US6163074A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit bonding pads including intermediate closed conductive layers having spaced apart insulating islands therein
Assignee: Samsung Electronics Co Ltd
•
Filing: 1999-09-01
•
Granted: 2000-12-19
•
Expires: 2019-09-01
Abstract
Abstract Bonding pads for integrated circuits include first and second spaced apart conductive layers, a third continuous conductive layer between the first and second spaced apart conductive layers and an array of spaced apart insulating islands in the third continuous conductive layer that extend therethrough such that sidewalls of the insulating islands are surrounded by the third continuous conductive layer. A fourth continuous conductive layer also may be provided between the third continuous conductive layer and the second conductive layer and a second array of spaced apart insulating islands may be provided in the fourth continuous conductive layer, that extend therethrough, such that sidewalls of the insulating islands are surrounded by the fourth continuous conductive layer. A fifth continuous conductive layer also may be provided between the third and fourth continuous conductive layers and a third array of spaced apart insulating islands may be provided in the fifth continuous conductive layer, that extend therethrough, such that sidewalls of the third array of insulating islands are surrounded by the fifth continuous conductive layer. The first and second arrays of spaced apart insulating islands preferably laterally overlap each other and may be congruent to each other. The third array of spaced apart insulating islands also may laterally overlap the first and second arrays. Preferably, the third array of spaced apart insulating islands are of the same shape as the first array, but of different sizes.
Inventors
- 👤 Soo-Cheol Lee
- 👤 Jong-Hyon Ahn
- 👤 Hyae-ryoung Lee
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 00:58
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/012; H10W72/071; H10W72/075; H10W72/20; H10W72/251; H10W72/29; H10W72/50; H10W72/531; H10W72/536; H10W72/541; H10W72/5449; H10W72/59; H10W72/90; H10W72/921; H10W72/923; H10W72/9232; H10W72/931; H10W72/932; H10W72/951; H10W72/952; H10W72/981; H10W72/983
Claims Analysis
Total Claims: 55
Claim 1
Independent Claim
93 words
An internal structure of a bonding pad for an integrated circuit having an array of bonding pads thereon, the internal structure of a bonding pad comprising: first and second spaced apart conductive layers; a third continuous conductive layer between the first and second spaced apart conductive layers and electrically connected to the first and second spaced apart conductive layers; and an array of spaced apart insulating islands in the third continuous conductive layer and extending therethrough such that sidewalls of the array of insulating islands are surrounded by the third continuous conductive layer.
Claim 2
Dependent Claim
93 words
An internal structure of a bonding pad for an integrated circuit having an array of bonding pads thereon, the internal structure of a bonding pad comprising: first and second spaced apart conductive layers; a third continuous conductive layer between the first and second spaced apart conductive layers and electrically connected to the first and second spaced apart conductive layers; and an array of spaced apart insulating islands in the third continuous conductive layer and extending therethrough such that sidewalls of the array of insulating islands are surrounded by the third continuous conductive layer.
Claim 3
Dependent Claim
96 words
A bonding pad according to claim 1 wherein the array of spaced apart insulating islands is a first array of spaced apart insulating islands, the bonding pad further comprising: a fourth continuous conductive layer between the third continuous conductive layer and the second conductive layer and electrically connected to the third continuous conductive layer and to the second conductive layer; and a second array of spaced apart insulating islands in the fourth continuous conductive layer and extending therethrough such that sidewalls of the second array of insulating islands are surrounded by the fourth continuous conductive layer.
Claim 4
Dependent Claim
21 words
A bonding pad according to claim 2 further comprising: a fifth conductive layer between the third and fourth continuous conductive layers.
Claim 5
Dependent Claim
58 words
A bonding pad according to claim 2 further comprising: a fifth continuous conductive layer between the third and fourth continuous conductive layers; and a third array of spaced apart insulating islands in the fifth continuous conductive layer and extending therethrough such that sidewalls of the third array of insulating islands are surrounded by the fifth continuous conductive layer.
Claim 6
Dependent Claim
22 words
A bonding pad according to claim 2 wherein the first and second arrays of spaced apart insulating islands laterally overlap each other.
