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US6152213A Expired / Lapsed US ⏱️ 0.0 years remaining

Cooling system for electronic packages

Assignee: Fujitsu Ltd
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Filing: 2000-01-06
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Granted: 2000-11-28
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Expires: 2020-01-06
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Abstract

Abstract A cooling system for various electronic packages used in electronic equipment such as electronic computers, work stations, word processors, etc. and, particularly, a cooling system capable of efficiently cooling various electronic packages and, particularly, highly dense electronic packages used in electronic equipment without greatly limiting the freedom for designing the electronic equipment as a whole. The cooling system includes a heat radiator (40, 40', 40") installed in at least one independent holding portion formed in advance in a housing (30) of the electronic equipment, a heat conducting plate element (36) provided for at least one electronic package in said housing so as to receive heat therefrom, and a heat conducting passage element (38) laid down to conduct heat from the heat conducting plate element to a heat radiator.

Inventors

  • 👤 Masahiro Suzuki

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-31 12:09
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/73; F; F28; F28D; F28D15/00; F28D15/02; F28D15/0241; F28D15/0266

Claims Analysis

Total Claims: 4
Claim 1
Independent Claim 132 words
A cooling system for electronic packages, said system comprising at least one independent heat radiator-holding portion formed in advance in a housing of an electronic equipment, a heat radiator installed in said heat radiator-holding portion, a plurality of heat conducting plate elements provided for a plurality of electronic packages arranged in said housing so as to receive heat therefrom, a plurality of first heat conducting passage elements which are connected at their ends on one side thereof to said heat conducting plate elements and are connected at their ends on the other side thereof to said heat radiator so that heat is conducted from said plurality of heat conducting plate elements to said heat radiator, and second heat conducting passage elements for connecting said plurality of heat-conducting plate elements to each other.
Claim 2
Dependent Claim 132 words
A cooling system for electronic packages, said system comprising at least one independent heat radiator-holding portion formed in advance in a housing of an electronic equipment, a heat radiator installed in said heat radiator-holding portion, a plurality of heat conducting plate elements provided for a plurality of electronic packages arranged in said housing so as to receive heat therefrom, a plurality of first heat conducting passage elements which are connected at their ends on one side thereof to said heat conducting plate elements and are connected at their ends on the other side thereof to said heat radiator so that heat is conducted from said plurality of heat conducting plate elements to said heat radiator, and second heat conducting passage elements for connecting said plurality of heat-conducting plate elements to each other.
Claim 3
Dependent Claim 21 words
A cooling system according to claim 1, wherein said first and second heat conducting passage elements are constituted as heat pipes.
Claim 4
Dependent Claim 19 words
A cooling system according to claim 2, wherein said heat pipe is at least partly formed as a bellows.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2003-11-28 2004-05-29 2004-11-28 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2007-11-28 2008-05-29 2008-11-28 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2011-11-28 2012-05-29 2012-11-28 $7700.00 Window Closed / Lapsed

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