
63 words
An integrated circuit package comprising: at least one solder connection attached to an integrated circuit; a substrate with an opening which is configured to receive the solder connection attached to the integrated circuit; and a resilient cantilever which extends into the opening such that the resilient cantilever applies pressure to the solder connection during reflow, wherein the resilient cantilever comprises gold plated copper.
Claim 9
Dependent Claim
21 words
The integrated circuit package of claim 6 wherein the pressure applied by the resilient cantilever is directed into the solder connection.
Claim 10
Dependent Claim
18 words
The integrated circuit package of claim 6 wherein the resilient cantilever is partially absorbed by the solder connection.
Claim 11
Dependent Claim
15 words
The integrated circuit package of claim 6 wherein the solder connection is a solder bump.
Claim 12
Dependent Claim
13 words
The integrated circuit package of claim 6 wherein the substrate comprises flexible tape.
Claim 13
Dependent Claim
12 words
The integrated circuit package of claim 6 wherein the substrate comprises polymide.
Claim 14
Independent Claim
42 words
An apparatus comprising: a substrate comprising an opening; and a conductive layer above the interconnect layer, the conductive layer comprising at least two malleable portions which extend into the opening, wherein the first malleable portion is larger than the second malleable portion.
Claim 15
Independent Claim
42 words
An apparatus comprising: a substrate comprising an opening; and a conductive layer above the interconnect layer, the conductive layer comprising at least two malleable portions which extend into the opening, wherein the first malleable portion is larger than the second malleable portion.
Claim 16
Dependent Claim
17 words
The apparatus of claim 12 wherein the two malleable portions extend approximately half way over the opening.
Claim 17
Dependent Claim
23 words
The apparatus of claim 12 wherein at least one of the malleable portions is resilient and deflects into a solder connection during reflow.
Claim 18
Dependent Claim
11 words
The apparatus of claim 12 wherein the substrate is an interconnect.
Claim 19
Dependent Claim
13 words
The apparatus of claim 12 wherein the first malleable portion is a cantilever.
Claim 20
Dependent Claim
13 words
The apparatus of claim 12 wherein the second malleable portion is a cantilever.
Claim 21
Dependent Claim
66 words
A package comprising: an integrated circuit having a pad; a solder connection in communication with the pad; and a partially deflected first conductor and a partially deflected second conductor, the partially deflected first and second conductors each at least partially absorbed by the solder connection, wherein the first and second cantilevers are each a length approximately equal to half of a diameter of the solder bump.
Claim 22
Dependent Claim
66 words
A package comprising: an integrated circuit having a pad; a solder connection in communication with the pad; and a partially deflected first conductor and a partially deflected second conductor, the partially deflected first and second conductors each at least partially absorbed by the solder connection, wherein the first and second cantilevers are each a length approximately equal to half of a diameter of the solder bump.
Claim 23
Dependent Claim
23 words
The package of claim 18 wherein the first and second cantilevers deflect in the same direction from opposite sides of the solder bump.
Claim 24
Dependent Claim
81 words
A package for an integrated circuit, the package comprising: an adhesive having a thickness; a solder bump having a diameter greater than the adhesive thickness; a conductive trace having a deflectable cantilever, wherein the deflectable cantilever deflects into a pocket when the adhesive layer affixes the integrated circuit to the conductive trace, and wherein the cantilever springs toward its original position when the solder bump reflows; a solder ball; and a tape attached between the conductive trace and the solder ball.
Claim 25
Dependent Claim
81 words
A package for an integrated circuit, the package comprising: an adhesive having a thickness; a solder bump having a diameter greater than the adhesive thickness; a conductive trace having a deflectable cantilever, wherein the deflectable cantilever deflects into a pocket when the adhesive layer affixes the integrated circuit to the conductive trace, and wherein the cantilever springs toward its original position when the solder bump reflows; a solder ball; and a tape attached between the conductive trace and the solder ball.
Claim 26
Dependent Claim
24 words
The package according to claim 20 wherein the conductive trace surrounds the pocket and the deflectable cantilever extends over a portion of the pocket.
Claim 27
Dependent Claim
13 words
The package according to claim 20 wherein the pocket protrudes through the tape.
Claim 28
Dependent Claim
32 words
The package according to claim 20 wherein the integrated circuit comprises one of a microprocessor, co-processor, digital signal processor, graphics processor, microcontroller, memory device, reprogrammable device, programmable logic device, and logic array.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-09-03 | 2005-03-05 | 2005-09-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-09-03 | 2009-03-05 | 2009-09-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-09-03 | 2013-03-05 | 2013-09-04 | $7700.00 | Window Closed / Lapsed |