Claim 7
Dependent Claim
23 words
A bonding pad according to claim 2 wherein the first and second arrays of spaced apart insulating islands are congruent to each other.
Claim 8
Dependent Claim
23 words
A bonding pad according to claim 5 wherein the first, second and third arrays of spaced apart insulating islands laterally overlap each other.
Claim 9
Dependent Claim
24 words
A bonding pad according to claim 7 wherein the first and second arrays of spaced apart insulating islands also are congruent to each other.
Claim 10
Dependent Claim
33 words
A bonding pad according to claim 8 wherein the third array of spaced apart insulating islands are of same shape as the first array of spaced apart insulating islands but of different sizes.
Claim 11
Dependent Claim
25 words
A bonding pad according to claim 1 wherein the first and second spaced apart conductive layers are first and second solid spaced apart conductive layers.
Claim 12
Dependent Claim
48 words
A bonding pad according to claim 1 wherein the third continuous conductive layer includes a peripheral portion and a central portion and wherein the array of spaced apart insulating islands in the third continuous conductive layer is located in the peripheral portion but not in the central portion.
Claim 13
Dependent Claim
22 words
A bonding pad according to claim 1 wherein the sidewalls of the insulating islands are cylindrical shaped, polygonal shaped or combinations thereof.
Claim 14
Dependent Claim
192 words
An internal structure of a bonding pad for an integrated circuit having an array of bonding pads thereon, the internal structure of a bonding pad comprising: an upper pad layer for attachment of a wire thereto; a lower pad layer for attachment to an integrated circuit; an intermediate pad layer between the upper pad layer and the lower pad layer, the upper pad layer, the intermediate pad layer and the lower pad layer being spaced apart from one another; a first continuous conductive plug between the upper and intermediate pad layers and electrically connected to the upper and intermediate pad layers; a first array of spaced apart first insulating islands in the first continuous conductive plug and extending therethrough Such that sidewalls of the first insulating islands are surrounded by the first continuous conductive plug; a second continuous conductive plug between the lower and intermediate pad layers and electrically connected to the lower and intermediate pad layers; and a second array of second spaced apart insulating islands in the second continuous conductive plug and extending therethrough such that sidewalls of the second insulating islands are surrounded by the second continuous conductive plug.
Claim 15
Dependent Claim
192 words
An internal structure of a bonding pad for an integrated circuit having an array of bonding pads thereon, the internal structure of a bonding pad comprising: an upper pad layer for attachment of a wire thereto; a lower pad layer for attachment to an integrated circuit; an intermediate pad layer between the upper pad layer and the lower pad layer, the upper pad layer, the intermediate pad layer and the lower pad layer being spaced apart from one another; a first continuous conductive plug between the upper and intermediate pad layers and electrically connected to the upper and intermediate pad layers; a first array of spaced apart first insulating islands in the first continuous conductive plug and extending therethrough Such that sidewalls of the first insulating islands are surrounded by the first continuous conductive plug; a second continuous conductive plug between the lower and intermediate pad layers and electrically connected to the lower and intermediate pad layers; and a second array of second spaced apart insulating islands in the second continuous conductive plug and extending therethrough such that sidewalls of the second insulating islands are surrounded by the second continuous conductive plug.
Claim 16
Dependent Claim
22 words
A bonding pad according to claim 13 wherein the first and second arrays of spaced apart insulating islands laterally overlap each other.
Claim 17
Dependent Claim
23 words
A bonding pad according to claim 14 wherein the first and second arrays of spaced apart insulating islands are congruent to each other.
Claim 18
Dependent Claim
41 words
A bonding pad according to claim 13 further comprising: a third array of spaced apart third insulating islands in the intermediate pad layer and extending therethrough such that sidewalls of the third insulating islands are surrounded by the intermediate pad layer.
Claim 19
Dependent Claim
23 words
A bonding pad according to claim 16 wherein the first, second and third arrays of spaced apart insulating islands laterally overlap each other.
Claim 20
Dependent Claim
24 words
A bonding pad according to claim 17 wherein the first and second arrays of spaced apart insulating islands also are congruent to each other.
Claim 21
Dependent Claim
33 words
A bonding pad according to claim 18 wherein the third array of spaced apart insulating islands are of same shape as the first array of spaced part insulating islands but of different sizes.
