US6248959B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Substrate with die area having same CTE as IC
Assignee: W.L. Gore and Associates Inc
•
Filing: 1999-04-13
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Granted: 2001-06-19
•
Expires: 2019-04-13
Abstract
Abstract A package for mounting an integrated circuit chip includes a body having at least a first region, the size of the integrated circuit chip, and a second region. The first region has a first coefficient of thermal expansion (CTE), and the second region has a second, different CTE. The first region approximately matches the CTE of the integrated circuit chip mounted on the package, and the second region approximates the CTE of the printed wiring board to which the package is mounted.
Inventors
- 👤 Mark F. Sylvester
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 18:03
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/153; H10W40/00; H10W40/20; H10W40/25; H10W40/251; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/695; H10W90/00; H10W90/401; H05; H05K; H05K1/00; H05K1/02; H05K1/0271; H10W70/68; H10W70/681; H10W70/682; H10W70/685; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/4913; Y10T428/00; Y10T428/249921; Y10T428/249953; Y10T428/249955; Y10T428/249958; Y10T428/249982; Y10T428/249994; Y10T428/249999; Y10T428/25; Y10T428/252; Y10T428/28; Y10T428/2804; Y10T428/31504; Y10T428/3154
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
102 words
The combination of a microchip and a substrate, said microchip having a coefficient of thermal expansion, said microchip having an area, said microchip being mounted on said substrate, said combination comprising: a die area defined on the substrate, said die area substantially equal to the area of the microchip, wherein only said die area portion of the substrate has a coefficient of thermal expansion that approaches the coefficient of thermal expansion of the microchip to reduce relative movement between the microchip and the die area of the substrate through mismatched coefficients of thermal expansion of the microchip and of the die area.
Claim 2
Dependent Claim
102 words
The combination of a microchip and a substrate, said microchip having a coefficient of thermal expansion, said microchip having an area, said microchip being mounted on said substrate, said combination comprising: a die area defined on the substrate, said die area substantially equal to the area of the microchip, wherein only said die area portion of the substrate has a coefficient of thermal expansion that approaches the coefficient of thermal expansion of the microchip to reduce relative movement between the microchip and the die area of the substrate through mismatched coefficients of thermal expansion of the microchip and of the die area.
Claim 3
Dependent Claim
64 words
The combination according to claim 1 , wherein said substrate has a different coefficient of thermal expansion outside the defined die area, said combination further comprising a circuit board for mounting the substrate, said circuit board having a coefficient of thermal expansion that approaches said different coefficient of thermal expansion outside the defined die area, to reduce thermally created bending and shearing movements therebetween.
Claim 4
Dependent Claim
24 words
The combination according to claim 1 , further comprising said die area coefficient of thermal expansion approximating the range of 2 to 12 PPM/°C.
Claim 5
Dependent Claim
26 words
The combination according to claim 2 , wherein said coefficient of thermal expansion of said substrate outside said die area approaches the range of 16-20 PPM/°C.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-06-18 | 2004-12-18 | 2005-06-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-06-18 | 2008-12-18 | 2009-06-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-06-18 | 2012-12-18 | 2013-06-19 | $7700.00 | Window Closed / Lapsed |