EP0257466A2
Expired / Lapsed
EP
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Low thermal expansion,heat conducting laminates having layersof metal and reinforced polymer matrix composite
Assignee: General Electric Co
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Filing: 1987-08-13
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Granted: —
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Expires: 2007-08-13
Abstract
Abstract Heat conducting laminates and laminated heat conducting devices having at least one layer of metal (80) and at least one layer of polymer matrix composite material (82, 84) having low-thermal-expansion reinforcing material (90) distributed throughout and embedded therein. The coefficient of thermal expansion and the thermal conductivity of the laminated heat conducting devices are defined by the metal in combination with the polymer matrix material and the low-thermal-expansion reinforcing material in the laminate. The coefficient of thermal expansion and thermal conductivity of a heat conducting device can be controlled by bonding at least one layer of metal to at least one layer of polymer matrix composite material having low-thermal-expansion reinforcing material distributed throughout and embedded therein. In one embodiment, the laminated heat conducting device comprises a plurality of alternating layers of aluminum and epoxy resin having graphite fibers distributed throughout the epoxy resin.
Inventors
- 👤 Carl Henry Zweben
- 👤 Rodman Arnold Mogle
- 👤 Benjamin Thomas Jr Rodini
- 👤 Charles Louis Thaw
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 19:12
CPC Classifications
B; B32; B32B; B32B15/00; B32B15/04; B32B15/08; B32B15/092; B32B15/20; B32B27/00; B32B27/34; B32B27/38; B32B3/00; B32B3/26; B32B3/266; B32B7/00; B32B7/02; B32B7/027; B32B7/04; B32B7/12; H; H10; H10W; H10W40/00; H10W40/20; H10W40/25; H10W40/251; B32B2250/00; B32B2250/42; B32B2262/00; B32B2262/10; B32B2262/106; B32B2307/00; B32B2307/30; B32B2307/302; Y; Y10; Y10S; Y10S428/00; Y10S428/902; Y10S428/922; Y10T; Y10T428/00; Y10T428/24; Y10T428/24058; Y10T428/24273; Y10T428/24322; Y10T428/29; Y10T428/2982; Y10T428/2991; Y10T428/2993; Y10T428/2996; Y10T428/30; Y10T428/31504; Y10T428/31678; Y10T428/31692; Y10T442/00; Y10T442/30; Y10T442/3382; Y10T442/3415; Y10T442/3423; Y10T442/60; Y10T442/654; Y10T442/656
Claims Analysis
Total Claims: 66
Claim 1
Independent Claim
27 words
A heat conducting laminate comprising at least one layer of metal and at least one layer of polymer matrix composite material having low-thermal-expansion reinforcing material embedded therein.
Claim 2
Dependent Claim
27 words
A heat conducting laminate comprising at least one layer of metal and at least one layer of polymer matrix composite material having low-thermal-expansion reinforcing material embedded therein.
Claim 3
Dependent Claim
32 words
The heat conducting laminate of Claim 1 wherein the low-thermal-expansion reinforcing material is selected from the group consisting of inorganic fibers, inorganic whiskers, inorganic particles, organic fibers, organic whiskers and mixtures thereof.
Claim 4
Dependent Claim
23 words
The heat conducting laminate of Claim 2 wherein the reinforcing material has a unidirectional orientation throughout the layer of polymer matrix composite material.
Claim 5
Dependent Claim
22 words
The heat conducting laminate of Claim 2 wherein the reinforcing material is randomly distributed throughout the layer of polymer matrix composite material.
Claim 6
Dependent Claim
29 words
The heat conducting laminate of Claim 2 wherein the organic fibers or whiskers are selected from the group consisting of polyaramid fibers or whiskers and PBT fibers or whiskers.
Claim 7
Dependent Claim
21 words
The heat conducting laminate of Claim 1 wherein the fibers are in the form of a woven fabric or non-woven mat.
Claim 8
Dependent Claim
41 words
The heat conducting laminate of Claim 1 wherein the polymer matrix composite material having low-thermal-expansion reinforcing material embedded therein is an ordered polymer film, and the low-thermal-expansion reinforcing material is oriented portions of the polymer itself within the ordered polymer film.
Claim 9
Dependent Claim
22 words
The heat conducting laminate of Claim 7 wherein the ordered polymer film is selected from the group consisting of polyaramid and PBT.
