Patent US6072228A successfully refreshed from Google Patents.
US6072228A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multi-part lead frame with dissimilar materials and method of manufacturing
Assignee: Micron Technology Inc
•
Filing: 1996-10-25
•
Granted: 2000-06-06
•
Expires: 2016-10-25
Abstract
Abstract A multi-leadframe die assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi part lead frame assembly which utilizes equipment designed for single lead frame processing. If desired, the materials for the multi part lead frame may be dissimilar.
Inventors
- 👤 S. Derek Hinkle
- 👤 Jerry M. Brooks
- 👤 David J. Corisis
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 22:29
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/413; H10W70/415; H10W70/421; H10W70/438; H10W70/442; H10W70/456; H10W70/457; H10W72/00; H10W72/071; H10W72/075; H10W72/50; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/59; H10W72/90; H10W72/931; H10W72/932; H10W72/941; H10W72/944; H10W72/9445; H10W72/951; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 81
Claim 1
Independent Claim
65 words
A lead frame for attaching a semiconductor device thereto, said lead frame comprising: a die paddle onto which said semiconductor device is to be attached, said die paddle being of a first material; and a lead frame including at least two carriers, said lead frame being of a second material different than the first material of said lead frame and having a plurality of leads.
Claim 2
Dependent Claim
65 words
A lead frame for attaching a semiconductor device thereto, said lead frame comprising: a die paddle onto which said semiconductor device is to be attached, said die paddle being of a first material; and a lead frame including at least two carriers, said lead frame being of a second material different than the first material of said lead frame and having a plurality of leads.
Claim 3
Dependent Claim
24 words
The lead frame of claim 1, wherein a portion of at least one lead of said plurality of leads extends over said semiconductor device.
Claim 4
Dependent Claim
26 words
The lead frame of claim 1, wherein a portion of at least one lead of said plurality of leads does not extend over said semiconductor device.
Claim 5
Dependent Claim
20 words
The lead frame of claim 1, wherein at least one lead of said plurality of leads overlaps said die paddle.
Claim 6
Dependent Claim
21 words
The lead frame of claim 1, wherein at least one lead of said plurality of leads terminates adjacent said die paddle.
Claim 7
Dependent Claim
30 words
The lead frame of claim 1, wherein the heat conductivity of the first material of said die paddle is different than that of the second material of said lead frame.
Claim 8
Dependent Claim
25 words
The lead frame of claim 1, wherein the first material of said die paddle and the second material of said lead frame are substantially similar.
Claim 9
Dependent Claim
30 words
The lead frame of claim 1, wherein the electrical conductivity of the second material of said lead frame is different than that of the first material of said die paddle.
Claim 10
Dependent Claim
44 words
The lead frame of claim 1, wherein the first material of said die paddle is selected from the group comprising alloy 42, copper alloy, aluminum alloy, silver alloy, copper-clad Invar, copper-clad molybdenum, ceramic compounds, plastic compounds, glass epoxy based compounds, and reinforced organic compounds.
Claim 11
Dependent Claim
29 words
The lead frame of claim 1, wherein the second material of said lead frame is selected from the group of alloy 42, copper alloy, aluminum alloy, and silver alloy.
Claim 12
Dependent Claim
96 words
A lead frame for attaching a semiconductor device thereto, said lead frame comprising: a separately formed die paddle onto which said semiconductor device is to be attached; a separately formed lead frame attached to said separately formed die paddle, said separately formed lead frame including at least two carriers, said lead frame having a plurality of leads, each lead of the plurality of leads having a length terminating adjacent said semiconductor device to be attached to said separately formed die paddle, the electrical conductivity of said lead frame being different than that of said die paddle.
Claim 13
Dependent Claim
96 words
A lead frame for attaching a semiconductor device thereto, said lead frame comprising: a separately formed die paddle onto which said semiconductor device is to be attached; a separately formed lead frame attached to said separately formed die paddle, said separately formed lead frame including at least two carriers, said lead frame having a plurality of leads, each lead of the plurality of leads having a length terminating adjacent said semiconductor device to be attached to said separately formed die paddle, the electrical conductivity of said lead frame being different than that of said die paddle.
Claim 14
Dependent Claim
22 words
The lead frame of claim 11, wherein the heat conductivity of said die paddle is different than that of said lead frame.
Claim 15
Dependent Claim
43 words
The lead frame of claim 11, wherein said die paddle is formed of material selected from the group comprising alloy 42, copper alloy, aluminum alloy, silver alloy, copper-clad Invar, copper-clad molybdenum, ceramic compounds, plastic compounds, glass epoxy based compounds, and reinforced organic compounds.
