Tracking sensor fixture and method for tracking reference locations on a moving semiconductor leadframe strip

Claim 2

In semiconductor manufacture, a tracking apparatus for aligning reference locations on a moving semiconductor leadframe strip optic sensor, said tracking apparatus comprising: a support frame moveably mounted with respect to the moving leadframe strips; a sender component and a receiver component of an optic sensor mounted to the movable support frame and adapted to provide an optic sight line through the leadframe strip; a guide means mounted to the movable support frame for contacting the leadframe strip and precisely position the reference locations on the leadframe strip with respect to the optic sight line so that the reference locations pass through the optic sight line; and biasing means for biasing the guide means into contact with the leadframe strip.

Claim 3

The tracking apparatus as claimed in claim 1 and wherein the movable guide means includes a v-shaped guide member and a roller bearing for contacting an edge of the leadframe strip for precisely positioning the reference locations with respect to the sight line.

Claim 4

The tracking apparatus as claimed in claim 2 and wherein the reference locations are holes formed along an edge of the leadframe strip.

Claim 5

The tracking apparatus as claimed in claim 3 and wherein the leadframe strips are moved by a carrier belt and the movable support frame is attached to a support member for the carrier belt.

Claim 6

The tracking apparatus as claimed in claim 4 and wherein the guide member and roller bearing contact a lower edge of the moving leadframe strips suspended from a carrier belt.

Claim 7

The tracking apparatus as claimed in claim 5 and wherein the optic sensor controls a laser inscription apparatus.

Claim 8

In semiconductor manufacture wherein leadframe strips are removably attached to and moved by a carrier belt, a tracking sensor apparatus mounting an optic sensor and positioning the moving leadframe strips so that reference locations formed on the leadframe strips are aligned with an optic sight line of the optic sensor, said tracking apparatus comprising: a support frame slidably mounted for up and down movement with respect to the carrier belt and leadframe strips and adapted for mounting a sender component and a receiver component of the optic sensor to provide an optic sight line through the leadframe strips; a guide member mounted to the support frame and including a generally v-shaped guide plate and a roller bearing for contacting an edge of the moving leadframe strips and aligning the optic sight line with the reference locations; and a spring member attached to the support frame for biasing the guide member and roller bearing into contact with the edge of the moving leadframe strips.

Claim 9

In semiconductor manufacture wherein leadframe strips are removably attached to and moved by a carrier belt, a tracking sensor apparatus mounting an optic sensor and positioning the moving leadframe strips so that reference locations formed on the leadframe strips are aligned with an optic sight line of the optic sensor, said tracking apparatus comprising: a support frame slidably mounted for up and down movement with respect to the carrier belt and leadframe strips and adapted for mounting a sender component and a receiver component of the optic sensor to provide an optic sight line through the leadframe strips; a guide member mounted to the support frame and including a generally v-shaped guide plate and a roller bearing for contacting an edge of the moving leadframe strips and aligning the optic sight line with the reference locations; and a spring member attached to the support frame for biasing the guide member and roller bearing into contact with the edge of the moving leadframe strips.

Claim 10

The tracking apparatus as claimed in claim 7 and wherein the reference locations are holes formed along an edge of the leadframe strips.

Claim 11

The tracking apparatus as claimed in claim 7 and wherein the leadframe strips are suspended from the carrier belt and the guide plate and roller bearing contact a lower edge of the leadframe strips.

Claim 12

The tracking apparatus as claimed in claim 7 and wherein the support frame is slidably mounted on a slide bearing.

Claim 13

The tracking apparatus as claimed in claim 7 and wherein the support frame is attached to a stationary support for the carrier belt.

Claim 14

The tracking apparatus as claimed in claim 7 and wherein the optic sensor controls a laser inscription apparatus.

Claim 15

The tracking apparatus as claimed in claim 7 and wherein the v-shaped guide member is mounted at an angle with respect to an edge of the moving leadframe strips.

Claim 16

The tracking apparatus as claimed in claim 7 and wherein the distance from an outside diameter of the roller bearing to the subject line is equal to the distance from the edge of the leadframe strips to a centerline of the reference locations.

Claim 17

In semiconductor manufacture wherein semiconductor leadframe strips are moved on a carrier belt, a method for aligning reference locations on the leadframe strips with an optic sight line of an optic sensor, comprising the steps of: providing a movable fixture for the optic sensor, said fixture having a guide member for the leadframe strips and with a sender component and a receiver component of the optic sensor mounted on the fixture to provide a sight line through the leadframe strips; positioning the movable fixture with respect to the moving leadframe strip so that an edge of the leadframe strip is contacted by the guide member regardless of its vertical location and the reference locations on leadframe strips are aligned with the sight line of the optic sensor; and using the reference locations to control a semiconductor manufacturing operation.

Claim 18

In semiconductor manufacture wherein semiconductor leadframe strips are moved on a carrier belt, a method for aligning reference locations on the leadframe strips with an optic sight line of an optic sensor, comprising the steps of: providing a movable fixture for the optic sensor, said fixture having a guide member for the leadframe strips and with a sender component and a receiver component of the optic sensor mounted on the fixture to provide a sight line through the leadframe strips; positioning the movable fixture with respect to the moving leadframe strip so that an edge of the leadframe strip is contacted by the guide member regardless of its vertical location and the reference locations on leadframe strips are aligned with the sight line of the optic sensor; and using the reference locations to control a semiconductor manufacturing operation.

Claim 19

The method as recited in claim 15 and wherein the reference locations comprise holes formed along a side rail of the leadframe strips.

Claim 20

The method as recited in claim 16 and further comprising biasing the movable fixture into contact with the leadframe strip using a spring member.

Claim 21

The method as recited in claim 17 and wherein the guide member comprises a generally v-shaped guide plate and a roller bearing.

Claim 22

The method as recited in claim 18 and wherein the movable fixture includes a movable support frame slidably mounted on a slide bearing.

Claim 23

The method as recited in claim 19 and wherein the semiconductor manufacturing operation controlled is a laser inscription process for printing a visual code on semiconductor packages formed on the leadframe strips.