Claim 10
Dependent Claim
42 words
The heat conducting laminate of Claim 1 wherein the low-thermal-expansion reinforcing material is inorganic fibers selected from the group consisting of carbon, graphite, boron, alumina, silicon carbide, boron carbide, boria, boron nitride, silica, titanium diboride, beryllium, quartz, alumina-boria silica and mixtures thereof.
Claim 11
Dependent Claim
46 words
The heat conducting laminate of Claim 1 wherein the low-thermal-expansion reinforcing material is inorganic whiskers selected from the group consisting of carbon, graphite, boron, alumina, silicon carbide, boron carbide, boria, boron nitride, silica, titanium diboride, beryllium, quartz, alumina-boria silica, silicon nitride, nickel aluminide and mixtures thereof.
Claim 12
Dependent Claim
69 words
The heat conducting laminate of Claim 1 wherein the low-thermal-expansion reinforcing material is inorganic particles selected from the group consisting of carbon, graphite, boron, alumina, silicon carbide, boron carbide, boria, boron nitride, silica, titanium diboride, beryllium, quartz, alumina-boria silica, nickel aluminide, silicon nitride, beryllium oxide, aluminum nitride, titanium carbide, aluminum dodecaboride, tungsten carbide, chromium carbide, molybdenum disilicide, hollow glass spheres, hollow quartz spheres, hollow graphite spheres and mixtures thereof.
Claim 13
Dependent Claim
28 words
The heat conducting laminate of Claim 1 wherein the coefficient of thermal expansion of the reinforcing material is less than the coefficient of thermal expansion of the metal.
Claim 14
Dependent Claim
38 words
The heat conducting laminate of Claim 1 wherein the coefficient of thermal expansion of the layer of polymer matrix composite material having low-thermal-expansion reinforcing material embedded therein is less than the coefficient of thermal expansion of the metal.
Claim 15
Dependent Claim
15 words
The heat conducting laminate of Claim 1 wherein the low-thermal-expansion reinforcing material is thermally conductive.
Claim 16
Dependent Claim
31 words
The heat conducting laminate of Claim 14 wherein the thermally conductive, low-thermal-expansion reinforcing material is aligned in the polymer matrix composite material to direct heat in the direction of the alignment.
Claim 17
Dependent Claim
56 words
The heat conducting laminate of Claim 14 wherein the thermally conductive, low-thermal-expansion reinforcing material is particles, whiskers, fibers, fabrics, mats or any combination of particles, whiskers, fibers, fabrics or mats selected from the group consisting of carbon, graphite, boron, alumina, silicon carbide, titanium diboride, beryllium, nickel aluminide, aluminum nitride, aluminum dodecaboride, molybdenum disilicide and mixtures thereof.
Claim 18
Dependent Claim
87 words
A laminated heat conducting device comprising at least one layer of metal and at least one layer of a polymer matrix composite material adhered thereto, the polymer matrix composite material having low-thermal-expansion reinforcing material embedded therein, whereby the coefficient of thermal expansion and the thermal conductivity of the device are defined by the metal in combination with the polymer matrix material and the low-thermal-expansion reinforcing material, and the coefficient of thermal expansion of the laminated device is less than the coefficient of thermal expansion of the metal.
Claim 19
Dependent Claim
87 words
A laminated heat conducting device comprising at least one layer of metal and at least one layer of a polymer matrix composite material adhered thereto, the polymer matrix composite material having low-thermal-expansion reinforcing material embedded therein, whereby the coefficient of thermal expansion and the thermal conductivity of the device are defined by the metal in combination with the polymer matrix material and the low-thermal-expansion reinforcing material, and the coefficient of thermal expansion of the laminated device is less than the coefficient of thermal expansion of the metal.
Claim 20
Dependent Claim
18 words
The laminated heat conducting device of Claim 17 comprising alternating layers of metals and polymer matrix composite material.
Claim 21
Dependent Claim
19 words
The laminated heat conducting device of Claim 17 comprising a plurality of layers symmetrically disposed about a central plane.
Claim 22
Dependent Claim
27 words
The laminated heat conducting device of Claim 17 wherein the low-thermal-expansion reinforcing material in at least one layer of polymer matrix composite material has a unidirectional orientation.
Claim 23
Dependent Claim
27 words
The laminated heat conducting device of Claim 17 wherein the low-thermal-expansion reinforcing material in at least one layer of polymer matrix composite material is randomly distributed therein.
