US6144560A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device including combed bond pad opening, assemblies and methods
Assignee: Micron Technology Inc
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Filing: 1999-12-16
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Granted: 2000-11-07
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Expires: 2019-12-16
Abstract
Abstract A semiconductor device including bond pads disposed proximate an edge thereof, and an overcoat layer. The overcoat layer defines notches around each of the bond pads. The overcoat layer may be formed from a photoimageable material such as a photoimageable epoxy. The invention also includes an alignment device that secures the semiconductor device perpendicularly upon a carrier substrate. The alignment device includes intermediate conductive elements which correspond to the bond pads of the semiconductor device. Upon insertion of the semiconductor device into the alignment device, the notches facilitate alignment of the bond pads with their corresponding intermediate conductive elements. The intermediate conductive elements establish an electrical connection between the semiconductor device and the carrier substrate.
Inventors
- 👤 Warren M. Farnworth
- 👤 Walter L. Moden
- 👤 Larry D. Kinsman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 10:22
CPC Classifications
H; H10; H10W; H10W78/00; H10W72/00
Claims Analysis
Total Claims: 37
Claim 1
Independent Claim
66 words
A semiconductor device mountable to a carrier substrate, comprising: an active surface including with at least one bond pad disposed proximate an edge thereof; and an overcoat layer covering at least a portion of said active surface adjacent to said edge, said overcoat layer having at least one notch formed therein so as to expose at least a portion of said at least one bond pad.
Claim 2
Dependent Claim
66 words
A semiconductor device mountable to a carrier substrate, comprising: an active surface including with at least one bond pad disposed proximate an edge thereof; and an overcoat layer covering at least a portion of said active surface adjacent to said edge, said overcoat layer having at least one notch formed therein so as to expose at least a portion of said at least one bond pad.
Claim 3
Dependent Claim
25 words
The semiconductor device of claim 1, wherein at least portion of said overcoat layer tapers toward said edge to define a bevel adjacent said edge.
Claim 4
Dependent Claim
17 words
The semiconductor device of claim 2, wherein said overcoat layer tapers at said at least one notch.
Claim 5
Dependent Claim
17 words
The semiconductor device of claim 2, wherein said overcoat layer covers substantially all of said active surface.
Claim 6
Dependent Claim
20 words
The semiconductor device of claim 2, wherein said at least one notch completely surrounds said at least one bond pad.
Claim 7
Dependent Claim
18 words
The semiconductor device of claim 2, wherein a plurality of bond pads are located on said active surface.
Claim 8
Dependent Claim
25 words
The semiconductor device of claim 6, wherein selected ones of said plurality of bond pads are disposed proximate a single edge of said semiconductor device.
Claim 9
Dependent Claim
25 words
The semiconductor device of claim 7, wherein said overcoat layer includes at least one tooth between adjacent bond pads of said plurality of bond pads.
Claim 10
Dependent Claim
57 words
A vertically mountable, substantially bare semiconductor device, comprising: an active surface with a plurality of bond pads disposed along an edge thereof; and a layer of dielectric material covering at least a portion of said active surface proximate said edge, selected ones of said plurality of bond pads being exposed through corresponding notches formed in said layer.
Claim 11
Dependent Claim
57 words
A vertically mountable, substantially bare semiconductor device, comprising: an active surface with a plurality of bond pads disposed along an edge thereof; and a layer of dielectric material covering at least a portion of said active surface proximate said edge, selected ones of said plurality of bond pads being exposed through corresponding notches formed in said layer.
Claim 12
Dependent Claim
21 words
The vertically mountable, substantially bare semiconductor device of claim 9, wherein said layer includes at least one tooth between adjacent notches.
Claim 13
Dependent Claim
26 words
The vertically mountable, substantially bare semiconductor device of claim 9, wherein at least a portion of said layer tapers toward said edge to form a bevel.
Claim 14
Dependent Claim
23 words
The vertically mountable, substantially bare semiconductor device of claim 9, wherein said layer of dielectric material tapers at selected ones of said notches.
Claim 15
Dependent Claim
23 words
The vertically mountable, substantially bare semiconductor device of claim 9, wherein said layer of dielectric material covers substantially all of said active surface.
Claim 16
Dependent Claim
22 words
The vertically mountable, substantially bare semiconductor device of claim 9, wherein said notches each completely surround at least one corresponding bond pad.
Claim 17
Dependent Claim
17 words
The vertically mountable, substantially bare semiconductor device of claim 9, wherein said dielectric material comprises a polymer.
Claim 18
Dependent Claim
18 words
The vertically mountable, substantially bare semiconductor device of claim 9, wherein said dielectric material comprises a photoimageable polymer.
