US6121689A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor flip-chip package and method for the fabrication thereof
Assignee: Adeia Semiconductor Technologies LLC
•
Filing: 1998-07-21
•
Granted: 2000-09-19
•
Expires: 2018-07-21
Abstract
Abstract A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and pre-coated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction. With this configuration, the complaint solder/flexible encapsulant understructure absorbs the strain caused by the difference in the thermal coefficients of expansion between the chip and the substrate without bending the chip and substrate.
Inventors
- 👤 Miguel A. Capote
- 👤 Zhiming Zhou
- 👤 Xiaoqi Zhu
- 👤 Ligui Zhou
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 12:19
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/02; B23K35/0222; B23K35/0244; B23K35/025; B32; B32B; B32B7/00; B32B7/04; B32B7/12; B23K35/22; B23K35/36; B23K35/3612; B23K35/3613; B23K35/3618; C; C09; C09J; C09J4/00; H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W70/66; H10W70/666; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H10W74/40; H10W74/47; H05; H05K; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H05K1/095; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H10W70/65; H10W70/654; H10W70/655; H10W72/00; H10W72/01; H10W72/012; H10W72/01215; H10W72/01251; H10W72/01255; H10W72/01271; H10W72/013; H10W72/01331; H10W72/01336; H10W72/01351; H10W72/01353; H10W72/071; H10W72/072; H10W72/07211; H10W72/07231; H10W72/07234; H10W72/07236; H10W72/07251; H10W72/07254; H10W72/073; H10W72/07331; H10W72/07337; H10W72/07338; H10W72/20; H10W72/221; H10W72/227; H10W72/241; H10W72/242; H10W72/244; H10W72/251; H10W72/252; H10W72/29; H10W72/30; H10W72/321; H10W72/322; H10W72/325; H10W72/341; H10W72/345; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W72/355; H10W72/90; H10W72/941; H10W72/944; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734
Claims Analysis
Total Claims: 49
Claim 1
Independent Claim
87 words
An electrical component assembly, comprising: a substrate having a plurality of pads on a first surface thereof; an integrated circuit chip having an encapsulant coated on an active surface thereof, the encapsulant having a plurality of holes therethrough filled with an electrically conductive material that extends from contacts on the active surface aligned with the holes through the encapsulant to the plurality of pads on the substrate; and a layer of flux adhesive between a subassembly comprising the encapsulant and the electrically conductive material and the substrate.
Claim 2
Dependent Claim
87 words
An electrical component assembly, comprising: a substrate having a plurality of pads on a first surface thereof; an integrated circuit chip having an encapsulant coated on an active surface thereof, the encapsulant having a plurality of holes therethrough filled with an electrically conductive material that extends from contacts on the active surface aligned with the holes through the encapsulant to the plurality of pads on the substrate; and a layer of flux adhesive between a subassembly comprising the encapsulant and the electrically conductive material and the substrate.
Claim 3
Dependent Claim
19 words
The electrical component assembly of claim 1 wherein the electrically conductive material in the plurality of holes is solder.
Claim 4
Dependent Claim
36 words
The electrical component assembly of claim 1 wherein a first portion of the coated encapsulant and the electrically conductive material are located on the integrated circuit chip and a second portion is located on the substrate.
Claim 5
Dependent Claim
37 words
The electrical component assembly of claim 1 wherein a first portion of the coated encapsulant and the electrically conductive material are located on the integrated circuit chip and a second portion is coated on the first portion.
Claim 6
Dependent Claim
38 words
The electrical component assembly of claim 1 wherein the coated encapsulant includes a polymer layer that can be remelted after assembly of the electrical component assembly to allow removal of the integrated circuit chip for repair or replacement.
Claim 7
Dependent Claim
20 words
The electrical component assembly of claim 1 wherein the coated encapsulant includes a printed circuit layer having electrical circuitry thereon.
Claim 8
Dependent Claim
39 words
The electrical component assembly of claim 1 wherein the encapsulant and electrically conductive material are compliant so as to expand or contract laterally without cracking or delamination upon heating or cooling of the integrated circuit chip and the substrate.
Claim 9
Dependent Claim
18 words
The electrical component assembly of claim 3 wherein the first portion comprises a polymeric adhesive and a filler.
Claim 10
Dependent Claim
82 words
An electrical component assembly, comprising: a substrate having a plurality of pads on a first surface thereof; and an integrated circuit chip having an encapsulant coated on an active surface thereof, the encapsulant having a plurality of holes therethrough filled with an electrically conductive material that extends from contacts on the active surface aligned with the holes through the encapsulant to the plurality of pads on the substrate, wherein the electrically conductive material in the plurality of holes comprises electrically conductive adhesive.
Claim 11
Dependent Claim
82 words
An electrical component assembly, comprising: a substrate having a plurality of pads on a first surface thereof; and an integrated circuit chip having an encapsulant coated on an active surface thereof, the encapsulant having a plurality of holes therethrough filled with an electrically conductive material that extends from contacts on the active surface aligned with the holes through the encapsulant to the plurality of pads on the substrate, wherein the electrically conductive material in the plurality of holes comprises electrically conductive adhesive.