Claim 24
Dependent Claim
57 words
The laminated heat conducting device of Claim 17 having a plurality of polymer matrix composite material layers wherein the low-thermal-expansion reinforcing material of at least one of the polymer matrix composite material layers is aligned at an angle up to 90° relative to the low-thermal-expansion reinforcing material of at least one other polymer matrix composite material layer.
Claim 25
Dependent Claim
30 words
The laminated heat conducting device of Claim 22 wherein the low-thermal-expansion reinforcing material in one layer is in an orthogonal orientation relative to the low-thermal-expansion reinforcing material of another layer.
Claim 26
Dependent Claim
26 words
The laminated heat conducting device of Claim 17 wherein the low-thermal-expansion reinforcing material in at least one layer of polymer matrix composite material is thermally conducltive.
Claim 27
Dependent Claim
32 words
The laminated heat conducting device of Claim 24 wherein the thermally conductive, low-thermal-expansion reinforcing material is aligned in the polymer matrix composite material to direct heat in the direction of the alignment.
Claim 28
Dependent Claim
58 words
The laminated heat conducting device of Claim 24 wherein the thermally conductive, low-thermal-expansion reinforcing material is particles, whiskers, fibes, fabrics or any combination of particles, whiskers, fibers or fabrics selected from the group consisting of carbon, graphite, boron, alumina, silicon carbide, titanium diboride, beryllium, nickel aluminide, aluminum nitride, aluminum dodecarboride, molybdenum disilicide, hollow graphite spheres and mixtures thereof.
Claim 29
Dependent Claim
35 words
The laminated heat conducting device of Claim 17 having a plurality of polymer matrix composite material layers wherein at least two of the polymer matrix composite material layers have different low-thermal-expansion reinforcing materials embedded therein.
Claim 30
Dependent Claim
25 words
The laminated heat conducting device of Claim 17 having a plurality of metal layers wherein at least two of the metal layers are different metals.
Claim 31
Dependent Claim
30 words
The laminated heat conducting device of Claim 17 having a plurality of polymer matrix material layers wherein at least two of the polymer matrix composite material layers are different polymers.
Claim 32
Dependent Claim
26 words
The laminated heat conducting device of Claim 29 wherein at least two of the polymer matrix composite material layers have different low-thermal-expansion reinforcing materials embedded therein.
Claim 33
Dependent Claim
47 words
The laminated heat conducting device of Claim 17 having a plurality of metal layers and a plurality of polymer matrix composite material layers wherein at least two of themetal layers are different metals and at least two of the polymer matrix composite material layers are different polymers.
Claim 34
Dependent Claim
53 words
The laminated heat conducting device of Claim 17 wherein the low-thermal-expansion reinforcing material which in combination with the polymer matrix material and the metal modify the coefficient of thermal expansion of the device, is in a form or shape selected from the group consisting of fibers, whiskers, particles, fabrics, mats and mixtures thereof.
Claim 35
Dependent Claim
44 words
The laminated heat conducting device of Claim 17 wherein the low-thermal-expansion reinforcing material which in combination with the polymer matrix material and the metal modify the coefficient of thermal expansion of the device, is selected from the group consisting of polyaramid fibers and PBT.
Claim 36
Dependent Claim
63 words
The laminated heat conducting device of Claim 17 wherein the low-thermal-expansion reinforcing material which, in combination with the polymer matrix material and the metal modify the coefficient of thermal expansion of the device, is inorganic fibers selected from the group consisting of carbon, graphite, boron, alumina, silicon carbide, boron carbide, boria, boron nitride, silica, titanium diboride, beryllium, quartz, alumina-boria silica and mixtures thereof.
Claim 37
Dependent Claim
67 words
The laminated heat conducting device of Claim 17 wherein the low-thermal-expansion reinforcing material which in combination with the polymer matrix material and the metal modify the coefficient of thermal expansion of the device, is inorganic whiskers selected from the group consisting of carbon, graphite, boron, alumina, silicon carbide, boron carbide, boria, boron nitride, silica, titanium diboride, beryllium, quartz, alumina-boria silica, silicon nitride, nickel aluminide and mixtures thereof.
