US6057600A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Structure for mounting a high-frequency package
Assignee: Kyocera Corp
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Filing: 1998-11-25
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Granted: 2000-05-02
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Expires: 2018-11-25
Abstract
Abstract A structure for mounting a high-frequency device on an insulating board having a circuit on a top surface and transmitting signals to the high-frequency device. The high-frequency device is sealed within a cavity on a top surface of a dielectric board. The dielectric board has a first signal transmission line on its top surface and a second signal transmission line on its bottom surface, the first and second signal transmission lines overlapping each other over a portion where the signal is transmitted through coupling of the first and second signal transmission lines. A recess is formed at the top surface of the insulating board below the overlapping portion of the first and second signal transmission lines to suppress transmission loss of the high-frequency signal between the first and second signal transmission lines. The recess may be filled with air or a material having a dielectric constant low than that of the insulating board.
Inventors
- 👤 Kenji Kitazawa
- 👤 Shinichi Koriyama
- 👤 Shigeki Morioka
- 👤 Satoru Tomie
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 04:34
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0237; H05K1/0243; H10; H10W; H10W44/00; H10W44/20; H10W90/00; H10W90/20; H10W90/293; H05K1/0216; H05K1/0218; H05K1/0219; H05K1/024; H05K2201/00; H05K2201/01; H05K2201/0183; H05K2201/0187; H05K2201/09; H05K2201/09009; H05K2201/09036; H05K2201/09072; H05K2201/09209; H05K2201/09654; H05K2201/09781; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10727; H05K2201/10954; H05K2201/10969; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3442; H10W44/203; H10W44/209; H10W44/216; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
187 words
A structure for mounting a high-frequency semiconductor element and transmitting a signal to and from the semiconductor element, comprising: a dielectric board having parallel first and second surfaces, wherein the high-frequency semiconductor element is mounted in a cavity formed adjacent the first surface of the dielectric board; a first signal transmission line formed on the first surface of the dielectric board and electrically connectable to the high-frequency semiconductor element; a second signal transmission line formed on the second surface of the dielectric board, the first and second signal transmission lines overlap each other in an overlapping region when viewed in a direction perpendicular to the first and second surfaces of the dielectric board; an insulating board having a wiring layer formed on a surface thereof, wherein the dielectric board is mounted on the surface of the insulating board and the wiring layer is electrically connected to the second signal transmission line, the insulating board defining a recess at the surface thereof which overlaps the overlapping region of the first and second signal transmission lines when viewed in a direction perpendicular to the surface of the insulating board.
Claim 2
Dependent Claim
187 words
A structure for mounting a high-frequency semiconductor element and transmitting a signal to and from the semiconductor element, comprising: a dielectric board having parallel first and second surfaces, wherein the high-frequency semiconductor element is mounted in a cavity formed adjacent the first surface of the dielectric board; a first signal transmission line formed on the first surface of the dielectric board and electrically connectable to the high-frequency semiconductor element; a second signal transmission line formed on the second surface of the dielectric board, the first and second signal transmission lines overlap each other in an overlapping region when viewed in a direction perpendicular to the first and second surfaces of the dielectric board; an insulating board having a wiring layer formed on a surface thereof, wherein the dielectric board is mounted on the surface of the insulating board and the wiring layer is electrically connected to the second signal transmission line, the insulating board defining a recess at the surface thereof which overlaps the overlapping region of the first and second signal transmission lines when viewed in a direction perpendicular to the surface of the insulating board.
Claim 3
Dependent Claim
37 words
A structure for mounting according to claim 1, wherein the first signal transmission line and the second signal transmission line are electromagnetically coupled together through a slot formed in a ground layer provided in said dielectric board.
Claim 4
Dependent Claim
34 words
A structure for mounting according to claim 1, wherein the first signal transmission line and the second signal transmission line are coupled together through a via-hole conductor that is penetrating through said dielectric board.
Claim 5
Dependent Claim
27 words
A structure for mounting according to claim 1, wherein the recess is filled with a material having a dielectric constant smaller than that of said insulating board.
Claim 6
Dependent Claim
23 words
A structure for mounting according to claim 4, wherein said material that is filled has a dielectric constant of not larger than 3.0.
Claim 7
Dependent Claim
123 words
A structure for mounting according to claim 2, wherein: said first signal transmission line includes a first input line and a first output line, and a first end of said first input line and a first end of said first output line are electrically connected to the semiconductor element; said second signal transmission line includes a second input line and a second output line; said slot formed in said ground layer includes an input-slot and an output-slot; and a second end of said first input line is electromagnetically coupled to an end of said second input line through the input-slot, and a second end of said first output line is electromagnetically coupled to an end of said second output line through the output-slot.
Claim 8
Dependent Claim
78 words
A structure for mounting according to claim 6, wherein: said input-slot and said output-slot are of a rectangular shape or an oval shape having a long side L or a long axis L, the distance between the centers thereof being not smaller than 2L; and a via-hole conductor or a metal band connected to said ground layer is formed in a region separated away by not smaller than L from the centers of said input-slot and said output-slot.
Claim 9
Dependent Claim
38 words
A structure for mounting according to claim 6, wherein said via-hole conductor or said metal band is positioned on a straight line connecting the end of the second input line to the end of the second output line.
Claim 10
Dependent Claim
32 words
A structure for mounting according to claim 6, wherein said via-hole conductor or said metal band is formed in a plural number maintaining such a gap as to shield the electromagnetic waves.
Claim 11
Dependent Claim
39 words
A structure for mounting according to claim 9, wherein said plural number via-hole conductors or said plural number metal bands are so formed as to surround the ends of the second input line and of the second output line.
Claim 12
Dependent Claim
42 words
A structure for mounting according to claim 6, wherein said second input line and said second output line are connected to the wiring layers at points separated by a distance not smaller than L from centers of the input-slot and the output-slot.
Claim 13
Dependent Claim
99 words
A structure for mounting according to claim 1, wherein a ground layer is formed in the insulating board to constitute a microstrip line in combination with the wiring layer formed on the surface thereof, wherein a ground layer is formed in the dielectric board to constitute a microstrip line in combination with the second signal transmission lines and the ground layers in the dielectric board and the ground layer in the insulating board are electrically joined together through via-hole conductors or electrically conducting cut-away portions formed in the dielectric board and the insulating board and aligned with each other.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-05-02 | 2003-11-01 | 2004-05-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-05-02 | 2007-11-01 | 2008-05-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-05-02 | 2011-11-01 | 2012-05-02 | $7700.00 | Window Closed / Lapsed |