US6056632A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head
Assignee: SPEEDFAM--IPEC CORP
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Filing: 1998-10-09
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Granted: 2000-05-02
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Expires: 2018-10-09
Abstract
Abstract A carrier head for a semiconductor wafer polishing apparatus includes a rigid plate which has a major surface with a plurality of open fluid channels. A flexible wafer carrier membrane has a perforated wafer contact section for contacting the semiconductor wafer, and a bellows extending around the wafer contact section. A retaining member is secured to the rigid plate with a flange on the bellows sandwiched between the plate's major surface and the retaining ring, thereby defining a cavity between the wafer carrier membrane and the rigid plate. A fluid conduit is coupled to the rigid plate allowing a source of vacuum and a source of pressurized fluid alternately to be connected to the cavity. An additional wafer carrier membrane is internally located with respect to the cavity formed by the wafer carrier membrane, and forms another cavity with respect to the rigid plate. Another fluid conduit is connected to the internal wafer carrier membrane's cavity, which is selectively pressurized to make the internal wafer carrier membrane contact the wafer contact section.
Inventors
- 👤 Fred E. Mitchel
- 👤 John A. Adams
- 👤 Thomas Frederick A. Bibby
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 17:55
CPC Classifications
H; H10; H10P; H10P50/00; B; B24; B24B; B24B37/00; B24B37/27; B24B37/30; B24B37/32
Claims Analysis
Total Claims: 27
Claim 1
Independent Claim
170 words
A carrier for an apparatus which performs chemical-mechanical planarization of a surface of a workpiece, wherein the carrier comprises: a rigid plate having a major surface; a wafer carrier membrane of soft, flexible material with a wafer contact section having an outer surface and an inner surface wherein the outer surface is for contacting an opposite surface of the workpiece, the wafer carrier membrane connected to the rigid plate and extending across at least a portion of the major surface thereby defining a first cavity therebetween; an internal wafer carrier membrane with a section having an outer surface for contacting the inner surface of the wafer contact section, the internal wafer carrier membrane connected to the rigid plate and extending across at least a portion of the major surface thereby defining a second cavity therebetween; a first fluid conduit by which a source of pressurized fluid is connected to the first cavity; and a second fluid conduit by which a source of pressurized fluid is connected to the second cavity.
Claim 2
Dependent Claim
170 words
A carrier for an apparatus which performs chemical-mechanical planarization of a surface of a workpiece, wherein the carrier comprises: a rigid plate having a major surface; a wafer carrier membrane of soft, flexible material with a wafer contact section having an outer surface and an inner surface wherein the outer surface is for contacting an opposite surface of the workpiece, the wafer carrier membrane connected to the rigid plate and extending across at least a portion of the major surface thereby defining a first cavity therebetween; an internal wafer carrier membrane with a section having an outer surface for contacting the inner surface of the wafer contact section, the internal wafer carrier membrane connected to the rigid plate and extending across at least a portion of the major surface thereby defining a second cavity therebetween; a first fluid conduit by which a source of pressurized fluid is connected to the first cavity; and a second fluid conduit by which a source of pressurized fluid is connected to the second cavity.
Claim 3
Dependent Claim
27 words
The carrier as recited in claim 1 further including a retaining member secured to the rigid plate around the wafer contact section of the wafer carrier membrane.
Claim 4
Dependent Claim
22 words
The carrier as recited in claim 1 wherein the wafer carrier membrane has a plurality of apertures through the wafer contact section.
Claim 5
Dependent Claim
22 words
The carrier as recited in claim 1 wherein the wafer carrier membrane in the wafer contact section has a substantially uniform thickness.
Claim 6
Dependent Claim
31 words
The carrier as recited in claim 1 wherein circumference of the wafer contact section of the wafer carrier membrane is coupled to a bellows which is coupled to the rigid plate.
Claim 7
Dependent Claim
25 words
The carrier as recited in claim 5 wherein the wafer carrier membrane further comprises a flange extending around the bellows and abutting the rigid plate.
Claim 8
Dependent Claim
53 words
The carrier as recited in claim 2 wherein the wafer carrier membrane further includes a bellows having a first end attached to the wafer contact section and having a second end, and a flange projecting from the second end and sandwiched between the major surface of the rigid plate and the retaining member.
Claim 9
Dependent Claim
30 words
The carrier as recited in claim 1 wherein the rigid plate has a plurality of channels on the major surface and the fluid conduits communicate with the plurality of channels.
Claim 10
Dependent Claim
22 words
The carrier as recited in claim 1 wherein the rigid plate has a plurality of concentric annular channels on the major surface.
Claim 11
Dependent Claim
22 words
The carrier as recited in claim 9 wherein the rigid plate further includes axial grooves interconnecting the plurality of concentric annular channels.
Claim 12
Dependent Claim
18 words
The carrier as recited in claim 1 wherein the internal wafer carrier membrane comprises a soft, flexible material.
Claim 13
Dependent Claim
33 words
The carrier as recited in claim 2 wherein the workpiece has a perimeter, and the retaining member has a perimeter which is less than five millimeters larger than the perimeter of the workpiece.
Claim 14
Dependent Claim
27 words
The carrier as recited in claim 2 wherein the retaining member has a surface which is substantially coplanar with the surface of the workpiece undergoing chemical-mechanical planarization.