Claim 38
Dependent Claim
89 words
The laminated heat conducting device of Claim 17 wherein the low-thermal-expansion reinforcing material which, in combination with polymer matrix material and the metal modify the coefficient of thermal expansion of the device, is inorganic particles selected from the group consistingk of carbon, grapite, boron, alumina, silicon carbide, boron carbide, boria, boron nitride, silica, titanium diboride, beryllium, quartz, alumina-boria silica, nickel aluminide, silicon nitride, beryllium oxide, aluminum nitride, titanium carbide, aluminum dodecaboride, tungsten carbide, chromium carbide, molybdenum disilicide, hollow glass spheres, hollow quartz spheres, hollow graphite spheres and mixtures thereof.
Claim 39
Dependent Claim
25 words
The laminated heat conducting device of Claim 17 wherein at least one layer is perforated to promote bonding of the adjacent layers to each other.
Claim 40
Dependent Claim
20 words
An electronic component having a heat sink wherein the heat sink is the laminated heat conducting device of Claim 17.
Claim 41
Dependent Claim
20 words
An electronic component having a cold plate wherein the cold plate is the laminated heat conducting device of Claim 17.
Claim 42
Independent Claim
68 words
A method of controlling the coefficient of thermal expansion and thermal conductivity of a heat conducting device comprising bonding at least one layer of metal to at least one layer of polymer matrix composite material having low-thermal-expansion reinforcing material embedded therein whereby the coefficient of thermal expansion and thermal conductivity are defined by the metal in combination with the polymer matrix composite material and the low-thermal-expansion reinforcing material.
Claim 43
Independent Claim
68 words
A method of controlling the coefficient of thermal expansion and thermal conductivity of a heat conducting device comprising bonding at least one layer of metal to at least one layer of polymer matrix composite material having low-thermal-expansion reinforcing material embedded therein whereby the coefficient of thermal expansion and thermal conductivity are defined by the metal in combination with the polymer matrix composite material and the low-thermal-expansion reinforcing material.
Claim 44
Dependent Claim
26 words
The method of Claim 40 wherein the metal is bonded to pre-cured polymer matrix composite material having low-thermal-expansion reinforcing material embedded therein by an adhesive agent.
Claim 45
Dependent Claim
55 words
The method of Claim 40 wherein the metal is bonded to the polymer matrix composite material having low-thermal-expansion reinforcing material embedded therein by laminating the metal with un-cured polymer matrix composite material having low-thermal-expansion reinforcing material therein, and thereafter curing the polymer matrix composite material, thereby forming a bond between the polymer and the metal.
Claim 46
Dependent Claim
12 words
The method of Claim 42 wherein the un-cured polymer is a liquid.
Claim 47
Dependent Claim
47 words
The method of Claim 40 wherein the metal is bonded to the un-cured polymer matrix composite material having low-thermal-expansion reinforcing material embedded therein by an adhesive agent, and thereafter the polymer matrix composite material is cured, thereby forming an additional bond between the polymer and the metal.
Claim 48
Dependent Claim
12 words
The method of Claim 44 wherein the un-cured polymer is a liquid.
Claim 49
Dependent Claim
23 words
The method of Claim 40 comprising bonding alternating layers of metal and of polymer matrix composite material having low-thermal-expansion reinforcing material embedded therein.
Claim 50
Dependent Claim
36 words
The method of Claim 40 comprising bonding a plurality of layers of metal and of polymer matrix composite material having low-thermal-expansion reinforcing material embedded therein, the plurality of layers being symmetrically disposed about a central plane.
Claim 51
Dependent Claim
25 words
The method of Claim 40 further comprising providing a polymer matrix composite material having the low-thermal-expansion reinforcing material unidirectionally oriented within the polymer matrix material.
Claim 52
Dependent Claim
26 words
The method of Claim 40 further comprising providing in at least one layer a polymer matrix composite material having the low-thermal-expansion reinforcing material randomly distributed therein.
Claim 53
Dependent Claim
74 words
The method of Claim 40 further comprising providing at least two polymer matrix composite material layers having low-thermal-expansion reinforcing material embedded therein in a unidirectional orientation; placing at least one layer of the polymer matrix composite material in a position to align the reinforcing material embedded therein at an angle up to 90° relative to the low-thermal-expansion reinforcing material of at least one other layer of polymer matrix composite material; and bonding the layers.
Claim 54
Dependent Claim
27 words
The method of Claim 50 wherein the low-thermal-expansion reinforcing material of one layer is in an orthogonal orientation relative to the low-thermal-expansion reinforcing material of another layer.
