US5940277A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device including combed bond pad opening, assemblies and methods
Assignee: Micron Technology Inc
•
Filing: 1997-12-31
•
Granted: 1999-08-17
•
Expires: 2017-12-31
Abstract
Abstract A semiconductor device including bond pads disposed proximate an edge thereof, and an overcoat layer. The overcoat layer defines notches around each of the bond pads. The overcoat layer may be formed from a photoimageable material such as a photoimageable epoxy. The invention also includes an alignment device that secures the semiconductor device perpendicularly upon a carrier substrate. The alignment device includes intermediate conductive elements which correspond to the bond pads of the semiconductor device. Upon insertion of the semiconductor device into the alignment device, the notches facilitate alignment of the bond pads with their corresponding intermediate conductive elements. The intermediate conductive elements establish an electrical connection between the semiconductor device and the carrier substrate.
Inventors
- 👤 Warren M. Farnworth
- 👤 Walter L. Moden
- 👤 Larry D. Kinsman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 04:15
CPC Classifications
H; H10; H10W; H10W78/00; H10W72/00
Claims Analysis
Total Claims: 51
Claim 1
Independent Claim
61 words
A semiconductor device which is vertically mountable to a carrier substrate, comprising: an active surface including an edge and a bond pad disposed proximate said edge; and an overcoat layer disposed on said active surface adjacent to said edge, said overcoat layer defining a notch around said bond pad such that at least a portion of said bond pad is exposed.
Claim 2
Dependent Claim
61 words
A semiconductor device which is vertically mountable to a carrier substrate, comprising: an active surface including an edge and a bond pad disposed proximate said edge; and an overcoat layer disposed on said active surface adjacent to said edge, said overcoat layer defining a notch around said bond pad such that at least a portion of said bond pad is exposed.
Claim 3
Dependent Claim
21 words
The semiconductor device of claim 1, wherein said overcoat layer tapers toward said edge to define a bevel adjacent said edge.
Claim 4
Dependent Claim
20 words
The semiconductor device of claim 1, wherein said overcoat layer defines an outward taper on said notch proximate said edge.
Claim 5
Dependent Claim
17 words
The semiconductor device of claim 1, wherein said overcoat layer covers substantially all of said active surface.
Claim 6
Dependent Claim
14 words
The semiconductor device of claim 1, wherein said notch completely surrounds said bond pad.
Claim 7
Dependent Claim
16 words
The semiconductor device of claim 1, wherein said active surface includes a plurality of bond pads.
Claim 8
Dependent Claim
19 words
The semiconductor device of claim 6, wherein selected ones of said bond pads are disposed proximate a single edge.
Claim 9
Dependent Claim
17 words
The semiconductor device of claim 1, wherein said overcoat layer defines a tooth between adjacent bond pads.
Claim 10
Dependent Claim
17 words
The semiconductor device of claim 1, wherein said overcoat layer is at least about one mil thick.
Claim 11
Dependent Claim
52 words
A vertically mountable bare semiconductor device, comprising: an active surface including a plurality of bond pads disposed along an edge thereof; an overcoat layer disposed over said active surface proximate said edge; and a plurality of notches defined by said overcoat layer, each of said notches exposing one of said bond pads.
Claim 12
Dependent Claim
52 words
A vertically mountable bare semiconductor device, comprising: an active surface including a plurality of bond pads disposed along an edge thereof; an overcoat layer disposed over said active surface proximate said edge; and a plurality of notches defined by said overcoat layer, each of said notches exposing one of said bond pads.
Claim 13
Dependent Claim
23 words
The vertically mountable semiconductor device of claim 10, further comprising a tooth defined by said overcoat layer between each pair of adjacent notches.
Claim 14
Dependent Claim
23 words
The vertically mountable semiconductor device of claim 10, wherein said overcoat layer tapers toward said edge to define a bevel adjacent said edge.
Claim 15
Dependent Claim
25 words
The vertically mountable semiconductor device of claim 10, wherein said overcoat layer defines an outward taper on selected ones of said notches proximate said edge.