Claim 16
Dependent Claim
28 words
The lead frame of claim 11, wherein said lead frame is formed of material selected from the group of alloy 42, copper alloy, aluminum alloy, and silver alloy.
Claim 17
Dependent Claim
107 words
A semiconductor die assembly comprising: a semiconductor die including an active surface having at least one bond pad formed thereon; a die paddle onto which said semiconductor die is attached, said die paddle being of a first material; a lead frame including at least two carriers, each carrier having an attachment tab receiving portion, said lead frame being of a second material different than the first material of said lead frame and having a plurality of leads; and at least one interconnection between at least one lead of said plurality of leads of said lead frame and said at least one bond pad of said semiconductor die.
Claim 18
Dependent Claim
107 words
A semiconductor die assembly comprising: a semiconductor die including an active surface having at least one bond pad formed thereon; a die paddle onto which said semiconductor die is attached, said die paddle being of a first material; a lead frame including at least two carriers, each carrier having an attachment tab receiving portion, said lead frame being of a second material different than the first material of said lead frame and having a plurality of leads; and at least one interconnection between at least one lead of said plurality of leads of said lead frame and said at least one bond pad of said semiconductor die.
Claim 19
Dependent Claim
30 words
A semiconductor die assembly according to claim 15, wherein a portion of at least one lead of said plurality of leads extends over said active surface of said semiconductor die.
Claim 20
Dependent Claim
32 words
A semiconductor die assembly according to claim 15, wherein a portion of at least one lead of said plurality of leads does not extend over said active surface of said semiconductor die.
Claim 21
Dependent Claim
25 words
A semiconductor die assembly according to claim 15, wherein a portion of at least one lead of said plurality of leads overlaps said die paddle.
Claim 22
Dependent Claim
32 words
A semiconductor die assembly according to claim 15, wherein the heat conductivity of the first material of said die paddle is different than that of the second material of said lead frame.
Claim 23
Dependent Claim
32 words
A semiconductor die assembly according to claim 15, wherein the electrical conductivity of the second material of said lead frame is different than that of the first material of said die paddle.
Claim 24
Dependent Claim
32 words
A semiconductor die assembly according to claim 15, wherein the electrical conductivity of the second material of said lead frame is greater than that of the first material of said die paddle.
Claim 25
Dependent Claim
27 words
A semiconductor die assembly according to claim 15, further including an insulating film, said insulating film covering a portion of said active surface of said semiconductor die.
Claim 26
Dependent Claim
46 words
The semiconductor die assembly according to claim 15, wherein the first material of said die paddle is selected from the group comprising alloy 42, copper alloy, aluminum alloy, silver alloy, copper-clad Invar, copper-clad molybdenum, ceramic compounds, plastic compounds, glass epoxy based compounds, and reinforced organic compounds.
Claim 27
Dependent Claim
31 words
The semiconductor die assembly according to claim 15, wherein the second material of said lead frame is selected from the group of alloy 42, copper alloy, aluminum alloy, and silver alloy.
Claim 28
Dependent Claim
18 words
The semiconductor die assembly according to claim 15, wherein said at least one interconnection includes a wire bond.
Claim 29
Dependent Claim
129 words
A semiconductor die assembly comprising: a semiconductor die including an active surface having at least one bond pad formed thereon; a separately formed die paddle of a first material onto which said semiconductor die is attached; a separately formed lead frame of a second material different than the first material of the separately formed die paddle including at least two carriers, each carrier having an attachment tab receiving portion, said lead frame having a plurality of leads, the plurality of leads each having a length terminating adjacent said semiconductor die; and at least one interconnection between at least one lead of said plurality of leads of said separately formed lead frame and said at least one bond pad of said semiconductor die attached to said separately formed die paddle.
Claim 30
Dependent Claim
129 words
A semiconductor die assembly comprising: a semiconductor die including an active surface having at least one bond pad formed thereon; a separately formed die paddle of a first material onto which said semiconductor die is attached; a separately formed lead frame of a second material different than the first material of the separately formed die paddle including at least two carriers, each carrier having an attachment tab receiving portion, said lead frame having a plurality of leads, the plurality of leads each having a length terminating adjacent said semiconductor die; and at least one interconnection between at least one lead of said plurality of leads of said separately formed lead frame and said at least one bond pad of said semiconductor die attached to said separately formed die paddle.
