Semiconductor device, semiconductor integrated circuit device, and method of manufacturing same

Claim 2

A semiconductor integrated circuit device comprising: a plurality of semiconductor layers of one conductivity type formed on one major surface of a substrate to be insulated from each other; a MOS transistor formed on the semiconductor layer; and a memory capacitor formed in a first trench formed in the semiconductor layer beneath a gate electrode of the MOS transistor, the memory capacitor having a dielectric film formed inside the first trench, and a conductor surrounded with the dielectric film and held at a floating potential, wherein said semiconductor layers are insulated from each other by a second trench dug from the surface of the semiconductor layer toward the substrate and a second insulating film is formed in the second trench to cover the inner surface of the second trench, and a second conductor is buried inside the second trench having an inner surface covered with the second insulating film.

Claim 3

A semiconductor integrated circuit device according to claim 1 wherein the upper end of the first trench is opposed to the gate electrode of the MOS transistor through an insulating film, and the lower end of the first trench reaches the substrate.

Claim 4

A semiconductor integrated circuit device according to claim 1 wherein the memory capacitor further comprises a conductive region which is formed at both side-wall portions of the first trench through the dielectric film to be capacitively coupled with the conductor.

Claim 5

A semiconductor integrated circuit device according to claim 3 wherein the conductive region is formed by doping an impurity of a reverse conductivity type to the conductivity type of the semiconductor layer into said semiconductor layer.

Claim 6

A semiconductor integrated circuit device according to claim 1 wherein the semiconductor layers are formed almost parallel to each other in one direction to be insulated from each other on the substrate; and the MOS transistor and the memory capacitor are formed to be aligned in the semiconductor layer.

Claim 7

A semiconductor integrated circuit device according to claim 1 wherein the second trench has such a depth that the second trench reaches the substrate from the surface of the semiconductor layer.

Claim 8

A semiconductor integrated circuit device according to claim 1 wherein an insulator is also buried in the second trench.

Claim 9

A semiconductor integrated circuit device comprising: a semiconductor layer; a first trench formed in the semiconductor layer to extend in a first direction; a second trench formed in the semiconductor layer to extend in a second direction; a charge accumulation memory capacitor formed to comprise a dielectric film formed to cover the inner surface of the first trench and a first electrode layer buried inside the first trench having an inner surface covered with the dielectric film to be opposed to the semiconductor layer through the dielectric film at a side-wall portion of the first trench; an element separation field shield structure, for dividing the memory capacitors and the semiconductor layers into a plurality of blocks, formed to comprise an insulating film formed to cover the inner surface of the second trench and a second electrode layer buried inside the second trench having the inner surface covered with the insulating film; and a transistor, for controlling an operation of inputting/outputting charges into/from the memory capacitor located beneath the transistor, formed to comprise a gate structure formed above a memory capacitor in a divided block and a pair of first impurity regions formed in the semiconductor layer on both sides of the gate structure.

Claim 10

A semiconductor integrated circuit device comprising: a semiconductor layer; a first trench formed in the semiconductor layer to extend in a first direction; a second trench formed in the semiconductor layer to extend in a second direction; a charge accumulation memory capacitor formed to comprise a dielectric film formed to cover the inner surface of the first trench and a first electrode layer buried inside the first trench having an inner surface covered with the dielectric film to be opposed to the semiconductor layer through the dielectric film at a side-wall portion of the first trench; an element separation field shield structure, for dividing the memory capacitors and the semiconductor layers into a plurality of blocks, formed to comprise an insulating film formed to cover the inner surface of the second trench and a second electrode layer buried inside the second trench having the inner surface covered with the insulating film; and a transistor, for controlling an operation of inputting/outputting charges into/from the memory capacitor located beneath the transistor, formed to comprise a gate structure formed above a memory capacitor in a divided block and a pair of first impurity regions formed in the semiconductor layer on both sides of the gate structure.

Claim 11

A semiconductor integrated circuit device according to claim 8 further comprising a second impurity region formed in the semiconductor layer at side-wall portions on both sides of the first trench.

Claim 12

A semiconductor integrated circuit device according to claim 8 wherein the gate structure comprises a gate electrode and a gate insulating film, and an upper surface of the first electrode layer of the memory capacitor is coated with the gate insulating film.

Claim 13

A semiconductor integrated circuit device according to claim 8 wherein the semiconductor layer comprises a first semiconductor layer of a reverse conductivity type to a conductivity type of the first impurity region; and a second semiconductor layer formed on the first semiconductor layer, and the first trench and the second trench are formed in the second semiconductor layer such that the bottom portions of these trenches reach the first semiconductor layer.

Claim 14

A semiconductor integrated circuit device according to claim 11 wherein the plurality of memory capacitors and the plurality of transistors are formed in the second semiconductor layer divided by the field shield element separation structure along the second direction.

Claim 15

A semiconductor integrated circuit device according to claim 11 wherein the first semiconductor layer and the second semiconductor layer have a same conductivity type, and a concentration of an impurity contained in the first semiconductor layer is higher than a concentration of an impurity contained in the second semiconductor layer.

Claim 16

A semiconductor integrated circuit device according to claim 8 wherein the insulating film comprises a silicon nitride film.

Claim 17

A semiconductor integrated circuit device according to claim 8 wherein the insulating film comprises a three-layered structure comprising a silicon oxide film, a silicon nitride film, and a silicon oxide film.