US5451721A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multilayer printed circuit board and method for fabricating same
Assignee: International Business Machines Corp
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Filing: 1991-09-24
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Granted: 1995-09-19
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Expires: 2011-09-24
Abstract
Abstract A multilayer printed circuit board and a corresponding fabrication method are disclosed, which circuit board achieves a relatively high degree of wiring density and a relatively high degree of wiring design freedom. These advantages are obtained in the inventive printed circuit board by electrically connecting power conductors or ground conductors using through holes. On the other hand, signal conductors in any two adjacent signal wiring layers are electrically connected using via holes extending only through an intervening electrically insulating layer. Preferably, the electrically insulating layer is a layer of photosensitive resin and the via holes are formed using conventional photolithographic techniques.
Inventors
- 👤 Yutaka Tsukada
- 👤 Shuhei Tsuchida
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 18:03
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4602; H05K1/00; H05K1/02; H05K1/0213; H05K1/0263; H05K1/0265; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0352; H05K2201/09; H05K2201/09209; H05K2201/0929; H05K2201/09327; H05K2201/095; H05K2201/09509; H05K2203/00; H05K2203/14; H05K2203/1438; H05K2203/15; H05K2203/1581; H05K3/0011; H05K3/0017; H05K3/0023; H05K3/10; H05K3/18; H05K3/181; H05K3/40; H05K3/42; H05K3/425; H05K3/426; H05K3/429; H05K3/4644; H05K3/4661; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/49155; Y10T29/49165
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
206 words
A multilayer printed circuit board, comprising: an electrically insulating substrate, including first and second surfaces; a first electrically conductive region, overlying said first surface of said electrically insulating substrate, to which electrical power or a ground potential is to be applied; at least first and second wiring layers, separated by an electrically insulating layer, overlying said second surface of said electrically insulating substrate, said first and second wiring layers including at least, respectively, first and second signal wiring conductors which are electrically connected to each other through a via hole, containing electrically conductive material, extending through said electrically insulating layer, there being no through hole electrical connections between said signal wiring conductors overlying said second surface and electrical conductors overlying said first surface, said second wiring layer, which overlies said first wiring layer, also including a second electrically conductive region intended to be electrically connected to said first electrically conductive region; and a through hole, containing electrically conductive material, extending through said first electrically conductive region, said electrically insulating substrate, said first wiring layer, said electrically insulating layer, and said second wiring layer, said electrically conductive material in said through hole serving to electrically connect said first electrically conductive region to said second electrically conductive region.
Claim 2
Dependent Claim
206 words
A multilayer printed circuit board, comprising: an electrically insulating substrate, including first and second surfaces; a first electrically conductive region, overlying said first surface of said electrically insulating substrate, to which electrical power or a ground potential is to be applied; at least first and second wiring layers, separated by an electrically insulating layer, overlying said second surface of said electrically insulating substrate, said first and second wiring layers including at least, respectively, first and second signal wiring conductors which are electrically connected to each other through a via hole, containing electrically conductive material, extending through said electrically insulating layer, there being no through hole electrical connections between said signal wiring conductors overlying said second surface and electrical conductors overlying said first surface, said second wiring layer, which overlies said first wiring layer, also including a second electrically conductive region intended to be electrically connected to said first electrically conductive region; and a through hole, containing electrically conductive material, extending through said first electrically conductive region, said electrically insulating substrate, said first wiring layer, said electrically insulating layer, and said second wiring layer, said electrically conductive material in said through hole serving to electrically connect said first electrically conductive region to said second electrically conductive region.
Claim 3
Dependent Claim
30 words
The multilayer printed circuit board of claim 1, wherein said first electrically conductive region is a power supply layer and said second electrically conductive region is a power supply conductor.
Claim 4
Dependent Claim
18 words
The multilayer printed circuit board of claim 2, wherein said second wiring layer also includes a ground conductor.
Claim 5
Dependent Claim
28 words
The multilayer printed circuit board of claim 1, wherein said first electrically conductive region is a ground layer and said second electrically conductive region is a ground conductor.
Claim 6
Dependent Claim
19 words
The multilayer printed circuit board of claim 4, wherein said second wiring layer also includes a power supply conductor.
Claim 7
Dependent Claim
17 words
The multilayer printed circuit board of claim 1, wherein said electrically insulating substrate is a glass-epoxy substrate.
