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US4635709A Expired / Lapsed US ⏱️ 0.0 years remaining

Dual mode heat exchanger

Assignee: United States Department of the Air Force
•
Filing: 1985-12-03
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Granted: 1987-01-13
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Expires: 2005-12-03
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Abstract

Abstract A dual mode heat exchanger 10 for cooling airborne electronics 12 through a cold plate 14. The heat exchanger either radiates heat to air through radiator fins 18 or absorbs heat by evaporative cooling. A liquid coolant contained in grooves 16 of the cold plate 14 boils at a preselected temperature and thereby absorbs heat energy. Vapor released by the boiling liquid is exhausted through a hydrophobic filter membrane 24.

Inventors

  • 👤 Frank E. Altoz

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-25 18:23
CPC Classifications
F; F28; F28D; F28D15/00; F28D15/02; F28D15/0233; F28F; F28F13/00; F28F13/18; H; H05; H05K; H05K7/00; H05K7/20; H05K7/20218; H05K7/20254; F28F2245/00; F28F2245/04; Y; Y10; Y10S; Y10S165/00; Y10S165/911; Y10S165/912

Claims Analysis

Total Claims: 15
Claim 1
Independent Claim 116 words
A device for cooling heat dissipating electronic components comprising: (a) a heat transfer plate thermally coupled to said electronic components for absorbing heat generated by said electronic components; (b) radiation fins thermally coupled to said heat transfer plate, for radiating heat absorbed by said heat transfer plate from said electronic components to a gaseous medium; (c) a liquid medium for evaporative cooling of said electronic components; and (d) a cavity formed to retain said liquid medium operably associated with said heat transfer plate; and (e) a selectively permeable membrane in contact with said liquid medium which retains said liquid medium within said cavity but permits vapor to leave said cavity in order to encourage evaporative cooling.
Claim 2
Independent Claim 116 words
A device for cooling heat dissipating electronic components comprising: (a) a heat transfer plate thermally coupled to said electronic components for absorbing heat generated by said electronic components; (b) radiation fins thermally coupled to said heat transfer plate, for radiating heat absorbed by said heat transfer plate from said electronic components to a gaseous medium; (c) a liquid medium for evaporative cooling of said electronic components; and (d) a cavity formed to retain said liquid medium operably associated with said heat transfer plate; and (e) a selectively permeable membrane in contact with said liquid medium which retains said liquid medium within said cavity but permits vapor to leave said cavity in order to encourage evaporative cooling.
Claim 3
Dependent Claim 22 words
The device defined in claim 1 further comprising a valve for controlling the passage of said gaseous medium past said radiation fins.
Claim 4
Dependent Claim 12 words
The device defined in claim 2 wherein said valve is thermostatically controlled.
Claim 5
Dependent Claim 12 words
The device defined in claim 1 wherein said liquid medium comprises water.
Claim 6
Dependent Claim 12 words
The device defined in claim 1 wherein said liquid medium comprises methanol.
Claim 7
Dependent Claim 26 words
The device defined in claim 1 wherein said cavity is fluidly connected to a liquid resevoir which serves to replenish the liquid medium in said cavity.
Claim 8
Dependent Claim 33 words
The device defined in claim 1 wherein said cavity comprises grooves formed on a face of said heat transfer plate, said grooves being fluidly connected with each other and said selectively permeable membrane.
Claim 9
Dependent Claim 20 words
The device defined in claim 1 wherein said device is mounted for exposure to an air stream surrounding an aircraft.
Claim 10
Dependent Claim 21 words
The device defined in claim 1 wherein said cavity is positioned adjacent to said heat transfer plate and said radiation fins.
Claim 11
Dependent Claim 97 words
A dual mode heat transfer device for cooling heat dissipating components comprising: (a) a cold plate for absorbing heat from and thereby cooling said heat dissipating components; (b) radiator fins for radiating heat conducted through said cold plate to an air flow adjacent to said radiator fins; (c) an aqueous coolant liquid disposed in grooves formed in said cold plate so that at elevated temperatures said coolant liquid is converted to vapor in order to cool said cold plate; and, (d) a hydrophobic membrane adjacent to said coolant liquid which allows vapor to vent from said grooves.
Claim 12
Dependent Claim 97 words
A dual mode heat transfer device for cooling heat dissipating components comprising: (a) a cold plate for absorbing heat from and thereby cooling said heat dissipating components; (b) radiator fins for radiating heat conducted through said cold plate to an air flow adjacent to said radiator fins; (c) an aqueous coolant liquid disposed in grooves formed in said cold plate so that at elevated temperatures said coolant liquid is converted to vapor in order to cool said cold plate; and, (d) a hydrophobic membrane adjacent to said coolant liquid which allows vapor to vent from said grooves.
Claim 13
Dependent Claim 16 words
The dual mode heat transfer device claimed in claim 10 wherein said coolant liquid comprises water.
Claim 14
Dependent Claim 16 words
The dual mode heat transfer device claimed in claim 10 wherein said coolant liquid comprises methanol.
Claim 15
Dependent Claim 21 words
The dual mode device of claim 10 further comprising an air valve for selectively stopping air flow across said radiator fins.

References Cited (Backward Citations)

SU273219A1 Cited
US3392781A Cited
US3390541A Cited
US3560778A Cited
US3664412A Cited
US3734168A Cited
US3776305A Cited
US4106557A Cited
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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1990-01-12 1990-07-14 1991-01-13 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1994-01-12 1994-07-14 1995-01-13 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1998-01-12 1998-07-14 1999-01-13 $7700.00 Window Closed / Lapsed

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