Claim 22
Dependent Claim
23 words
A bonding pad according to claim 13 wherein the upper, lower and intermediate pad layers are solid upper lower and intermediate pad layers.
Claim 23
Dependent Claim
60 words
A bonding pad according to claim 13 wherein the first and second continuous conductive plugs each includes a peripheral portion and a central portion and wherein the first and second arrays of spaced apart first and second insulating islands in the respective first and second continuous conductive plugs are located in the peripheral portions but not in the central portions.
Claim 24
Dependent Claim
25 words
A bonding pad according to claim 13 wherein the sidewalls of the first and second insulating islands are cylindrical shaped, polygonal shaped or combinations thereof.
Claim 25
Dependent Claim
119 words
An integrated circuit comprising: an integrated circuit substrate; and an array of bonding pads on the integrated circuit substrate, at least one of the bonding pads having an internal structure comprising: first and second spaced apart conductive layers, wherein the first conductive layer is adjacent the integrated circuit substrate and the second conductive layer is remote from the integrated circuit substrate; a third continuous conductive layer between the first and second spaced apart conductive layers and electrically connected to the first and second spaced apart conductive layers; and an array of spaced apart insulating islands in the third continuous conductive layer and extending therethrough such that sidewalls of the insulating islands are surrounded by the third continuous conductive layer.
Claim 26
Dependent Claim
119 words
An integrated circuit comprising: an integrated circuit substrate; and an array of bonding pads on the integrated circuit substrate, at least one of the bonding pads having an internal structure comprising: first and second spaced apart conductive layers, wherein the first conductive layer is adjacent the integrated circuit substrate and the second conductive layer is remote from the integrated circuit substrate; a third continuous conductive layer between the first and second spaced apart conductive layers and electrically connected to the first and second spaced apart conductive layers; and an array of spaced apart insulating islands in the third continuous conductive layer and extending therethrough such that sidewalls of the insulating islands are surrounded by the third continuous conductive layer.
Claim 27
Dependent Claim
96 words
An integrated circuit according to claim 23 wherein the array of spaced apart insulating islands is a first array of spaced apart insulating islands, the bonding pad further comprising: a fourth continuous conductive layer between the third continuous conductive layer and the second conductive layer and electrically connected to the third continuous conductive layer and to the second conductive layer; and a second array of spaced apart insulating islands in the fourth continuous conductive layer and extending therethrough such that sidewalls of the second array of insulating islands are surrounded by the fourth continuous conductive layer.
Claim 28
Dependent Claim
21 words
An integrated circuit according to claim 24 further comprising: a fifth conductive layer between the third and fourth continuous conductive layers.
Claim 29
Dependent Claim
58 words
An integrated circuit according to claim 24 further comprising: a fifth continuous conductive layer between the third and fourth continuous conductive layers; and a third array of spaced apart insulating islands in the fifth continuous conductive layer and extending therethrough such that sidewalls of the third array of insulating islands are surrounded by the fifth continuous conductive layer.
Claim 30
Dependent Claim
22 words
An integrated circuit according to claim 24 wherein the first and second arrays of spaced apart insulating islands laterally overlap each other.
Claim 31
Dependent Claim
23 words
An integrated circuit according to claim 24 wherein the first and second arrays of spaced apart insulating islands are congruent to each other.
Claim 32
Dependent Claim
23 words
An integrated circuit according to claim 26 wherein the first, second and third arrays of spaced apart insulating islands laterally overlap each other.
Claim 33
Dependent Claim
24 words
An integrated circuit according to claim 29 wherein the first and second arrays of spaced apart insulating islands also are congruent to each other.
Claim 34
Dependent Claim
33 words
An integrated circuit according to claim 30 wherein the third array of spaced apart insulating islands are of same shape as the first array of spaced part insulating islands but of different sizes.
Claim 35
Dependent Claim
25 words
An integrated circuit according to claim 23 wherein the first and second spaced apart conductive layers are first and second solid spaced apart conductive layers.
Claim 36
Dependent Claim
48 words
An integrated circuit according to claim 23 wherein the third continuous conductive layer includes a peripheral portion and a central portion and wherein the array of spaced apart insulating islands in the third continuous conductive layer is located in the peripheral portion but not in the central portion.
