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US6069041A Expired / Lapsed US ⏱️ 0.0 years remaining

Process for manufacturing non-volatile semiconductor memory device by introducing nitrogen atoms

Assignee: Sharp Corp
•
Filing: 1997-11-19
•
Granted: 2000-05-30
•
Expires: 2017-11-19
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Abstract

Abstract A process for manufacturing a non-volatile semiconductor memory device by forming a tunnel dielectric film, a floating gate electrode, an interlayer capacitive film and a control gate electrode successively on a semiconductor substrate includes introducing nitrogen atoms into at least one of an interface between the floating gate electrode and the interlayer capacitive film and an interface between the interlayer capacitive film and the control gate electrode.

Inventors

  • 👤 Takuji Tanigami
  • 👤 Shinichi Sato
  • 👤 Kenichi Azuma

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 02:46
CPC Classifications
H; H10; H10D; H10D64/00; H10D64/01; H10D64/013; H10D64/01302; H10D64/01332; H10D64/01336; H10D64/01338; H10D64/031; H10D64/035; H10D64/60; H10D64/66; H10D64/68; H10D64/681; H10D64/693; H10D64/01342; Y; Y10; Y10S; Y10S438/00; Y10S438/91

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 68 words
A process for manufacturing a non-volatile semiconductor memory device by forming a tunnel dielectric film, a floating gate electrode, an interlayer capacitive film and a control gate electrode successively on a semiconductor substrate, wherein the process comprises introducing nitrogen atoms into at least an interface between the floating gate electrode and the interlayer capacitive film and an interface between the interlayer capacitive film and the control gate electrode.
Claim 2
Dependent Claim 68 words
A process for manufacturing a non-volatile semiconductor memory device by forming a tunnel dielectric film, a floating gate electrode, an interlayer capacitive film and a control gate electrode successively on a semiconductor substrate, wherein the process comprises introducing nitrogen atoms into at least an interface between the floating gate electrode and the interlayer capacitive film and an interface between the interlayer capacitive film and the control gate electrode.
Claim 3
Dependent Claim 85 words
A process for manufacturing a non-volatile semiconductor memory device according to claim 1, wherein introduction of nitrogen atoms into the interface between the tunnel dielectric film and the floating gate electrode and the interface between the floating gate electrode and the interlayer capacitive film is performed by the steps of forming the floating gate electrode on the tunnel dielectric film, then doping nitrogen atoms into the floating gate electrode, depositing the interlayer capacitive film on the floating gate electrode and carrying out a thermal treatment.
Claim 4
Dependent Claim 62 words
A process for manufacturing a non-volatile semiconductor memory device according to claim 1, wherein introduction of nitrogen atoms into the interface between the interlayer capacitive film and the control gate electrode is performed by the steps of forming the control gate electrode on the interlayer capacitive film, then doping nitrogen atoms into the control gate electrode and carrying out a thermal treatment.
Claim 5
Dependent Claim 86 words
A process for manufacturing a non-volatile semiconductor memory device according to claim 3, wherein introduction of nitrogen atoms into the interface between the tunnel dielectric film and the floating gate electrode and into the interface between the floating gate electrode and the interlayer capacitive film is performed by the steps of forming the floating gate electrode on the tunnel dielectric film, then doping nitrogen atoms into the floating gate electrode, depositing the interlayer capacitive film on the floating gate electrode and carrying out a thermal treatment.

References Cited (Backward Citations)

US4774197A Cited
JPH05267684A Cited
JPH0629314A Cited
JPH0677493A Cited
US5464792A Cited
US5571734A Cited
US5837585A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2003-05-30 2003-11-29 2004-05-30 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2007-05-30 2007-11-29 2008-05-30 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2011-05-30 2011-11-29 2012-05-30 $7700.00 Window Closed / Lapsed

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