Claim 16
Dependent Claim
19 words
The vertically mountable semiconductor device of claim 10, wherein said overcoat layer covers substantially all of said active surface.
Claim 17
Dependent Claim
16 words
The vertically mountable semiconductor device of claim 10, wherein said notches completely surround said bond pads.
Claim 18
Dependent Claim
19 words
The vertically mountable semiconductor device of claim 10, wherein said overcoat layer is at least about 1 mil thick.
Claim 19
Dependent Claim
76 words
An assembly for vertically mounting a semiconductor device relative to a carrier substrate, comprising: a semiconductor device including an active surface, a bottom edge, a bond pad disposed proximate said bottom edge and an overcoat layer disposed on said active surface proximate said bottom edge, said overcoat layer defining a notch around said bond pad such that at least a portion of said bond pad is exposed; and an alignment device attachable to the carrier substrate.
Claim 20
Dependent Claim
76 words
An assembly for vertically mounting a semiconductor device relative to a carrier substrate, comprising: a semiconductor device including an active surface, a bottom edge, a bond pad disposed proximate said bottom edge and an overcoat layer disposed on said active surface proximate said bottom edge, said overcoat layer defining a notch around said bond pad such that at least a portion of said bond pad is exposed; and an alignment device attachable to the carrier substrate.
Claim 21
Dependent Claim
20 words
The assembly of claim 17, wherein said overcoat layer defines an outward taper on said notch proximate said bottom edge.
Claim 22
Dependent Claim
19 words
The assembly of claim 17, wherein said notch tapers outward proximate to said bottom edge of said semiconductor device.
Claim 23
Dependent Claim
20 words
The assembly of claim 17, wherein said overcoat layer covers substantially all of said active surface of said semiconductor device.
Claim 24
Dependent Claim
17 words
The assembly of claim 17, wherein said notch completely surrounds said bond pad of said semiconductor device.
Claim 25
Dependent Claim
19 words
The assembly of claim 17, wherein said active surface of said semiconductor device includes a plurality of bond pads.
Claim 26
Dependent Claim
22 words
The assembly of claim 22, wherein said plurality of said bond pads is disposed proximate a single edge of said semiconductor device.
Claim 27
Dependent Claim
20 words
The assembly of claim 23, wherein said overcoat layer of said semiconductor device defines a tooth between adjacent bond pads.
Claim 28
Dependent Claim
16 words
The assembly of claim 17, wherein said alignment device includes a body which defines a receptacle.
Claim 29
Dependent Claim
30 words
The assembly of claim 17, wherein said alignment device comprises an intermediate conductive element which, upon interconnection of said semiconductor device and said alignment device, resiliently engages said bond pad.
Claim 30
Dependent Claim
29 words
The assembly of claim 26, wherein said intermediate conductive element, upon interconnection of said semiconductor device and said alignment device, secures said semiconductor device relative to said alignment device.
Claim 31
Dependent Claim
16 words
The assembly of claim 17, wherein said overcoat layer is at least about 1 mil thick.
Claim 32
Dependent Claim
77 words
A chip-on-board assembly, comprising: a semiconductor device including an active surface, a bottom edge, a bond pad disposed proximate said bottom edge and an overcoat layer disposed on said active surface proximate said bottom edge, said overcoat layer defining a notch around said bond pad such that at least a portion of said bond pad is exposed; and an alignment device including a body which defines a receptacle, said alignment device being attachable to a carrier substrate.
Claim 33
Dependent Claim
77 words
A chip-on-board assembly, comprising: a semiconductor device including an active surface, a bottom edge, a bond pad disposed proximate said bottom edge and an overcoat layer disposed on said active surface proximate said bottom edge, said overcoat layer defining a notch around said bond pad such that at least a portion of said bond pad is exposed; and an alignment device including a body which defines a receptacle, said alignment device being attachable to a carrier substrate.
Claim 34
Dependent Claim
30 words
The assembly of claim 29, wherein said alignment device comprises an intermediate conductive element which, upon interconnection of said semiconductor device and said alignment device, resiliently engages said bond pad.
