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US6093637A
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Method of making a multi-layer interconnection structure
Assignee: NEC Electronics Corp
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Filing: 1997-10-08
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Granted: 2000-07-25
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Expires: 2017-10-08
Abstract
Abstract A multi-layer interconnection structure in a semiconductor device has a interlevel dielectric layer of three SiO 2 films. The first SiO 2 film has a small thickness not lower than 25 nm and is formed by a dual-frequency plasma enhanced CVD process using alkoxysilane as a reactive gas. The second SiO 2 film has a large thickness ranging between 300 and 800 nm and is formed on the first SiO 2 film by an atmospheric pressure CVD process using a mixture of alkoxysilane and ozone as a reactive gas. The third SiO 2 film has a thickness of 50 nm and is flattened by an etch-back process of the same together with an overlying sacrificial spin-on glass film. A second layer interconnect pattern is formed on or above the flattened third SiO 2 film with an excellent reliability.
Inventors
- 👤 Koji Kishimoto
- 👤 Yoshiaki Yamada
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 13:53
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/60; H10P14/66; H10P14/662; H10P14/63; H10P14/6326; H10P14/6328; H10P14/6334; H10P14/6342; H10P14/668; H10P14/6681; H10P14/6684; H10P14/6686; H10W; H10W20/00; H10W20/01; H10W20/071; H10W20/093; H10W20/097; H10W20/098; H10W20/40; H10W20/45; H10W20/48; H10P14/6336; H10P14/6682; H10P14/69; H10P14/692; H10P14/6921; H10P14/69215; H10P14/6922; H10P95/00; H10P95/06; H10P95/062; H10P95/064
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
148 words
A method for forming a semiconductor device of a multi-layer interconnection structure comprising the steps of forming an insulating film overlying a semiconductor substrate, forming a first interconnect pattern on said insulating film, forming a first silicon oxide film on said first interconnect pattern and said insulating film by a dual-frequency plasma enhanced chemical vapor deposition (CVD) using a higher frequency component and a lower frequency component for plasma discharge and using a alkoxysilane as 2a reactive gas, said first silicon oxide film having a thickness lower than a thickness of said first interconnect pattern, forming a second silicon oxide film by an atmospheric pressure CVD process using a mixture of alkoxysilane and ozone as a reactive gas, forming a third silicon oxide film on said second silicon oxide film by a plasma enhanced CVD process, and forming a second interconnect pattern overlying said second silicon oxide film.
Claim 2
Independent Claim
148 words
A method for forming a semiconductor device of a multi-layer interconnection structure comprising the steps of forming an insulating film overlying a semiconductor substrate, forming a first interconnect pattern on said insulating film, forming a first silicon oxide film on said first interconnect pattern and said insulating film by a dual-frequency plasma enhanced chemical vapor deposition (CVD) using a higher frequency component and a lower frequency component for plasma discharge and using a alkoxysilane as 2a reactive gas, said first silicon oxide film having a thickness lower than a thickness of said first interconnect pattern, forming a second silicon oxide film by an atmospheric pressure CVD process using a mixture of alkoxysilane and ozone as a reactive gas, forming a third silicon oxide film on said second silicon oxide film by a plasma enhanced CVD process, and forming a second interconnect pattern overlying said second silicon oxide film.
Claim 3
Dependent Claim
65 words
A method for manufacturing a semiconductor device of a multi-layer interconnection structure as defined in claim 1, further comprising the steps of forming a spin-on glass film on said third silicon oxide film, and etching back said spin-on glass film and a portion of said third silicon oxide film by a plasma etching process to flatten a remaining portion of said third silicon oxide film.
Claim 4
Dependent Claim
31 words
A method for manufacturing a semiconductor device of a multi-layer interconnection structure as defined in claim 1, wherein the thickness of said first silicon oxide is not lower than 25 nm.
Claim 5
Dependent Claim
23 words
A method for manufacturing a semiconductor device of a multi-layer interconnection structure as defined in claim 1, wherein said alkoxysilane is tetraethoxysilane (TEOS).
Claim 6
Dependent Claim
56 words
A method for manufacturing a semiconductor device of a multi-layer interconnection structure as defined in claim 1, wherein said higher frequency component has a frequency of about 13.56 MHz, and said lower frequency component has a frequency ranging between 200 and 450 kHz and a discharge power density ranging between 0.1 and 0.7 watt/cm 2 .
Claim 7
Dependent Claim
45 words
A method for manufacturing a semiconductor device of a multi-layer interconnection structure as defined in claim 1, said forming of the first interconnect pattern includes patterning of an interconnection film by a dry etching to form a forward mesa structure of the first interconnect pattern.
Claim 8
Dependent Claim
55 words
The method for manufacturing a semiconductor device of a multi-layer interconnection structure as defined in claim 2, wherein the second silicon oxide film is formed to be in direct contact with the first silicon oxide film, and the third silicon oxide film is formed to be in direct contact with the second silicon oxide film.
Claim 9
Dependent Claim
37 words
The method for manufacturing a semiconductor device of a multi-layer interconnection structure as defined in claim 7, wherein the second silicon oxide film is not subjected to etching prior to formation of the third silicon oxide film.
Claim 10
Dependent Claim
40 words
The method for manufacturing a semiconductor device of a multi-layer interconnection structure as defined in claim 8, wherein the etching step is performed to allow a portion of the spin-on glass film to remain on the third silicon oxide film.
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