US5768108A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multi-layer wiring structure
Assignee: Hitachi Ltd
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Filing: 1996-09-27
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Granted: 1998-06-16
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Expires: 2016-09-27
Abstract
Abstract A multi-layer wiring structure for mounting electronic devices is provided to be used in an electronic computer, a work station or the like, and more particularly a multi-layer packaging board having microscopic wiring layers, which board has an excellent dimensional stability and a high reliability, and also a method of producing such a board are provided. The multi-layer wiring structure includes a complex of at least two sub-assemblies each having wiring layers formed respectively on opposite sides of a core material of a low thermal expansive metal through an insulation layer in such a manner that the wiring layers correspond in area ratio to each other. The sub-assemblies are connected to one another by conductors via through holes. In this structure, the wiring structure having the core material of a low thermal expansive metal is used as a base, and therefore a dimensional change of a board is small, and microscopic wiring layers can be formed, and the reliability of connection between the sub-assemblies is enhanced. Furthermore, the board can be produced at low costs.
Inventors
- 👤 Osamu Miura
- 👤 Kunio Miyazaki
- 👤 Akio Takahashi
- 👤 Motoyo Wajima
- 👤 Ryuji Watanabe
- 👤 Takao Miwa
- 👤 Yuichi Satsu
- 👤 Shigeo Amagi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 19:57
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; H05K3/4641; H10W70/60; H10W70/611; H10W90/00; H10W90/401; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K1/112; H05K1/113; H05K2201/00; H05K2201/06; H05K2201/068; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09536; H05K2201/096; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4069; H05K3/42; H05K3/429; H05K3/4623; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
118 words
A multi-layer wiring structure comprising a complex of at least two sub-assemblies each having wiring layers formed respectively on both sides of a core material through an insulation layer in such a manner that said wiring layers correspond in area ratio to each other, said core material being made of at least one metal selected from the group consisting of tungsten, molybdenum, an iron-nickel alloy, an iron-nickel-cobalt alloy, iron, nickel and cobalt, said sub-assemblies being connected to one another by conductors via through holes, said conductors being formed by filling the through holes by plating or addition of paste, such that the through holes are filled with said conductors, and the sub-assemblies being laminated together by adhesive films.
Claim 2
Dependent Claim
118 words
A multi-layer wiring structure comprising a complex of at least two sub-assemblies each having wiring layers formed respectively on both sides of a core material through an insulation layer in such a manner that said wiring layers correspond in area ratio to each other, said core material being made of at least one metal selected from the group consisting of tungsten, molybdenum, an iron-nickel alloy, an iron-nickel-cobalt alloy, iron, nickel and cobalt, said sub-assemblies being connected to one another by conductors via through holes, said conductors being formed by filling the through holes by plating or addition of paste, such that the through holes are filled with said conductors, and the sub-assemblies being laminated together by adhesive films.
Claim 3
Dependent Claim
144 words
A packaging board comprising a board having a thermal expansion coefficient of 1×10 -5 /°C.-1×10 -7 /°C.; and a multi-layer wiring structure formed on said board, said multi-layer wiring structure comprising a complex of at least two sub-assemblies each having wiring layers formed respectively on both sides of a core material through an insulation layer in such a manner that said wiring layers correspond in area ratio to each other, said core material being made of at least one metal selected from the group consisting of tungsten, molybdenum, an iron-nickel alloy, an iron-nickel-cobalt alloy, iron, nickel and cobalt, said sub-assemblies being connected to one another by conductors via through holes, said conductors being formed by filling the through holes by plating or addition of paste, such that the through holes are filled with said conductors, and the sub-assemblies being laminated together by adhesive films.
Claim 4
Dependent Claim
144 words
A packaging board comprising a board having a thermal expansion coefficient of 1×10 -5 /°C.-1×10 -7 /°C.; and a multi-layer wiring structure formed on said board, said multi-layer wiring structure comprising a complex of at least two sub-assemblies each having wiring layers formed respectively on both sides of a core material through an insulation layer in such a manner that said wiring layers correspond in area ratio to each other, said core material being made of at least one metal selected from the group consisting of tungsten, molybdenum, an iron-nickel alloy, an iron-nickel-cobalt alloy, iron, nickel and cobalt, said sub-assemblies being connected to one another by conductors via through holes, said conductors being formed by filling the through holes by plating or addition of paste, such that the through holes are filled with said conductors, and the sub-assemblies being laminated together by adhesive films.