Claim 15
Dependent Claim
28 words
The carrier as recited in claim 1 further comprising a fluid within the cavities, wherein the fluid is selected from the group consisting of air, nitrogen and water.
Claim 16
Dependent Claim
30 words
The carrier as recited in claim 1 wherein circumference of said section of the internal wafer carrier membrane is coupled to a bellows which is coupled to the rigid plate.
Claim 17
Dependent Claim
26 words
The carrier as recited in claim 15 wherein the internal wafer carrier membrane further comprises a flange extending around the bellows and abutting the rigid plate.
Claim 18
Dependent Claim
54 words
The carrier as recited in claim 1 wherein the internal wafer carrier membrane further includes a bellows having a first end attached to said section of the internal wafer carrier membrane and having a second end, and a flange projecting from the second end and sandwiched between the major surface and a locking member.
Claim 19
Dependent Claim
23 words
The carrier as recited in claim 1 wherein the wafer carrier membrane and the internal wafer carrier membrane are connected to each other.
Claim 20
Dependent Claim
30 words
The carrier as recited in claim 1 wherein an area of the section for contacting the wafer contact section is less than an area corresponding to the wafer contact section.
Claim 21
Dependent Claim
16 words
The carrier as recited in claim 1 wherein the second cavity is within the first cavity.
Claim 22
Dependent Claim
148 words
A carrier for an apparatus which performs chemical-mechanical planarization of a surface of a workpiece, wherein the carrier comprises: a rigid plate having a major surface; a wafer carrier membrane of soft, flexible material with a wafer contact section having an outer surface and an inner surface wherein the outer surface is for contacting an opposite surface of the workpiece, the wafer carrier membrane connected to the rigid plate and extending across at least a portion of the major surface thereby defining a first cavity therebetween; an internal wafer carrier membrane comprising a balloon-like portion with a section for contacting the inner surface of the wafer contact section; a first fluid conduit by which a source of pressurized fluid is connected to the first cavity; and a second fluid conduit by which a source of pressurized fluid is connected to a second cavity formed by the balloon-like portion.
Claim 23
Dependent Claim
148 words
A carrier for an apparatus which performs chemical-mechanical planarization of a surface of a workpiece, wherein the carrier comprises: a rigid plate having a major surface; a wafer carrier membrane of soft, flexible material with a wafer contact section having an outer surface and an inner surface wherein the outer surface is for contacting an opposite surface of the workpiece, the wafer carrier membrane connected to the rigid plate and extending across at least a portion of the major surface thereby defining a first cavity therebetween; an internal wafer carrier membrane comprising a balloon-like portion with a section for contacting the inner surface of the wafer contact section; a first fluid conduit by which a source of pressurized fluid is connected to the first cavity; and a second fluid conduit by which a source of pressurized fluid is connected to a second cavity formed by the balloon-like portion.
Claim 24
Independent Claim
115 words
A method of operating a carrier for an apparatus which performs chemical-mechanical planarization of a surface of a workpiece comprising the steps of: providing a rigid plate having a major surface; pressurizing a first cavity formed between a wafer carrier membrane of soft, flexible material and the major surface such that an outer surface of wafer contact section of the wafer carrier membrane contacts an opposite surface of the workpiece; and pressurizing a second cavity formed between an internal wafer carrier membrane of soft, flexible material and the major surface such that an outer surface of a section of the internal wafer carrier membrane makes contact with an inner surface of the wafer carrier membrane.
Claim 25
Independent Claim
115 words
A method of operating a carrier for an apparatus which performs chemical-mechanical planarization of a surface of a workpiece comprising the steps of: providing a rigid plate having a major surface; pressurizing a first cavity formed between a wafer carrier membrane of soft, flexible material and the major surface such that an outer surface of wafer contact section of the wafer carrier membrane contacts an opposite surface of the workpiece; and pressurizing a second cavity formed between an internal wafer carrier membrane of soft, flexible material and the major surface such that an outer surface of a section of the internal wafer carrier membrane makes contact with an inner surface of the wafer carrier membrane.
Claim 26
Independent Claim
87 words
A method of operating a carrier for an apparatus which performs chemical-mechanical planarization of a surface of a workpiece comprising the steps of: positioning the carrier including a membrane with at least one aperture therethrough over a surface of the workpiece; applying vacuum through each aperture to chuck the workpiece against the membrane; moving the carrier and chucked workpiece into position against a polishing surface; releasing vacuum through each aperture; and applying pressurized fluid into a cavity located between a surface of the carrier and the membrane.
Claim 27
Independent Claim
87 words
A method of operating a carrier for an apparatus which performs chemical-mechanical planarization of a surface of a workpiece comprising the steps of: positioning the carrier including a membrane with at least one aperture therethrough over a surface of the workpiece; applying vacuum through each aperture to chuck the workpiece against the membrane; moving the carrier and chucked workpiece into position against a polishing surface; releasing vacuum through each aperture; and applying pressurized fluid into a cavity located between a surface of the carrier and the membrane.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-05-02 | 2003-11-01 | 2004-05-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-05-02 | 2007-11-01 | 2008-05-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-05-02 | 2011-11-01 | 2012-05-02 | $7700.00 | Window Closed / Lapsed |