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US6175145B1 Expired / Lapsed US ⏱️ 0.0 years remaining

Method of making a fuse in a semiconductor device and a semiconductor device having a fuse

Assignee: Samsung Electronics Co Ltd
•
Filing: 1998-09-30
•
Granted: 2001-01-16
•
Expires: 2018-09-30
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Abstract

Abstract The present invention provides a fuse of a semiconductor device and a method of forming a fuse of a semiconductor device. The method of the invention includes forming an underlying metal conductor on a semiconductor substrate, forming an insulating film over the underlying metal conductor, and selectively etching regions of the insulating film. One of the regions of the insulating film is etched to form a via contact region exposing the underlying metal conductor. A second region is etched to form a groove in the insulating film for the fuse metal. Metal is buried within the second etched region of the insulating film and the via contact region to respectively form a fuse metal pattern and a via contact metal layer. The fuse metal pattern can be formed from copper and/or tungsten.

Inventors

  • 👤 Dong-Hun Lee
  • 👤 Jong-Hyon Ahn

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-06 00:03
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40; H10W20/49; H10W20/493; H10W20/494

Claims Analysis

Total Claims: 4
Claim 1
Independent Claim 148 words
A semiconductor device having a fuse, comprising: an underlying metal conductor formed on a semiconductor substrate; an interlayer insulating film over said underlying metal conductor; an upper metal conductor layer over said interlayer insulating film; a selectively etched first region of said insulating film, said selectively etched first region forming a via hole extending between said underlying metal conductor and said upper metal conductor layer; a selectively etched second region of said insulating film, said second region being selectively etched to a predetermined depth; a single metal buried within the first and second regions, said buried metal forming a conductive metal via in the first region and a fuse metal in the second region of the same metal, said single metal being copper; wherein the fuse metal and the interlayer insulating film are planarized and chemically mechanically polished such that the fuse metal has a rectangular planar shape.
Claim 2
Dependent Claim 148 words
A semiconductor device having a fuse, comprising: an underlying metal conductor formed on a semiconductor substrate; an interlayer insulating film over said underlying metal conductor; an upper metal conductor layer over said interlayer insulating film; a selectively etched first region of said insulating film, said selectively etched first region forming a via hole extending between said underlying metal conductor and said upper metal conductor layer; a selectively etched second region of said insulating film, said second region being selectively etched to a predetermined depth; a single metal buried within the first and second regions, said buried metal forming a conductive metal via in the first region and a fuse metal in the second region of the same metal, said single metal being copper; wherein the fuse metal and the interlayer insulating film are planarized and chemically mechanically polished such that the fuse metal has a rectangular planar shape.
Claim 3
Dependent Claim 18 words
A semiconductor device having a fuse as claimed in claim 1 wherein said single metal further comprises tungsten.
Claim 4
Dependent Claim 21 words
A semiconductor device having a fuse as claimed in claim 1 wherein said selectively etched second region is 300-4000Å in depth.

References Cited (Backward Citations)

US4329706A Cited
US4547830A Cited
US4381595A Cited
US4873506A Cited
US5011791A Cited
US5627400A Cited
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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2004-01-16 2004-07-17 2005-01-16 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2008-01-16 2008-07-17 2009-01-16 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2012-01-16 2012-07-17 2013-01-16 $7700.00 Window Closed / Lapsed

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