Claim 5
Dependent Claim
154 words
An electronic device packaging board comprising a board having a thermal expansion coefficient of 1×10 -5 /°C.-1×10 -7 /°C.; and a multi-layer wiring structure formed on said board, said multi-layer wiring structure comprising a complex of at least two sub-assemblies each having wiring layers formed respectively on both sides of a core material through an insulation layer in such a manner that said wiring layers correspond in area ratio to each other, said core material being made of at least one metal selected from the group consisting of tungsten, molybdenum, an iron-nickel alloy, an iron-nickel-cobalt alloy, iron, nickel and cobalt, said sub-assemblies being connected to one another by conductors via through holes, said conductors being formed by filling the through holes by plating or addition of paste, such that the through holes are filled with said conductors, and being laminated together by adhesive films, and an electronic device being mounted on the packaging board.
Claim 6
Dependent Claim
154 words
An electronic device packaging board comprising a board having a thermal expansion coefficient of 1×10 -5 /°C.-1×10 -7 /°C.; and a multi-layer wiring structure formed on said board, said multi-layer wiring structure comprising a complex of at least two sub-assemblies each having wiring layers formed respectively on both sides of a core material through an insulation layer in such a manner that said wiring layers correspond in area ratio to each other, said core material being made of at least one metal selected from the group consisting of tungsten, molybdenum, an iron-nickel alloy, an iron-nickel-cobalt alloy, iron, nickel and cobalt, said sub-assemblies being connected to one another by conductors via through holes, said conductors being formed by filling the through holes by plating or addition of paste, such that the through holes are filled with said conductors, and being laminated together by adhesive films, and an electronic device being mounted on the packaging board.
Claim 7
Dependent Claim
24 words
A structure according to any one of claims 1 to 3, wherein said core material is a metallic film having thickness of 0.01-1 mm.
Claim 8
Dependent Claim
28 words
A structure according to any one of claims 1 to 3, wherein a depth of said through hole is larger than an inner diameter of said through hole.
Claim 9
Dependent Claim
29 words
A structure according to any one of claims 1 to 3, wherein an area ratio of said through holes to the multi-layer wiring layer is .not more than 10%.
Claim 10
Dependent Claim
21 words
A structure according to any one of claims 1 to 3, wherein said insulation layer has a dielectric constant of 2.2-4.7.
Claim 11
Dependent Claim
15 words
A packaging board according to claim 3, wherein said electronic device is a semiconductor device.
Claim 12
Dependent Claim
17 words
A packaging board according to claim 3, wherein said electronic device is a plastic-molded-type large-scale integrated circuit.
Claim 13
Dependent Claim
17 words
A packaging board according to claim 3, wherein said electronic device is a bare large-scale integrated circuit.
Claim 14
Dependent Claim
19 words
A packaging board according to claim 3, wherein said electronic device is mounted directly on the multi-layer wiring structure.
Claim 15
Dependent Claim
16 words
A packaging board according to claim 11, wherein said electronic device is a large-scale integrated circuit.
Claim 16
Dependent Claim
103 words
A multi-layer wiring structure comprising a complex of at least two sub-assemblies each having a wiring layer formed through an insulation layer on a surface of a core material of a metallic foil made of at least one metal selected from the group consisting of tungsten, molybdenum, an iron-nickel alloy, an iron-nickel-cobalt alloy, iron, nickel and cobalt, said sub-assemblies being connected to one another by conductors via through holes, said conductors being formed by filling the through holes by plating or addition of paste, such that the through holes are filled with said conductors, and the sub-assemblies being laminated together by adhesive films.