Claim 35
Dependent Claim
28 words
The assembly of claim 29, wherein said alignment device, upon interconnection of said semiconductor device and said alignment device, secures said semiconductor device relative to said alignment device.
Claim 36
Dependent Claim
60 words
A computer including a vertically mountable semiconductor device, the semiconductor device comprising: an active surface including an edge and a bond pad disposed proximate said edge; and an overcoat layer disposed on said active surface adjacent said edge, said overcoat layer defining a notch around said bond pad such that at least a portion of said bond pad is exposed.
Claim 37
Dependent Claim
60 words
A computer including a vertically mountable semiconductor device, the semiconductor device comprising: an active surface including an edge and a bond pad disposed proximate said edge; and an overcoat layer disposed on said active surface adjacent said edge, said overcoat layer defining a notch around said bond pad such that at least a portion of said bond pad is exposed.
Claim 38
Dependent Claim
17 words
The computer of claim 32, wherein said overcoat layer tapers toward said edge to define a bevel.
Claim 39
Dependent Claim
19 words
The computer of claim 32, wherein said overcoat layer defines an outward taper on said notch proximate said edge.
Claim 40
Dependent Claim
16 words
The computer of claim 32, wherein said overcoat layer covers substantially all of said active surface.
Claim 41
Dependent Claim
13 words
The computer of claim 32, wherein said notch completely surrounds said bond pad.
Claim 42
Dependent Claim
68 words
A computer comprising: a carrier substrate; an alignment device including a body defining a receptacle and an intermediate conductive element disposed within said receptacle, said alignment device being attached to said carrier substrate; and a semiconductor device including a bond pad disposed proximate an edge thereof and an overcoat layer defining a notch around said bond pad, said edge being disposed within said receptacle of said alignment device.
Claim 43
Dependent Claim
68 words
A computer comprising: a carrier substrate; an alignment device including a body defining a receptacle and an intermediate conductive element disposed within said receptacle, said alignment device being attached to said carrier substrate; and a semiconductor device including a bond pad disposed proximate an edge thereof and an overcoat layer defining a notch around said bond pad, said edge being disposed within said receptacle of said alignment device.
Claim 44
Dependent Claim
23 words
The computer of claim 37, wherein said intermediate conductive element of said alignment device abuts said bond pad and is operatively connected thereto.
Claim 45
Dependent Claim
19 words
The computer of claim 37, wherein said intermediate conductive element of said alignment device resiliently engages said semiconductor device.
Claim 46
Independent Claim
40 words
A method of packaging a semiconductor device, comprising: applying a layer of an overcoat material to the semiconductor device to form an overcoat layer; and defining a notch in said overcoat layer around a bond pad of the semiconductor device.
Claim 47
Independent Claim
40 words
A method of packaging a semiconductor device, comprising: applying a layer of an overcoat material to the semiconductor device to form an overcoat layer; and defining a notch in said overcoat layer around a bond pad of the semiconductor device.
Claim 48
Dependent Claim
13 words
The method of claim 40, wherein said overcoat material comprises a photoimageable material.
Claim 49
Dependent Claim
13 words
The method of claim 41, wherein said photoimageable material comprises a photoimageable epoxy.
Claim 50
Dependent Claim
18 words
The method of claim 42, wherein said photoimageable epoxy comprises a multi-functional glycidyl ether derivative of bisphenol-A novolac.
Claim 51
Dependent Claim
15 words
The method of claim 41, wherein said defining includes masking and irradiating the overcoat layer.
References Cited (Backward Citations)
US34794A
Cited
US3624587A
Cited
US4558912A
Cited
US4967262A
Cited
USRE34794E
Cited
US5555488A
Cited
US5444304A
Cited
US5352851A
Cited
US5708297A
Cited
US5450289A
Cited
US5451815A
Cited
US5635760A
Cited
US5593927A
Cited
US5592019A
Cited
US5417580A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-08-16 | 2003-02-15 | 2003-08-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-08-16 | 2007-02-15 | 2007-08-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-08-16 | 2011-02-15 | 2011-08-17 | $7700.00 | Window Closed / Lapsed |