Claim 8
Dependent Claim
19 words
The multilayer printed circuit board of claim 1, wherein said electrically insulating layer is a layer of photosensitive resin.
Claim 9
Dependent Claim
22 words
The multilayer printed circuit board of claim 1, wherein said second wiring layer also includes terminals for attachment of surface mount components.
Claim 10
Dependent Claim
273 words
A multilayer printed circuit board, comprising: an electrically insulating substrate, including first and second surfaces; at least first and second wiring layers, separated by a first electrically insulating layer, overlying said first surface, said first and second wiring layers including at least, respectively, first and second signal wiring conductors which are electrically connected to each other through a first via hole, containing electrically conductive material, extending through said first electrically insulating layer, said first wiring layer, which overlies said second wiring layer, also including a first electrically conductive region to which electrical power or a ground potential is to be applied; at least third and fourth wiring layers, separated by a second electrically insulating layer, overlying said second surface, said third and fourth wiring layers including at least, respectively, third and fourth signal wiring conductors which are electrically connected to each other through a second via hole, containing electrically conductive material, extending through said second electrically insulating layer, there being no through hole electrical connections between signal wiring conductors overlying said second surface and signal wiring conductors overlying said first surface, said fourth wiring layer, which overlies said third wiring layer, also including a second electrically conductive region intended to be electrically connected to said first electrically conductive region; and a through hole, containing electrically conductive material, extending through said first wiring layer, said first electrically insulating layer, said second wiring layer, said electrically insulating substrate, said third wiring layer, said second electrically insulating layer and said fourth wiring layer, said electrically conductive material in said through hole serving to electrically connect said first electrically conductive region to said second electrically conductive region.
Claim 11
Dependent Claim
273 words
A multilayer printed circuit board, comprising: an electrically insulating substrate, including first and second surfaces; at least first and second wiring layers, separated by a first electrically insulating layer, overlying said first surface, said first and second wiring layers including at least, respectively, first and second signal wiring conductors which are electrically connected to each other through a first via hole, containing electrically conductive material, extending through said first electrically insulating layer, said first wiring layer, which overlies said second wiring layer, also including a first electrically conductive region to which electrical power or a ground potential is to be applied; at least third and fourth wiring layers, separated by a second electrically insulating layer, overlying said second surface, said third and fourth wiring layers including at least, respectively, third and fourth signal wiring conductors which are electrically connected to each other through a second via hole, containing electrically conductive material, extending through said second electrically insulating layer, there being no through hole electrical connections between signal wiring conductors overlying said second surface and signal wiring conductors overlying said first surface, said fourth wiring layer, which overlies said third wiring layer, also including a second electrically conductive region intended to be electrically connected to said first electrically conductive region; and a through hole, containing electrically conductive material, extending through said first wiring layer, said first electrically insulating layer, said second wiring layer, said electrically insulating substrate, said third wiring layer, said second electrically insulating layer and said fourth wiring layer, said electrically conductive material in said through hole serving to electrically connect said first electrically conductive region to said second electrically conductive region.
Claim 12
Dependent Claim
20 words
The multilayer printed circuit board of claim 9, wherein said first and second electrically conductive regions are power supply conductors.
Claim 13
Dependent Claim
22 words
The multilayer printed circuit board of claim 10, wherein at least said first or said fourth wiring layer includes a ground conductor.
Claim 14
Dependent Claim
19 words
The multilayer printed circuit board of claim 9, wherein said first and second electrically conductive regions are ground conductors.
Claim 15
Dependent Claim
23 words
The multilayer printed circuit board of claim 12, wherein at least said first or said fourth wiring layer includes a power supply conductor.
Claim 16
Dependent Claim
17 words
The multilayer printed circuit board of claim 9, wherein said electrically insulating substrate is a glass-epoxy substrate.
Claim 17
Dependent Claim
21 words
The multilayer printed circuit board of claim 9, wherein said first and second electrically insulating layers are layers of photosensitive resin.
Claim 18
Dependent Claim
26 words
The multilayer printed circuit board of claim 9, wherein at least said first or said fourth wiring layer includes terminals for attachment of surface mount components.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-09-18 | 1999-03-20 | 1999-09-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-09-18 | 2003-03-20 | 2003-09-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-09-18 | 2007-03-20 | 2007-09-19 | $7700.00 | Window Closed / Lapsed |