Claim 31
Dependent Claim
24 words
A semiconductor die assembly according to claim 26, wherein the heat conductivity of said die paddle is different than that of said lead frame.
Claim 32
Dependent Claim
30 words
A semiconductor die assembly according to claim 26, wherein the electrical conductivity of the material of said lead frame is different than that of the material of said die paddle.
Claim 33
Dependent Claim
27 words
A semiconductor die assembly according to claim 26, wherein the electrical conductivity of the material of said lead frame is greater than that of the die paddle.
Claim 34
Dependent Claim
45 words
A semiconductor die assembly according to claim 26, wherein said die paddle is formed of material selected from the group comprising alloy 42, copper alloy, aluminum alloy, silver alloy, copper-clad Invar, copper-clad molybdenum, ceramic compounds, plastic compounds, glass epoxy based compounds, and reinforced organic compounds.
Claim 35
Dependent Claim
30 words
The semiconductor die assembly according to claim 26, wherein said lead frame is formed of material selected from the group of alloy 42, copper alloy, aluminum alloy, and silver alloy.
Claim 36
Dependent Claim
18 words
The semiconductor die assembly according to claim 26, wherein the at least one interconnection includes a wire bond.
Claim 37
Dependent Claim
138 words
A semiconductor die assembly comprising: a semiconductor die including an active surface having at least one bond pad formed thereon; a die paddle of a first material onto which said semiconductor die is attached; at least one tie bar connected to said die paddle, the tie bar including an attachment tab thereon; a lead frame of a second material different than the first material of the die paddle including carriers, each carrier having an attachment tab receiving portion attached to a portion of said attachment tab of said at least one tie bar, and a plurality of leads, each lead including an inner lead portion and an outer lead portion; and at least one interconnection between at least one said inner lead portion of said lead frame and said at least one bond pad of said semiconductor die.
Claim 38
Dependent Claim
138 words
A semiconductor die assembly comprising: a semiconductor die including an active surface having at least one bond pad formed thereon; a die paddle of a first material onto which said semiconductor die is attached; at least one tie bar connected to said die paddle, the tie bar including an attachment tab thereon; a lead frame of a second material different than the first material of the die paddle including carriers, each carrier having an attachment tab receiving portion attached to a portion of said attachment tab of said at least one tie bar, and a plurality of leads, each lead including an inner lead portion and an outer lead portion; and at least one interconnection between at least one said inner lead portion of said lead frame and said at least one bond pad of said semiconductor die.
Claim 39
Dependent Claim
31 words
A semiconductor die assembly according to claim 33, wherein said inner lead portion of at least one of the plurality of leads extends over said active surface of said semiconductor die.
Claim 40
Dependent Claim
33 words
A semiconductor die assembly according to claim 33, wherein said inner lead portion of at least one of the plurality of leads does not extend over said active surface of said semiconductor die.
Claim 41
Dependent Claim
26 words
A semiconductor die assembly according to claim 33, wherein said inner lead portion of at least one of the plurality of leads overlaps said die paddle.
Claim 42
Dependent Claim
24 words
A semiconductor die assembly according to claim 33, wherein said lead frame and said at least one tie bar are made of different materials.
Claim 43
Dependent Claim
32 words
A semiconductor die assembly according to claim 33, wherein the heat conductivity of the first material of said die paddle is different than that of the second material of said lead frame.
Claim 44
Dependent Claim
32 words
A semiconductor die assembly according to claim 33, wherein the electrical conductivity of the second material of said lead frame is different than that of the first material of said die paddle.
Claim 45
Dependent Claim
31 words
A semiconductor die assembly according to claim 33, wherein the electrical conductivity of the second material of said lead frame is different than that of the material of said tie bar.
Claim 46
Dependent Claim
27 words
A semiconductor die assembly according to claim 33, further including an insulating film, said insulating film covering a portion of said active surface of said semiconductor die.
Claim 47
Dependent Claim
17 words
A semiconductor die assembly of claim 33, wherein said at least one interconnection includes a wire bond.
Claim 48
Dependent Claim
160 words
A semiconductor die assembly comprising: a semiconductor die including an active surface having at least one bond pad formed thereon; a die paddle of a first material onto which said semiconductor die is attached; at least one tie bar connected to said die paddle, said at least one tie bar including an enlarged attachment tab thereon, said enlarged attachment tab being larger than the at least one tie bar; a lead frame of a second material different than the first material of said die paddle including carriers, each carrier having an attachment tab receiving portion having an aperture therein attached to a portion of said enlarged attachment tab of said at least one tie bar, and a plurality of leads, each lead including an inner lead portion and an outer lead portion; and at least one interconnection between at least one said inner lead portion of said lead frame and said at least one bond pad of said semiconductor die.