Claim 37
Dependent Claim
22 words
An integrated circuit according to claim 23 wherein the sidewalls of the insulating islands are cylindrical shaped, polygonal shaped or combinations thereof.
Claim 38
Dependent Claim
200 words
An integrated circuit comprising: an integrated circuit substrate; and an array of bonding pads on the integrated circuit substrate, at least one of the bonding pads having an internal structure comprising: an upper pad layer that is remote from the integrated circuit substrate; a lower pad layer that is adjacent the integrated circuit substrate; an intermediate pad layer between the upper pad layer and the lower pad layer, the upper pad layer, the intermediate pad layer and the lower pad layer being spaced apart from one another; a first continuous conductive plug between the upper and intermediate pad layers and electrically connected to the upper and intermediate pad layers; a first array of spaced apart first insulating islands in the first continuous conductive plug and extending therethrough such that sidewalls of the first insulating islands are surrounded by the first continuous conductive plug; a second continuous conductive plug between the lower and intermediate pad layers and electrically connected to the lower and intermediate pad layers; and a second array of second spaced apart insulating islands in the second continuous conductive plug and extending therethrough such that sidewalls of the second insulating islands are surrounded by the second continuous conductive plug.
Claim 39
Dependent Claim
200 words
An integrated circuit comprising: an integrated circuit substrate; and an array of bonding pads on the integrated circuit substrate, at least one of the bonding pads having an internal structure comprising: an upper pad layer that is remote from the integrated circuit substrate; a lower pad layer that is adjacent the integrated circuit substrate; an intermediate pad layer between the upper pad layer and the lower pad layer, the upper pad layer, the intermediate pad layer and the lower pad layer being spaced apart from one another; a first continuous conductive plug between the upper and intermediate pad layers and electrically connected to the upper and intermediate pad layers; a first array of spaced apart first insulating islands in the first continuous conductive plug and extending therethrough such that sidewalls of the first insulating islands are surrounded by the first continuous conductive plug; a second continuous conductive plug between the lower and intermediate pad layers and electrically connected to the lower and intermediate pad layers; and a second array of second spaced apart insulating islands in the second continuous conductive plug and extending therethrough such that sidewalls of the second insulating islands are surrounded by the second continuous conductive plug.
Claim 40
Dependent Claim
22 words
An integrated circuit according to claim 35 wherein the first and second arrays of spaced apart insulating islands laterally overlap each other.
Claim 41
Dependent Claim
23 words
An integrated circuit according to claim 36 wherein the first and second arrays of spaced apart insulating islands are congruent to each other.
Claim 42
Dependent Claim
41 words
An integrated circuit according to claim 35 further comprising: a third array of spaced apart third insulating islands in the intermediate pad layer and extending therethrough such that sidewalls of the third insulating islands are surrounded by the intermediate pad layer.
Claim 43
Dependent Claim
23 words
An integrated circuit according to claim 38 wherein the first, second and third arrays of spaced apart insulating islands laterally overlap each other.
Claim 44
Dependent Claim
24 words
An integrated circuit according to claim 39 wherein the first and second arrays of spaced apart insulating islands also are congruent to each other.
Claim 45
Dependent Claim
33 words
An integrated circuit according to claim 40 wherein the third array of spaced apart insulating islands is of same shape as the first array of spaced part insulating islands but of different size.
Claim 46
Dependent Claim
23 words
An integrated circuit according to claim 35 wherein the upper, lower and intermediate pad layers are solid upper, lower and intermediate pad layers.
Claim 47
Dependent Claim
60 words
An integrated circuit according to claim 35 wherein the first and second continuous conductive plugs each includes a peripheral portion and a central portion and wherein the first and second arrays of spaced apart first and second insulating islands in the respective first and second continuous conductive plugs are located in the peripheral portions but not in the central portions.
Claim 48
Dependent Claim
25 words
An integrated circuit according to claim 35 wherein the sidewalls of the first and second insulating islands are cylindrical shaped, polygonal shaped or combinations thereof.
