US5290624A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Heat-conductive adhesive films, laminates with heat-conductive adhesive layers and the use thereof
Assignee: Huntsman Advanced Materials Americas LLC
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Filing: 1992-04-22
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Granted: 1994-03-01
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Expires: 2012-04-22
Abstract
Abstract A laminate comprising (a) a carrier having a heat conductivity of at least 10 W/mK and a thickness of 10 to 100 μm, and (b) a dielectric adhesive layer which is applied to at least one surface of said substrate and which contains a heat-conductive filler and has a thickness of 5 to 500 μm and a heat conductivity of 1 W/mK. The flexible laminate, or a dielectric and self-supporting adhesive film which contains a heat-conductive filler and has a heat conductivity of at least 1 W/mK, is suitable for removing heat from leadframes which have electrically insulated contact surfaces for electrical and electronic components and which are encapsulated with a synthetic resin moulding material, typically dual-in-line plastic packages, by bonding the rear sides of the contact surfaces to the leads.
Inventors
- 👤 Patrice Bujard
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 18:54
CPC Classifications
B; B32; B32B; B32B15/00; B32B15/04; B32B15/08; H; H10; H10W; H10W40/00; H10W40/20; H10W40/25; H10W40/251; H05; H05K; H05K3/00; H05K3/30; H05K3/303; H05K3/305; H10W40/255; H10W40/258; H10W40/70; H10W40/77; H10W40/778; H05K1/00; H05K1/02; H05K1/0201; H05K1/0203; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10689; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H10W90/00; H10W90/701; H10W90/731; H10W90/736; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/249921; Y10T428/249953; Y10T428/249955; Y10T428/249958; Y10T428/29; Y10T428/2913; Y10T428/2918; Y10T428/292; Y10T428/2933; Y10T428/294; Y10T428/2942; Y10T428/2949
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
82 words
A laminate comprising (a) a substrate having a heat conductivity of at least 10 W/mK and a thickness of 10 to 100 μm, and (b) a dielectric adhesive layer which is applied to at least one surface of said substrate and which contains a heat-conductive, finely particulate filler selected from the group consisting of aluminum nitride, boron nitride, silicon nitride and silicon carbide, said dielectric adhesive layer having a thickness of 5 to 500 μm and a heat conductivity of 1 W/mK.
Claim 2
Dependent Claim
82 words
A laminate comprising (a) a substrate having a heat conductivity of at least 10 W/mK and a thickness of 10 to 100 μm, and (b) a dielectric adhesive layer which is applied to at least one surface of said substrate and which contains a heat-conductive, finely particulate filler selected from the group consisting of aluminum nitride, boron nitride, silicon nitride and silicon carbide, said dielectric adhesive layer having a thickness of 5 to 500 μm and a heat conductivity of 1 W/mK.
Claim 3
Dependent Claim
48 words
A laminate according to claim 1, wherein the substrate is selected from the group consisting of foils or cloths of metals, alloys or synthetic resin moulding materials of high heat conductivity and having melting points higher than about 150° C., and of cloths of carbon or ceramic fibres.
Claim 4
Dependent Claim
19 words
A laminate according to claim 1, wherein the substrate is selected from the group consisting of metals and alloys.
Claim 5
Dependent Claim
26 words
A laminate according to claim 3, wherein the substrate is selected from the group consisting of copper, nickel, zinc, aluminium and alloys of copper and nickel.
Claim 6
Dependent Claim
18 words
A laminate according to claim 1, wherein the substrate has a heat conductivity of at least 20 W/mK.
Claim 7
Dependent Claim
17 words
A laminate according to claim 1, wherein the substrate has a thickness of 10 to 70 μm.
Claim 8
Dependent Claim
19 words
A laminate according to claim 1, wherein the adhesive layer is formed from a pasty, viscous or solid adhesive.
Claim 9
Dependent Claim
21 words
A laminate according to claim 1, wherein the adhesive layer is formed from a film adhesive or a hot melt adhesive.
Claim 10
Dependent Claim
16 words
A laminate according to claim 1, wherein the adhesive layer contains an epoxy resin as adhesive.
Claim 11
Dependent Claim
19 words
A laminate according to claim 1, wherein the thickness of the adhesive layer is from 20 to 300 μm.
Claim 12
Dependent Claim
19 words
A laminate according to claim 1, wherein the adhesive layer has a heat conductivity of at least 1.5 W/mK.
Claim 13
Dependent Claim
34 words
A laminate according to claim 1, wherein the adhesive layer contains a heat-conductive filler which is finely particulate and has a particle size which is not greater than the thickness of the adhesive layer.
Claim 14
Dependent Claim
20 words
A laminate according to claim 12, wherein the heat-conductive filler is a natural or synthetic mineral or a ceramic material.
Claim 15
Dependent Claim
13 words
A laminate according to claim 12, wherein the heat-conductive filler is aluminium nitride.
Claim 16
Dependent Claim
20 words
A laminate according to claim 1, which is adapted to the shape of the component to which it is bonded.
Claim 17
Dependent Claim
24 words
A laminate according to claim 12 wherein the heat-conductive filler has a particle size which is smaller than the thickness of the adhesive layer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-02-28 | 1997-08-30 | 1998-03-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-02-28 | 2001-08-30 | 2002-03-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-02-28 | 2005-08-30 | 2006-03-01 | $7700.00 | Window Closed / Lapsed |