Hybird cooling system for electronic components

Claim 2

An electrical apparatus comprising: a circuit board; a heat generating electronic component mounted on said circuit board, said electronic component having a maximum operating temperature, said electronic component having a substantially planar surface; and a heat sink composed of a thermally conductive material, said heat sink having: a first exterior surface mounted on and in thermal contact with said substantially planar surface of said electronic component; a second exterior surface opposite said first surface and comprising spaced apart heat dissipation members for thermal contact by a cooling gas; an internal cavity to conduct a flow of cooling liquid; said heat sink providing conductive paths from said electronic component to said cooling gas and said cooling liquid; means for containing and directing flow of said cooling liquid to and from said internal cavity of said heat sink sufficient to cool said electronic component to at least said maximum operating temperature; means for circulating said cooling gas over said spaced apart heat dissipation members of said heat sink; and said heat sink and said internal cavity being configured and dimensioned relative to the flow of said cooling gas for enabling said cooling gas, alone, to cool said electronic component at least to said maximum operating temperature.

Claim 3

An electrical apparatus according to claim 1, wherein said planar surface of said electronic component and said first exterior surface of said heat sink are rectangular surfaces having sides of approximately equal length.

Claim 4

An electronic device comprising: a heat generating electronic component having a maximum operating temperature, said electronic component mounted on a circuit board and having a substantially planar external surface spaced from said circuit board; a heat sink comprising thermally conductive material, said heat sink including: a first planar surface in thermal transfer contact with said substantially planar external surface of said electronic component whereby said electronic component is positioned between said heat sink and said circuit board; a second surface opposed to said first surface and incorporating a plurality of spaced apart heat transfer fins extending transversely of said first planar surface; and an internal fluid flow path; means for directing a forced flow of gaseous cooling fluid through said heat transfer fins effective to cool said electronic component below said maximum operating temperature; and means operable independently of said means for directing a forced flow of gaseous cooling fluid, for providing a flow of cooling liquid through said internal fluid flow path of said heat sink effective to cool said electronic component below said maximum operating temperature, said cooling liquid having a boiling point significantly higher than said maximum operating temperature.

Claim 5

An electronic device comprising: a heat generating electronic component having a maximum operating temperature, said electronic component mounted on a circuit board and having a substantially planar external surface spaced from said circuit board; a heat sink comprising thermally conductive material, said heat sink including: a first planar surface in thermal transfer contact with said substantially planar external surface of said electronic component whereby said electronic component is positioned between said heat sink and said circuit board; a second surface opposed to said first surface and incorporating a plurality of spaced apart heat transfer fins extending transversely of said first planar surface; and an internal fluid flow path; means for directing a forced flow of gaseous cooling fluid through said heat transfer fins effective to cool said electronic component below said maximum operating temperature; and means operable independently of said means for directing a forced flow of gaseous cooling fluid, for providing a flow of cooling liquid through said internal fluid flow path of said heat sink effective to cool said electronic component below said maximum operating temperature, said cooling liquid having a boiling point significantly higher than said maximum operating temperature.

Claim 6

An electronic device according to claim 3, wherein said means for directing a flow of cooling fluid comprises an air circulator.

Claim 7

An electronic device according to claim 3, wherein said maximum operating temperature is about 125° C.

Claim 8

An electronic device according to claim 3, wherein said fins are parallel, spaced apart fins.

Claim 9

An electronic device according to claim 3, wherein said internal fluid flow path is a serpentine path.

Claim 10

An electronic apparatus comprising: a plurality of heat generating electronic components mounted on a common circuit board, each said electronic component having individual maximum operating temperatures, said electronic component having a substantially planar external surface; for each said electronic component, an individual heat sink comprising thermally conductive material, each said heat sink including: a first planar surface in thermal transfer contact with said substantially planar external surface of a respective one of said electronic components whereby said electronic component is located between said heat sink and said circuit board; a second surface opposed to said first surface and incorporating a plurality of spaced apart heat transfer fins extending transversely of said first planar surface; at least one of said individual heat sinks further including an internal fluid flow path, said at least one heat sink having a first planar surface in thermal transfer contact with one of said electronic components operable to generate more heat than other ones of said electronic components; means for directing a forced flow of gaseous cooling fluid through said heat transfer fins of all of said heat sinks effective to cool each said electronic component below its said maximum operating temperature; and means operable independently of said means for directing a flow of gaseous cooling fluid, for providing a flow of cooling liquid through said internal fluid flow path of said at least one heat sink effective to cool said electronic component generating more heat, below said maximum operating temperature, said cooling liquid having a boiling point significantly higher than said maximum operating temperature of said one electronic component.