Claim 17
Dependent Claim
103 words
A multi-layer wiring structure comprising a complex of at least two sub-assemblies each having a wiring layer formed through an insulation layer on a surface of a core material of a metallic foil made of at least one metal selected from the group consisting of tungsten, molybdenum, an iron-nickel alloy, an iron-nickel-cobalt alloy, iron, nickel and cobalt, said sub-assemblies being connected to one another by conductors via through holes, said conductors being formed by filling the through holes by plating or addition of paste, such that the through holes are filled with said conductors, and the sub-assemblies being laminated together by adhesive films.
Claim 18
Dependent Claim
148 words
A packaging board comprising a board having not less than two layers of wiring formed therein; and a multi-layer wiring structure provided on one side or each side of said board, said multi-layer wiring structure being connected to said board by conductors via through holes, said multi-layer wiring structure comprising a complex of at least two sub-assemblies each having wiring layers formed through an insulation layer on both upper and lower surfaces of a core material of a metallic foil made of at least one metal selected from the group consisting of tungsten, molybdenum, an iron-nickel alloy, an iron-nickel-cobalt alloy, iron, nickel and cobalt, said sub-assemblies being connected together by conductors via through holes, said conductors being formed by filling the through holes by plating or addition of paste, such that the through holes are filled with said conductors, and said sub-assemblies being laminated together by adhesive films.
Claim 19
Dependent Claim
148 words
A packaging board comprising a board having not less than two layers of wiring formed therein; and a multi-layer wiring structure provided on one side or each side of said board, said multi-layer wiring structure being connected to said board by conductors via through holes, said multi-layer wiring structure comprising a complex of at least two sub-assemblies each having wiring layers formed through an insulation layer on both upper and lower surfaces of a core material of a metallic foil made of at least one metal selected from the group consisting of tungsten, molybdenum, an iron-nickel alloy, an iron-nickel-cobalt alloy, iron, nickel and cobalt, said sub-assemblies being connected together by conductors via through holes, said conductors being formed by filling the through holes by plating or addition of paste, such that the through holes are filled with said conductors, and said sub-assemblies being laminated together by adhesive films.
Claim 20
Dependent Claim
152 words
An electronic device packaging board comprising a board having not less than two layers of wiring formed therein; and a multi-layer wiring structure provided on one side or each side of said board, said multi-layer wiring structure being connected to said board by conductors via through holes, said multi-layer wiring structure comprising a complex of at least two sub-assemblies each having wiring layers formed through an insulation layer on both upper and lower surfaces of a core material of a metallic foil made of at least one metal selected from the group consisting of tungsten, molybdenum, an iron-nickel alloy, an iron-nickel-cobalt alloy, iron, nickel and cobalt, said sub-assemblies being connected to one another by conductors via through holes, said conductors being formed by filling the through holes by plating or addition of pastes such that the through holes are filled with said conductors, and said sub-assemblies being laminated together by adhesive films.
Claim 21
Dependent Claim
152 words
An electronic device packaging board comprising a board having not less than two layers of wiring formed therein; and a multi-layer wiring structure provided on one side or each side of said board, said multi-layer wiring structure being connected to said board by conductors via through holes, said multi-layer wiring structure comprising a complex of at least two sub-assemblies each having wiring layers formed through an insulation layer on both upper and lower surfaces of a core material of a metallic foil made of at least one metal selected from the group consisting of tungsten, molybdenum, an iron-nickel alloy, an iron-nickel-cobalt alloy, iron, nickel and cobalt, said sub-assemblies being connected to one another by conductors via through holes, said conductors being formed by filling the through holes by plating or addition of pastes such that the through holes are filled with said conductors, and said sub-assemblies being laminated together by adhesive films.
Claim 22
Dependent Claim
33 words
A structure according to any one of claims 1-3, 13, 14 and 15, wherein said core material has a thermal expansion coefficient in a range of 1×10 -5 /°C. to 1×10 -7 /°C.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-06-15 | 2001-12-15 | 2002-06-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-06-15 | 2005-12-15 | 2006-06-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-06-15 | 2009-12-15 | 2010-06-16 | $7700.00 | Window Closed / Lapsed |