Claim 55
Dependent Claim
23 words
The method of Claim 50 wherein the low-thermal-expansion reinforcing material in at least one layer of polymer matrix composite material is thermally conductive.
Claim 56
Dependent Claim
27 words
The method of Claim 52 comprising aligning the thermally conductive, low-thermal-expansion reinforcing material in the polymer matrix composite material to direct heat in the direction of alignment.
Claim 57
Dependent Claim
27 words
The method of Claim 40 wherein the low-thermal-expansion reinforcing material is in a form selected from the group consisting of fibers, whiskers, particles, fabrics and mixtures thereof.
Claim 58
Dependent Claim
22 words
The method of Claim 40 further comprising providing at least one perforated layer to promote bonding of adjacent layers to each other.
Claim 59
Independent Claim
159 words
A method of fabricating thermally conducting heat transfer devices for electronic components, the heat transfer devices having a coefficient of thermal expansion substantially matching the coefficient of thermal expansion of elements adjacent the heat transfer device in the electronics component, comprising: a) providing at least one metal or metal alloy sheet material; b) providing at least one layer of polymer matrix material having low-thermal-expansion reinforcing material embedded therein; c) varying the low-thermal-expansion reinforcing material in the polymer matrix material to modify the coefficient of thermal expansion of the polymer matrix material and the heat transfer device; and d) bonding the metal or metal alloy to the polymer matrix material having the low-thermal-expansion reinforcing material therein to form a laminate whereby the coefficient of thermal expansion of the polymer matrix material having the low-thermal-expansion reinforcing material embedded therein in combination with the metal in the heat transfer device substantially matches the coefficient of thermal expansion of the element adjacent thereto.
Claim 60
Independent Claim
159 words
A method of fabricating thermally conducting heat transfer devices for electronic components, the heat transfer devices having a coefficient of thermal expansion substantially matching the coefficient of thermal expansion of elements adjacent the heat transfer device in the electronics component, comprising: a) providing at least one metal or metal alloy sheet material; b) providing at least one layer of polymer matrix material having low-thermal-expansion reinforcing material embedded therein; c) varying the low-thermal-expansion reinforcing material in the polymer matrix material to modify the coefficient of thermal expansion of the polymer matrix material and the heat transfer device; and d) bonding the metal or metal alloy to the polymer matrix material having the low-thermal-expansion reinforcing material therein to form a laminate whereby the coefficient of thermal expansion of the polymer matrix material having the low-thermal-expansion reinforcing material embedded therein in combination with the metal in the heat transfer device substantially matches the coefficient of thermal expansion of the element adjacent thereto.
Claim 61
Dependent Claim
36 words
The method of Claim 56 wherein the low-thermal-expansion reinforcing material in the polymer matrix material is varied by selecting a form from the group consisting of fibers, whiskers, particles, non-woven mat, woven fabric and mixtures thereof.
Claim 62
Dependent Claim
40 words
The method of Claim 56 wherein the ratio of the amount of reinforcing material to the amount of polymer matrix material is varied to modify the coefficient of thermal expansion of the polymer matrix material and the heat transfer device.
Claim 63
Dependent Claim
32 words
The method of Claim 58 wherein the reinforcing material is about 0.01 volume percent to about 75 volume percent of the composite formed from the reinforcing material and the polymer matrix material.
Claim 64
Dependent Claim
98 words
The method of Claim 56 further comprising providing at least two polymer matrix composite material layers having low-thermal-expansion reinforcing material embedded therein in a unidirectional orientation; and placing at least one layer of the polymer matrix composite material in a position to align the reinforcing material embedded therein at an angle up to 90° relative to the low-thermal-expansion reinforcing material of at least one other layer of polymer matrix material, thereby varying the low-thermal-expansion reinforcing material in the polymer matrix material to modify the coefficient of thermal expansion of the polymer matrix material and the heat transfer device.
Claim 65
Dependent Claim
31 words
The method of Claim 56 further comprising varying the ratio of the polymer matrix composite material to the metal to modify the coefficient of thermal expansion of the heat transfer device.
Claim 66
Dependent Claim
26 words
The method of Claim 61 wherein the polymer matrix composite material comprises about 40 volume percent to about 60 volume percent of the heat transfer device.
References Cited (Backward Citations)
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