Claim 49
Dependent Claim
160 words
A semiconductor die assembly comprising: a semiconductor die including an active surface having at least one bond pad formed thereon; a die paddle of a first material onto which said semiconductor die is attached; at least one tie bar connected to said die paddle, said at least one tie bar including an enlarged attachment tab thereon, said enlarged attachment tab being larger than the at least one tie bar; a lead frame of a second material different than the first material of said die paddle including carriers, each carrier having an attachment tab receiving portion having an aperture therein attached to a portion of said enlarged attachment tab of said at least one tie bar, and a plurality of leads, each lead including an inner lead portion and an outer lead portion; and at least one interconnection between at least one said inner lead portion of said lead frame and said at least one bond pad of said semiconductor die.
Claim 50
Dependent Claim
17 words
A semiconductor die assembly of claim 43, wherein said at least one interconnection includes a wire bond.
Claim 51
Dependent Claim
31 words
A semiconductor die assembly according to claim 43, wherein said inner lead portion of at least one of the plurality of leads extends over said active surface of said semiconductor die.
Claim 52
Dependent Claim
34 words
A semiconductor die assembly according to claim 43, wherein said inner plurality lead portion of at least one of the plurality of leads does not extend over said active surface of said semiconductor die.
Claim 53
Dependent Claim
26 words
A semiconductor die assembly according to claim 43, wherein said inner lead portion of at least one of the plurality of leads overlaps said die paddle.
Claim 54
Dependent Claim
24 words
A semiconductor die assembly according to claim 43, wherein said lead frame and said at least one tie bar are made of different materials.
Claim 55
Dependent Claim
24 words
A semiconductor die assembly according to claim 43, wherein a heat conductivity of said die paddle is different than that of said lead frame.
Claim 56
Dependent Claim
30 words
A semiconductor die assembly according to claim 43, wherein a material from which said die paddle is formed is different than a material from which said lead frame is formed.
Claim 57
Dependent Claim
24 words
A semiconductor die assembly according to claim 43, wherein the electrical conductivity of said lead frame is different than that of said die paddle.
Claim 58
Dependent Claim
24 words
A semiconductor die assembly according to claim 43, wherein the electrical conductivity of said lead frame is different than that of said tie bar.
Claim 59
Dependent Claim
27 words
A semiconductor die assembly according to claim 43, further including an insulating film, said insulating film covering a portion of said active surface of said semiconductor die.
Claim 60
Dependent Claim
156 words
A semiconductor die assembly comprising: a semiconductor die including an active surface having at least one bond pad formed thereon; a die paddle of a first material onto which said semiconductor die is attached; at least one tie bar connected to said die paddle, said at least one tie bar including an enlarged attachment tab thereon, said enlarged attachment tab being larger than the at least one tie bar; a lead frame of a second material different than the first material of said die paddle including carriers, each carrier having an attachment tab receiving portion attached to a portion of said enlarged attachment tab of said at least one tie bar, and a plurality of leads, each lead including an inner lead portion and an outer lead portion; and at least one interconnection between at least one said inner lead portion of said lead frame and said at least one bond pad of said semiconductor die.
Claim 61
Dependent Claim
156 words
A semiconductor die assembly comprising: a semiconductor die including an active surface having at least one bond pad formed thereon; a die paddle of a first material onto which said semiconductor die is attached; at least one tie bar connected to said die paddle, said at least one tie bar including an enlarged attachment tab thereon, said enlarged attachment tab being larger than the at least one tie bar; a lead frame of a second material different than the first material of said die paddle including carriers, each carrier having an attachment tab receiving portion attached to a portion of said enlarged attachment tab of said at least one tie bar, and a plurality of leads, each lead including an inner lead portion and an outer lead portion; and at least one interconnection between at least one said inner lead portion of said lead frame and said at least one bond pad of said semiconductor die.
Claim 62
Dependent Claim
18 words
A semiconductor die assembly according to claim 54, wherein said at least one interconnection includes a wire bond.
Claim 63
Dependent Claim
31 words
A semiconductor die assembly according to claim 54, wherein said inner lead portion of at least one of the plurality of leads extends over said active surface of said semiconductor die.