Claim 19
Dependent Claim
94 words
An assembly for vertically mounting a semiconductor device relative to a carrier substrate, comprising: a semiconductor device including an active surface, a bottom edge, at least one bond pad disposed proximate said bottom edge, and a layer of dielectric material covering at least a portion of said active surface, said layer including at least one notch formed therein to expose at least a portion of said at least one bond pad therethrough; and an alignment device attachable to the carrier substrate and configured to receive at least the bottom edge of said semiconductor device.
Claim 20
Dependent Claim
94 words
An assembly for vertically mounting a semiconductor device relative to a carrier substrate, comprising: a semiconductor device including an active surface, a bottom edge, at least one bond pad disposed proximate said bottom edge, and a layer of dielectric material covering at least a portion of said active surface, said layer including at least one notch formed therein to expose at least a portion of said at least one bond pad therethrough; and an alignment device attachable to the carrier substrate and configured to receive at least the bottom edge of said semiconductor device.
Claim 21
Dependent Claim
18 words
The assembly of claim 17, wherein said layer of dielectric material tapers toward said at least one notch.
Claim 22
Dependent Claim
18 words
The assembly of claim 17, wherein said layer of dielectric material covers substantially all of said active surface.
Claim 23
Dependent Claim
20 words
The assembly of claim 17, wherein said layer of dielectric material completely laterally surrounds said at least one bond pad.
Claim 24
Dependent Claim
19 words
The assembly of claim 17, wherein said semiconductor device includes a plurality of bond pads on said active surface.
Claim 25
Dependent Claim
25 words
The assembly of claim 21, wherein selected ones of said plurality of said bond pads are disposed proximate a single edge of said semiconductor device.
Claim 26
Dependent Claim
21 words
The assembly of claim 22, wherein said layer of dielectric material includes at least one tooth located between adjacent bond pads.
Claim 27
Dependent Claim
12 words
The assembly of claim 17, wherein said dielectric material comprises a polymer.
Claim 28
Dependent Claim
13 words
The assembly of claim 17, wherein said dielectric material comprises a photoimageable polymer.
Claim 29
Dependent Claim
26 words
The assembly of claim 17, wherein said alignment device includes at least one receptacle configured to receive at least said bottom edge of said semiconductor device.
Claim 30
Dependent Claim
39 words
The assembly of claim 17, wherein said alignment device comprises at least one intermediate conductive element which, upon said alignment device receiving at least said bottom edge of said semiconductor device, resiliently abuts said at least one bond pad.
Claim 31
Dependent Claim
22 words
The assembly of claim 27, wherein said intermediate conductive element is configured to secure said semiconductor device relative to said alignment device.
Claim 32
Dependent Claim
105 words
A chip-on-board assembly, comprising: a semiconductor device with an active surface, a bottom edge, at least one bond pad disposed proximate said bottom edge, and a layer of dielectric material covering at least a portion of said active surface proximate said bottom edge, said layer including at least one notch at least partially surrounding said at least one bond pad and through which said at least one bond pad is at least partially exposed; and an alignment device including at least one receptacle configured to receive at least said bottom edge of said semiconductor device, said alignment device configured to be connected to a substrate.
Claim 33
Dependent Claim
105 words
A chip-on-board assembly, comprising: a semiconductor device with an active surface, a bottom edge, at least one bond pad disposed proximate said bottom edge, and a layer of dielectric material covering at least a portion of said active surface proximate said bottom edge, said layer including at least one notch at least partially surrounding said at least one bond pad and through which said at least one bond pad is at least partially exposed; and an alignment device including at least one receptacle configured to receive at least said bottom edge of said semiconductor device, said alignment device configured to be connected to a substrate.
Claim 34
Dependent Claim
57 words
The assembly of claim 29, wherein said alignment device comprises at least one intermediate conductive element corresponding to said at least one bond pad, said intermediate conductive element being configured to resiliently abut said at least one bond pad upon insertion of at least said bottom edge of said semiconductor device into said at least one receptacle.
Claim 35
Dependent Claim
29 words
The assembly of claim 29, wherein said alignment device, upon placement of said semiconductor device in said at least one receptacle, secures said semiconductor device relative to said substrate.
Claim 36
Dependent Claim
12 words
The assembly of claim 29, wherein said dielectric material comprises a polymer.
Claim 37
Dependent Claim
13 words
The assembly of claim 29, wherein said dielectric material comprises a photoimageable polymer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-11-07 | 2004-05-08 | 2004-11-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-11-07 | 2008-05-08 | 2008-11-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-11-07 | 2012-05-08 | 2012-11-07 | $7700.00 | Window Closed / Lapsed |