US5751068A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Tape with solder forms for semiconductor devices
Assignee: Intel Corp
•
Filing: 1997-04-23
•
Granted: 1998-05-12
•
Expires: 2017-04-23
Abstract
Abstract An electronic component with insulative tape-held solder forms is disclosed. Electronic components may be any of the integrated circuit chips, chip packages and printed circuit boards. The solder forms are coupled to conductive pads of the electronic component through through-holes in the insulative tape. The solder forms may be shaped as balls, cylinders, polygonal boxes, barrels, or hour-glasses. The insulative tape is thermally conductive and heat resistant. The tape may be made of an organic material such as an elastomer. The tape may further have impregnated materials such as ceramic, aluminum nitride, or solder flux to improve its thermal, mechanical, and/or electrical properties.
Inventors
- 👤 Jack McMahon
- 👤 George Chiu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 16:10
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/20; B; B23; B23K; B23K3/00; B23K3/06; B23K3/0607; B23K3/0623; B23K3/0646; B23K3/0692; B23K35/00; B23K35/02; B23K35/0222; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H05K3/3465; H05K3/3478; H10P; H10P72/00; H10P72/70; H10P72/74; H10W70/00; H10W70/099; B23K2101/00; B23K2101/36; B23K2101/40; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/10378; H05K2201/10424; H05K2201/10613; H05K2201/10954; H05K2201/10977; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0113; H05K2203/0147; H05K2203/0156; H05K2203/03; H05K2203/0338; H05K2203/04; H05K2203/041; H05K3/303; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W72/01; H10W72/012; H10W72/01204; H10W72/01208; H10W72/01212; H10W72/01221; H10W72/01225; H10W72/013; H10W72/01331; H10W72/01336; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/251; H10W90/00; H10W90/701; H10W90/751; H10W90/754; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
62 words
An integrated circuit package assembly, comprising: an integrated circuit package that has a surface pads; a tape; a solder pre-form located on said tape; and, an adhesive that is located between said tape and said solder pre-form, and attaches said solder pre-form to said tape and allows said solder pre-form to be attached to said surface pad of said integrated circuit package.
Claim 2
Dependent Claim
62 words
An integrated circuit package assembly, comprising: an integrated circuit package that has a surface pads; a tape; a solder pre-form located on said tape; and, an adhesive that is located between said tape and said solder pre-form, and attaches said solder pre-form to said tape and allows said solder pre-form to be attached to said surface pad of said integrated circuit package.
Claim 3
Dependent Claim
18 words
The assembly as recited in claim 1, wherein said tape has a hole that receives said solder pre-form.
Claim 4
Dependent Claim
15 words
The assembly as recited in claim 1, wherein said solder pre-form has a spherical shape.
Claim 5
Dependent Claim
15 words
The assembly as recited in claim 1, wherein said solder pre-form has a rectangular shape.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-05-11 | 2001-11-10 | 2002-05-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-05-11 | 2005-11-10 | 2006-05-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-05-11 | 2009-11-10 | 2010-05-12 | $7700.00 | Window Closed / Lapsed |