Claim 12
Dependent Claim
36 words
The electrical component assembly of claim 9 wherein a first portion of the coated encapsulant and the electrically conductive material are located on the integrated circuit chip and a second portion is located on the substrate.
Claim 13
Dependent Claim
37 words
The electrical component assembly of claim 9 wherein a first portion of the coated encapsulant and the electrically conductive material are located on the integrated circuit chip and a second portion is coated on the first portion.
Claim 14
Dependent Claim
38 words
The electrical component assembly of claim 9 wherein the coated encapsulant includes a polymer layer that can be remelted after assembly of the electrical component assembly to allow removal of the integrated circuit chip for repair or replacement.
Claim 15
Dependent Claim
20 words
The electrical component assembly of claim 9 wherein the coated encapsulant includes a printed circuit layer having electrical circuitry thereon.
Claim 16
Dependent Claim
18 words
The electrical component assembly of claim 10 wherein the first portion comprises a polymeric adhesive and a filler.
Claim 17
Dependent Claim
119 words
An electrical component assembly, comprising: a substrate having a plurality of pads on a first surface thereof; and an integrated circuit chip having an encapsulant coated on an active surface thereof, the encapsulant having a plurality of holes therethrough filled with an electrically conductive material that extends from contacts on the active surface aligned with the holes through the encapsulant to the plurality of pads on the substrate, wherein a first portion of the coated encapsulant and the electrically conductive material are located on the integrated circuit chip and a second portion is located on the substrate, the first portion comprises a polymeric adhesive and a filler and the second portion is an adhesive material with solder fluxing properties.
Claim 18
Dependent Claim
119 words
An electrical component assembly, comprising: a substrate having a plurality of pads on a first surface thereof; and an integrated circuit chip having an encapsulant coated on an active surface thereof, the encapsulant having a plurality of holes therethrough filled with an electrically conductive material that extends from contacts on the active surface aligned with the holes through the encapsulant to the plurality of pads on the substrate, wherein a first portion of the coated encapsulant and the electrically conductive material are located on the integrated circuit chip and a second portion is located on the substrate, the first portion comprises a polymeric adhesive and a filler and the second portion is an adhesive material with solder fluxing properties.
Claim 19
Dependent Claim
19 words
The electrical component assembly of claim 15 wherein the electrically conductive material in the plurality of holes is solder.
Claim 20
Dependent Claim
21 words
The electrical component assembly of claim 15 wherein the electrically conductive material in the plurality of holes comprises electrically conductive adhesive.
Claim 21
Dependent Claim
37 words
The electrical component assembly of claim 15 wherein a first portion of the coated encapsulant and the electrically conductive material are located on the integrated circuit chip and a second portion is coated on the first portion.
Claim 22
Dependent Claim
38 words
The electrical component assembly of claim 15 wherein the coated encapsulant includes a polymer layer that can be remelted after assembly of the electrical component assembly to allow removal of the integrated circuit chip for repair or replacement.
Claim 23
Dependent Claim
20 words
The electrical component assembly of claim 15 wherein the coated encapsulant includes a printed circuit layer having electrical circuitry thereon.
Claim 24
Dependent Claim
82 words
An electrical component assembly, comprising: a substrate having a plurality of pads on a first surface thereof; and an integrated circuit chip having an encapsulant coated on an active surface thereof, the encapsulant having a plurality of holes therethrough filled with an electrically conductive material that extends from contacts on the active surface aligned with the holes through the encapsulant to the plurality of pads on the substrate, and wherein the coated encapsulant includes a printed circuit layer having electrical circuitry thereon.
Claim 25
Dependent Claim
82 words
An electrical component assembly, comprising: a substrate having a plurality of pads on a first surface thereof; and an integrated circuit chip having an encapsulant coated on an active surface thereof, the encapsulant having a plurality of holes therethrough filled with an electrically conductive material that extends from contacts on the active surface aligned with the holes through the encapsulant to the plurality of pads on the substrate, and wherein the coated encapsulant includes a printed circuit layer having electrical circuitry thereon.
Claim 26
Dependent Claim
19 words
The electrical component assembly of claim 21 wherein the electrically conductive material in the plurality of holes is solder.
Claim 27
Dependent Claim
28 words
The electrical component assembly of claim 21 further comprising a layer of flux adhesive between a subassembly comprising the encapsulant and the electrically conductive material and the substrate.
Claim 28
Dependent Claim
21 words
The electrical component assembly of claim 21 wherein the electrically conductive material in the plurality of holes comprises electrically conductive adhesive.
Claim 29
Dependent Claim
36 words
The electrical component assembly of claim 21 wherein a first portion of the coated encapsulant and the electrically conductive material are located on the integrated circuit chip and a second portion is located on the substrate.
Claim 30
Dependent Claim
37 words
The electrical component assembly of claim 21 wherein a first portion of the coated encapsulant and the electrically conductive material are located on the integrated circuit chip and a second portion is coated on the first portion.