Claim 11

An electronic apparatus comprising: a plurality of heat generating electronic components mounted on a common circuit board, each said electronic component having individual maximum operating temperatures, said electronic component having a substantially planar external surface; for each said electronic component, an individual heat sink comprising thermally conductive material, each said heat sink including: a first planar surface in thermal transfer contact with said substantially planar external surface of a respective one of said electronic components whereby said electronic component is located between said heat sink and said circuit board; a second surface opposed to said first surface and incorporating a plurality of spaced apart heat transfer fins extending transversely of said first planar surface; at least one of said individual heat sinks further including an internal fluid flow path, said at least one heat sink having a first planar surface in thermal transfer contact with one of said electronic components operable to generate more heat than other ones of said electronic components; means for directing a forced flow of gaseous cooling fluid through said heat transfer fins of all of said heat sinks effective to cool each said electronic component below its said maximum operating temperature; and means operable independently of said means for directing a flow of gaseous cooling fluid, for providing a flow of cooling liquid through said internal fluid flow path of said at least one heat sink effective to cool said electronic component generating more heat, below said maximum operating temperature, said cooling liquid having a boiling point significantly higher than said maximum operating temperature of said one electronic component.

Claim 12

An electrical apparatus according to claim 8, wherein said planar external surface of each said electronic component and said first planar surface of the respective heat sink in contact therewith are rectangular surfaces having sides of approximately equal length.

Claim 13

An electronic apparatus according to claim 8, wherein said means for directing a flow of gaseous cooling fluid comprises a plurality of air circulation fans.

Claim 14

An electronic apparatus according to claim 9, wherein said maximum operating temperature is about 125° C.

Claim 15

An electronic device comprising a heat generating electronic component mounted on a circuit board and having a substantially planar external surface spaced from said circuit board, said substantially planar external surface attached in thermal transfer contact to a substantially planar surface of a hybrid, block-shaped heat sink, said heat sink including an internal fluid flow path extending in a plane parallel to and over the area of said planar surface of said heat sink, said heat sink also including external, spaced apart heat dissipation members; said electronic component having a maximum operating temperature; a pump, operable to provide cooling liquid flow along said internal fluid flow path sufficient to cool said electronic component below said maximum operating temperature, said cooling liquid having a boiling point significantly higher than 125° C.; said electronic component having a maximum operating temperature not exceeding 125° C; and a circulator positioned to create gaseous cooling fluid flow over said heat dissipation members sufficient to cool said electronic component to a temperature below said maximum operating temperature, said circulator operable independently of said pump to effect said cooling of said electronic component even when said pump is not in operation.

Claim 16

An electronic device comprising a heat generating electronic component mounted on a circuit board and having a substantially planar external surface spaced from said circuit board, said substantially planar external surface attached in thermal transfer contact to a substantially planar surface of a hybrid, block-shaped heat sink, said heat sink including an internal fluid flow path extending in a plane parallel to and over the area of said planar surface of said heat sink, said heat sink also including external, spaced apart heat dissipation members; said electronic component having a maximum operating temperature; a pump, operable to provide cooling liquid flow along said internal fluid flow path sufficient to cool said electronic component below said maximum operating temperature, said cooling liquid having a boiling point significantly higher than 125° C.; said electronic component having a maximum operating temperature not exceeding 125° C; and a circulator positioned to create gaseous cooling fluid flow over said heat dissipation members sufficient to cool said electronic component to a temperature below said maximum operating temperature, said circulator operable independently of said pump to effect said cooling of said electronic component even when said pump is not in operation.