Patent US6059893A successfully refreshed from Google Patents.
US6059893A
Expired / Lapsed
US
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Method for cleaning a semiconductor wafer
Assignee: Lapis Semiconductor Co Ltd
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Filing: 1998-07-27
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Granted: 2000-05-09
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Expires: 2018-07-27
Abstract
Abstract A semiconductor cleaning method for removing particles that have adhered to the back side of a semiconductor wafer. The semiconductor wafer is placed on a support. Inert gas is blown against the back of the semiconductor wafer by a plurality of nozzles, each of which is positioned at a predetermined angle to the back of the semiconductor wafer and inclined in a first direction. An air exhaust is located near the periphery of the semiconductor wafer and arranged so as to suck in the particles removed from the semiconductor wafer with the nozzles.
Inventors
- 👤 Shinji Kawasaki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 12:41
CPC Classifications
H; H10; H10P; H10P52/00; H10P72/00; H10P72/04; H10P72/0402; H10P72/0406; B; B08; B08B; B08B15/00; B08B15/04; B08B5/00; B08B5/02; Y; Y10; Y10S; Y10S134/00; Y10S134/902
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
143 words
A method of cleaning a semiconductor wafer with an inert gas blown through a plurality of nozzles, comprising: preparing a semiconductor wafer having a front side and a back side; rotating the semiconductor wafer; blowing the inert gas through the plurality of nozzles against the back side of the semiconductor wafer to remove particles from the back side of the semiconductor wafer, said inert gas being blown from the plurality of nozzles against the back side of the semiconductor wafer at a predetermined angle thereto and in only a single predetermined direction so that a first flow is produced across said wafer in said single predetermined direction; and sucking the removed particles into an intake port of an exhausting means located adjacent to the semiconductor wafer, wherein a width of the intake port is wider than an outer diameter of the semiconductor wafer.
Claim 2
Independent Claim
143 words
A method of cleaning a semiconductor wafer with an inert gas blown through a plurality of nozzles, comprising: preparing a semiconductor wafer having a front side and a back side; rotating the semiconductor wafer; blowing the inert gas through the plurality of nozzles against the back side of the semiconductor wafer to remove particles from the back side of the semiconductor wafer, said inert gas being blown from the plurality of nozzles against the back side of the semiconductor wafer at a predetermined angle thereto and in only a single predetermined direction so that a first flow is produced across said wafer in said single predetermined direction; and sucking the removed particles into an intake port of an exhausting means located adjacent to the semiconductor wafer, wherein a width of the intake port is wider than an outer diameter of the semiconductor wafer.
Claim 3
Dependent Claim
18 words
A method according to claim 1, wherein the predetermined angle is greater than 0° and less than 90°.
Claim 4
Independent Claim
175 words
A method of cleaning a semiconductor device comprising: preparing a semiconductor wafer having a front side and a back side; supplying a first inert gas to the front side of the semiconductor wafer in a first direction, said first inert gas being supplied thereto so that a first flow is produced in the first direction; rotating the semiconductor wafer; blowing a second inert gas through a plurality of nozzles against the back side of the semiconductor wafer to remove particles from the back side of the semiconductor wafer, said second inert gas being blown from the plurality of nozzles against the back side of the semiconductor wafer at a predetermined angle thereto and in only a single second direction so that a second flow is produced across said wafer in said single second direction; and sucking the particles removed by the second inert gas, into an intake port of an exhausting means located adjacent to the semiconductor wafer, wherein a width of the intake port is wider than an outer diameter of the semiconductor wafer.
Claim 5
Independent Claim
175 words
A method of cleaning a semiconductor device comprising: preparing a semiconductor wafer having a front side and a back side; supplying a first inert gas to the front side of the semiconductor wafer in a first direction, said first inert gas being supplied thereto so that a first flow is produced in the first direction; rotating the semiconductor wafer; blowing a second inert gas through a plurality of nozzles against the back side of the semiconductor wafer to remove particles from the back side of the semiconductor wafer, said second inert gas being blown from the plurality of nozzles against the back side of the semiconductor wafer at a predetermined angle thereto and in only a single second direction so that a second flow is produced across said wafer in said single second direction; and sucking the particles removed by the second inert gas, into an intake port of an exhausting means located adjacent to the semiconductor wafer, wherein a width of the intake port is wider than an outer diameter of the semiconductor wafer.
Claim 6
Dependent Claim
18 words
A method according to claim 3, wherein the predetermined angle is greater than 0° and less than 90°.