Claim 64
Dependent Claim
26 words
A semiconductor die assembly according to claim 54, wherein said inner lead portion of at least one of the plurality of leads overlaps said die paddle.
Claim 65
Dependent Claim
24 words
A semiconductor die assembly according to claim 54, wherein said lead frame and said at least one tie bar are made of different materials.
Claim 66
Dependent Claim
30 words
A semiconductor die assembly according to claim 54, wherein the heat conductivity of the material of said die paddle is greater than that of the material of said lead frame.
Claim 67
Dependent Claim
30 words
A semiconductor die assembly according to claim 54, wherein the material from which said die paddle is formed is thicker than the material from which said lead frame is formed.
Claim 68
Dependent Claim
24 words
A semiconductor die assembly according to claim 54, wherein the electrical conductivity of said lead frame is greater than that of said die paddle.
Claim 69
Dependent Claim
24 words
A semiconductor die assembly according to claim 54, wherein the electrical conductivity of said lead frame is greater than that of said tie bar.
Claim 70
Dependent Claim
26 words
A semiconductor die assembly according to claim 54, further including an insulating film, said film covering a portion of said active surface of said semiconductor die.
Claim 71
Dependent Claim
183 words
A semiconductor die assembly comprising: a semiconductor die including an active surface having at least one bond pad formed thereon; a die paddle of a first material onto which said semiconductor die is attached; at least one tie bar connected to said die paddle, said at least one tie bar including an enlarged attachment tab thereon, said enlarged attachment tab being larger than the at least one tie bar; a lead frame of a second material different than the first material of said die paddle including carriers, each carrier having an attachment tab receiving portion having an aperture therein and a shape substantially the same as the enlarged attachment tab on said at least one tie bar, said attachment tab receiving portion attached to a portion of said enlarged attachment tab of said at least one tie bar, and a plurality of leads, each lead including an inner lead portion and an outer lead portion; and at least one interconnection of at least one said inner lead portion of said lead frame and said at least one bond pad of said semiconductor die.
Claim 72
Dependent Claim
183 words
A semiconductor die assembly comprising: a semiconductor die including an active surface having at least one bond pad formed thereon; a die paddle of a first material onto which said semiconductor die is attached; at least one tie bar connected to said die paddle, said at least one tie bar including an enlarged attachment tab thereon, said enlarged attachment tab being larger than the at least one tie bar; a lead frame of a second material different than the first material of said die paddle including carriers, each carrier having an attachment tab receiving portion having an aperture therein and a shape substantially the same as the enlarged attachment tab on said at least one tie bar, said attachment tab receiving portion attached to a portion of said enlarged attachment tab of said at least one tie bar, and a plurality of leads, each lead including an inner lead portion and an outer lead portion; and at least one interconnection of at least one said inner lead portion of said lead frame and said at least one bond pad of said semiconductor die.
Claim 73
Dependent Claim
18 words
A semiconductor die assembly according to claim 64, wherein the at least one interconnection includes a wire bond.
Claim 74
Dependent Claim
31 words
A semiconductor die assembly according to claim 64, wherein said inner lead portion of at least one of the plurality of leads extends over said active surface of said semiconductor die.
Claim 75
Dependent Claim
26 words
A semiconductor die assembly according to claim 64, wherein said inner lead portion of at least one of the plurality of leads overlaps said die paddle.
Claim 76
Dependent Claim
24 words
A semiconductor die assembly according to claim 64, wherein said lead frame and said at least one tie bar are made of different materials.
Claim 77
Dependent Claim
30 words
A semiconductor die assembly according to claim 64, wherein the heat conductivity of the material of said die paddle is greater than that of the material of said lead frame.
Claim 78
Dependent Claim
24 words
A semiconductor die assembly according to claim 64, wherein the material of said die paddle is thicker than the material of said lead frame.
Claim 79
Dependent Claim
24 words
A semiconductor die assembly according to claim 64, wherein the electrical conductivity of said lead frame is greater than that of said die paddle.
Claim 80
Dependent Claim
24 words
A semiconductor die assembly according to claim 64, wherein the electrical conductivity of said lead frame is greater than that of said tie bar.
Claim 81
Dependent Claim
27 words
A semiconductor die assembly according to claim 64, further including an insulating film, said insulating film covering a portion of said active surface of said semiconductor die.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-06-06 | 2003-12-06 | 2004-06-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-06-06 | 2007-12-06 | 2008-06-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-06-06 | 2011-12-06 | 2012-06-06 | $7700.00 | Window Closed / Lapsed |