Claim 31
Dependent Claim
38 words
The electrical component assembly of claim 21 wherein the coated encapsulant includes a polymer layer that can be remelted after assembly of the electrical component assembly to allow removal of the integrated circuit chip for repair or replacement.
Claim 32
Dependent Claim
18 words
The electrical component assembly of claim 1 wherein the first portion comprises a polymeric adhesive and a filler.
Claim 33
Dependent Claim
19 words
The electrical component assembly of claim 28 wherein the second portion is an adhesive material with solder fluxing properties.
Claim 34
Dependent Claim
121 words
An electrical component assembly, comprising: an integrated circuit chip having a plurality of pads on an active surface thereof; and a substrate having an encapsulant coated on a first surface thereof, the encapsulant having a plurality of holes therethrough filled with an electrically conductive material that extends from contacts on the first surface aligned with the holes through the encapsulant to the plurality of pads on the integrated circuit chip, wherein a first portion of the coated encapsulant and the electrically conductive material are located on the substrate and a second portion is located on the integrated circuit chip, the first portion comprises a polymeric adhesive and a filler and the second portion is an adhesive material with solder fluxing properties.
Claim 35
Dependent Claim
121 words
An electrical component assembly, comprising: an integrated circuit chip having a plurality of pads on an active surface thereof; and a substrate having an encapsulant coated on a first surface thereof, the encapsulant having a plurality of holes therethrough filled with an electrically conductive material that extends from contacts on the first surface aligned with the holes through the encapsulant to the plurality of pads on the integrated circuit chip, wherein a first portion of the coated encapsulant and the electrically conductive material are located on the substrate and a second portion is located on the integrated circuit chip, the first portion comprises a polymeric adhesive and a filler and the second portion is an adhesive material with solder fluxing properties.
Claim 36
Dependent Claim
19 words
The electrical component assembly of claim 30 wherein the electrically conductive material in the plurality of holes is solder.
Claim 37
Dependent Claim
21 words
The electrical component assembly of claim 30 wherein the electrically conductive material in the plurality of holes comprises electrically conductive adhesive.
Claim 38
Dependent Claim
35 words
The electrical component assembly of claim 30 wherein a first portion of the coated encapsulant and the electrically conductive material are located on the substrate and a second portion is coated on the first portion.
Claim 39
Dependent Claim
38 words
The electrical component assembly of claim 30 wherein the coated encapsulant includes a polymer layer that can be remelted after assembly of the electrical component assembly to allow removal of the integrated circuit chip for repair or replacement.
Claim 40
Dependent Claim
20 words
The electrical component assembly of claim 30 wherein the coated encapsulant includes a printed circuit layer having electrical circuitry thereon.
Claim 41
Dependent Claim
83 words
An electrical component assembly, comprising: an integrated circuit chip having a plurality of pads on an active surface thereof; and a substrate having an encapsulant coated on a first surface thereof, the encapsulant having a plurality of holes therethrough filled with an electrically conductive material that extends from contacts on the first surface aligned with the holes through the encapsulant to the plurality of pads on the integrated circuit chip, wherein the coated encapsulant includes a printed circuit layer having electrical circuitry thereon.
Claim 42
Dependent Claim
83 words
An electrical component assembly, comprising: an integrated circuit chip having a plurality of pads on an active surface thereof; and a substrate having an encapsulant coated on a first surface thereof, the encapsulant having a plurality of holes therethrough filled with an electrically conductive material that extends from contacts on the first surface aligned with the holes through the encapsulant to the plurality of pads on the integrated circuit chip, wherein the coated encapsulant includes a printed circuit layer having electrical circuitry thereon.
Claim 43
Dependent Claim
19 words
The electrical component assembly of claim 36 wherein the electrically conductive material in the plurality of holes is solder.
Claim 44
Dependent Claim
30 words
The electrical component assembly of claim 36 further comprising a layer of flux adhesive between a subassembly comprising the encapsulant and the electrically conductive material and the integrated circuit chip.
Claim 45
Dependent Claim
21 words
The electrical component assembly of claim 36 wherein the electrically conductive material in the plurality of holes comprises electrically conductive adhesive.
Claim 46
Dependent Claim
36 words
The electrical component assembly of claim 36 wherein a first portion of the coated encapsulant and the electrically conductive material are located on the substrate and a second portion is located on the integrated circuit chip.
Claim 47
Dependent Claim
35 words
The electrical component assembly of claim 36 wherein a first portion of the coated encapsulant and the electrically conductive material are located on the substrate and a second portion is coated on the first portion.
Claim 48
Dependent Claim
38 words
The electrical component assembly of claim 36 wherein the coated encapsulant includes a polymer layer that can be remelted after assembly of the electrical component assembly to allow removal of the integrated circuit chip for repair or replacement.
Claim 49
Dependent Claim
18 words
The electrical component assembly of claim 40 wherein the first portion comprises a polymeric adhesive and a filler.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-09-19 | 2004-03-20 | 2004-09-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-09-19 | 2008-03-20 | 2008-09-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-09-19 | 2012-03-20 | 2012-09-19 | $7700.00 | Window Closed / Lapsed |