Claim 7
Independent Claim
159 words
A method of cleaning a semiconductor device with an insert gas blown through a plurality of nozzles, comprising: preparing a semiconductor wafer having a front side and a back side; rotating the semiconductor wafer; blowing the inert gas through the plurality of nozzles against the back side of the semiconductor wafer in order to remove particles from the back side of the semiconductor wafer, said inert gas being blown against the back side of the semiconductor wafer from the plurality of nozzles at a predetermined angle thereto and in only a single predetermined direction so that a first flow is produced across said wafer in said single predetermined direction toward a periphery of the semiconductor wafer; and sucking the particles removed by the inert gas, into an intake port of an exhausting means located adjacent to the periphery of the semiconductor wafer, wherein a width of the intake port is wide than an outer diameter of the semiconductor wafer.
Claim 8
Independent Claim
159 words
A method of cleaning a semiconductor device with an insert gas blown through a plurality of nozzles, comprising: preparing a semiconductor wafer having a front side and a back side; rotating the semiconductor wafer; blowing the inert gas through the plurality of nozzles against the back side of the semiconductor wafer in order to remove particles from the back side of the semiconductor wafer, said inert gas being blown against the back side of the semiconductor wafer from the plurality of nozzles at a predetermined angle thereto and in only a single predetermined direction so that a first flow is produced across said wafer in said single predetermined direction toward a periphery of the semiconductor wafer; and sucking the particles removed by the inert gas, into an intake port of an exhausting means located adjacent to the periphery of the semiconductor wafer, wherein a width of the intake port is wide than an outer diameter of the semiconductor wafer.
Claim 9
Dependent Claim
18 words
A method according to claim 5, wherein the predetermined angle is greater than 0° and less than 90°.
Claim 10
Independent Claim
177 words
A method of cleaning a semiconductor device comprising: preparing a semiconductor wafer having a front side and a back side; supplying an inert gas to the front side of the semiconductor wafer in a predetermined direction, said inert gas being supplied thereto so that a first flow is produced in the predetermined direction; rotating the semiconductor wafer; blowing the inert gas through a plurality of nozzles against the back side of the semiconductor wafer in order to remove particles from the back side of the semiconductor wafer, said inert gas being blown from the plurality of nozzles against the back side of the semiconductor wafer at a predetermined angle thereto and in only a single direction such that a second flow is produced across said wafer toward a periphery of the semiconductor wafer in said single direction; and sucking the particles removed by the inert gas, into an intake port of an exhausting means located adjacent to the semiconductor wafer, wherein a width of the intake port is wider than an outer diameter of the semiconductor wafer.
Claim 11
Independent Claim
177 words
A method of cleaning a semiconductor device comprising: preparing a semiconductor wafer having a front side and a back side; supplying an inert gas to the front side of the semiconductor wafer in a predetermined direction, said inert gas being supplied thereto so that a first flow is produced in the predetermined direction; rotating the semiconductor wafer; blowing the inert gas through a plurality of nozzles against the back side of the semiconductor wafer in order to remove particles from the back side of the semiconductor wafer, said inert gas being blown from the plurality of nozzles against the back side of the semiconductor wafer at a predetermined angle thereto and in only a single direction such that a second flow is produced across said wafer toward a periphery of the semiconductor wafer in said single direction; and sucking the particles removed by the inert gas, into an intake port of an exhausting means located adjacent to the semiconductor wafer, wherein a width of the intake port is wider than an outer diameter of the semiconductor wafer.
Claim 12
Dependent Claim
18 words
A method according to claim 7, wherein the predetermined angle is greater than 0° and less than 90°.
Claim 13
Dependent Claim
47 words
A method according to claim 1, wherein said exhausting means is located adjacent to a periphery of the semiconductor wafer and wherein said exhausting means is arranged to receive the removed particles propelled in the predetermined direction by the inert gas discharged from the plurality of nozzles.
Claim 14
Dependent Claim
47 words
A method according to claim 3, wherein said exhausting means is located adjacent to a periphery of the semiconductor wafer and wherein said exhausting means is arranged to receive the particles propelled in the second direction by the second inert gas discharged from the plurality of nozzles.
Claim 15
Dependent Claim
46 words
A method according to claim 5, wherein said exhausting means is located adjacent to the periphery of the semiconductor wafer and wherein said exhausting means is arranged to receive the particles propelled in the predetermined direction by the inert gas discharged from the plurality of nozzles.
Claim 16
Dependent Claim
46 words
A method according to claim 7, wherein said exhausting means is located adjacent to the periphery of the semiconductor wafer and wherein said exhausting means is arranged to receive the particles propelled in the predetermined direction by the inert gas discharged from the plurality of nozzles.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-05-09 | 2003-11-08 | 2004-05-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-05-09 | 2007-11-08 | 2008-05-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-05-09 | 2011-11-08 | 2012-05-09 | $7700.00 | Window Closed / Lapsed |