Claim 49
Dependent Claim
88 words
An internal structure of a bonding pad for an integrated circuit having an array of bonding pads thereon, the internal structure of a bonding pad comprising: first and second spaced apart conductive layers; a third continuous conductive layer between the first and second spaced apart conductive layers and electrically connected to the first and second spaced apart conductive layers; and an insulating island in the third continuous conductive layer and extending therethrough such that the sidewall of the insulating island is surrounded by the third continuous conductive layer.
Claim 50
Dependent Claim
88 words
An internal structure of a bonding pad for an integrated circuit having an array of bonding pads thereon, the internal structure of a bonding pad comprising: first and second spaced apart conductive layers; a third continuous conductive layer between the first and second spaced apart conductive layers and electrically connected to the first and second spaced apart conductive layers; and an insulating island in the third continuous conductive layer and extending therethrough such that the sidewall of the insulating island is surrounded by the third continuous conductive layer.
Claim 51
Dependent Claim
88 words
A bonding pad according to claim 45 wherein the insulating island is a first insulating island, the bonding pad further comprising: a fourth continuous conductive layer between the third continuous conductive layer and the second conductive layer and electrically connected to the third continuous conductive layer and to the second conductive layer; and at least a second insulating island in the fourth continuous conductive layer and extending therethrough such that the sidewall of the at least a second insulating island is surrounded by the fourth continuous conductive layer.
Claim 52
Dependent Claim
58 words
A bonding pad according to claim 46 further comprising: a fifth continuous conductive layer between the third and fourth continuous conductive layers; and at least a third insulating island in the fifth continuous conductive layer and extending therethrough such that the sidewall of the at least a third insulating island is surrounded by the fifth continuous conductive layer.
Claim 53
Dependent Claim
194 words
An internal structure of a bonding pad for an integrated circuit having an array of bonding pads thereon, the internal structure of a bonding pad comprising: an upper pad layer for attachment of a wire thereto; a lower pad layer for attachment to an integrated circuit; an intermediate pad layer between the upper pad layer and the lower pad layer, the upper pad layer, the intermediate pad layer and the lower pad layer being spaced apart from one another; a first continuous conductive plug between the upper and intermediate pad layers and electrically connected to the upper and intermediate pad layers; at least a first insulating island in the first continuous conductive plug and extending therethrough such that the sidewall of the at least a first insulating island is surrounded by the first continuous conductive plug; a second continuous conductive plug between the lower and intermediate pad layers and electrically connected to the lower and intermediate pad layers; and at least a second insulating island in the second continuous conductive plug and extending therethrough such that the sidewall of the at least a second insulating island is surrounded by the second continuous conductive plug.
Claim 54
Dependent Claim
194 words
An internal structure of a bonding pad for an integrated circuit having an array of bonding pads thereon, the internal structure of a bonding pad comprising: an upper pad layer for attachment of a wire thereto; a lower pad layer for attachment to an integrated circuit; an intermediate pad layer between the upper pad layer and the lower pad layer, the upper pad layer, the intermediate pad layer and the lower pad layer being spaced apart from one another; a first continuous conductive plug between the upper and intermediate pad layers and electrically connected to the upper and intermediate pad layers; at least a first insulating island in the first continuous conductive plug and extending therethrough such that the sidewall of the at least a first insulating island is surrounded by the first continuous conductive plug; a second continuous conductive plug between the lower and intermediate pad layers and electrically connected to the lower and intermediate pad layers; and at least a second insulating island in the second continuous conductive plug and extending therethrough such that the sidewall of the at least a second insulating island is surrounded by the second continuous conductive plug.
Claim 55
Dependent Claim
42 words
A bonding pad according to claim 48 further comprising: at least a third insulating island in the intermediate pad layer and extending therethrough such that the sidewall of the at least a third insulating island is surrounded by the intermediate pad layer.
References Cited (Backward Citations)
US5084752A
Cited
US5250843A
Cited
US5403777A
Cited
US5248903A
Cited
US5502337A
Cited
US5736791A
Cited
US5707894A
Cited
US5700735A
Cited
US6016000A
Cited
US6031293A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-12-19 | 2004-06-19 | 2004-12-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-12-19 | 2008-06-19 | 2008-12-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-12-19 | 2012-06-19 | 2012-12-19 | $7700.00 | Window Closed / Lapsed |