US6274935B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Copper wire-bonding pad
Assignee: International Business Machines Corp
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Filing: 2000-12-12
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Granted: 2001-08-14
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Expires: 2020-12-12
Abstract
Abstract A copper-containing, wire-bonding pad structure for bonding to gold wires. The structure includes a nickel-containing film to improve metallurgical characteristics. The structure also has a laminated impurity film within the copper pad, which complexes with the nickel-containing pad to prevent a destructive interaction between nickel and copper at elevated temperatures, or during the lifetime of the device or the wirebond.
Inventors
- 👤 Cyprian E. Uzoh
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 15:50
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40; H10W20/41; H10W20/425; H10W72/00; H10W72/01; H10W72/012; H10W72/071; H10W72/075; H10W72/20; H10W72/251; H10W72/29; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/5525; H10W72/59; H10W72/90; H10W72/921; H10W72/923; H10W72/931; H10W72/934; H10W72/941; H10W72/9415; H10W72/942; H10W72/951; H10W72/952
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
78 words
An improved copper-containing pad for gold wire bonding having an upper copper surface and a nickel-containing film disposed over said upper copper surface including nickel and a component, wherein the improvement comprises: an impurity disposed beneath said upper copper surface; an interface formed between said nickel-containing film and said upper copper surface; and a chemical mixture disposed at said interface and formed from an interaction between said nickel-containing film and an impurity film originally laminated within said pad.
Claim 2
Dependent Claim
78 words
An improved copper-containing pad for gold wire bonding having an upper copper surface and a nickel-containing film disposed over said upper copper surface including nickel and a component, wherein the improvement comprises: an impurity disposed beneath said upper copper surface; an interface formed between said nickel-containing film and said upper copper surface; and a chemical mixture disposed at said interface and formed from an interaction between said nickel-containing film and an impurity film originally laminated within said pad.
Claim 3
Dependent Claim
20 words
The improved copper-containing pad as in claim 1 , wherein said chemical mixture includes nickel, said component, and said impurity.
Claim 4
Dependent Claim
15 words
The improved copper-containing pad as in claim 1 , wherein said nickel-containing film includes phosphorus.
Claim 5
Dependent Claim
15 words
The improved copper-containing pad as in claim 1 , wherein said nickel-containing film includes boron.
Claim 6
Dependent Claim
15 words
The improved copper-containing pad as in claim 1 , wherein said impurity film includes oxygen.
Claim 7
Dependent Claim
22 words
The improved copper-containing pad as in claim 1 , wherein said impurity film includes at least one of nitrogen, sulfur, and carbon.
Claim 8
Dependent Claim
15 words
The improved copper-containing pad as in claim 1 , wherein said chemical mixture comprises NiP(O).
Claim 9
Dependent Claim
18 words
The improved copper-containing pad as in claim 1 , further comprising a gold film covering said nickel-containing film.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-08-13 | 2005-02-12 | 2005-08-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-08-13 | 2009-02-12 | 2009-08-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-08-13 | 2013-02-12 | 2013-08-14 | $7700.00 | Window Closed / Lapsed |