Patent US6046498A successfully refreshed from Google Patents.
US6046498A
Expired / Lapsed
US
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Device having a heat sink for cooling an integrated circuit
Assignee: NEC Corp
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Filing: 1998-06-26
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Granted: 2000-04-04
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Expires: 2018-06-26
Abstract
Abstract A cooling structure is provided for a multichip module on which integrated circuit devices (i.e., LSI devices) having heat-radiation surfaces are mounted, wherein there are provided a heat sink, thermal conduction blocks and thermal compounds. Recess portions are formed at a surface of the heat sink in connection with the integrated circuit devices of the multichip module. Low melting point metal material such as solder is supplied to interiors of the recess portions of the heat sink. The thermal conduction blocks are partially inserted into the interiors of the recess portions under the condition where the low melting point metal material is heated and melted, so that the thermal conduction blocks temporarily float in the melted material. To avoid heat transfer toward the integrated circuit devices, a heat insulating sheet is provided on the thermal conduction blocks. Then, the low melting point metal material is solidified, so the heat insulating sheet is removed. The thermal compounds are placed on the thermal conduction blocks. Thus, the integrated circuit devices and the thermal conduction blocks are connected together by means of the thermal compounds. Because of temporary floating of the thermal conduction blocks in the melted material, it is possible to absorb dispersion in heights and slopes of the heat-radiation surfaces of the integrated circuit devices.
Inventors
- 👤 Minoru Yoshikawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:27
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/774; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/851; H10W72/874; H10W72/877
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
167 words
A cooling structure of a multichip module on which a plurality of integrated circuit devices are mounted, said cooling structure comprising: a plurality of thermal conduction members that are respectively provided on the plurality of integrated circuit devices of the multichip module; a heat sink being provided on the multichip module, the heat sink having a plurality of recess portions which are located at positions corresponding to the plurality of thermal conduction members; a projection portion formed on the thermal conduction members, being received in each of the plurality of recess portions of the heat sink and having a shape operative to absorb dispersion in heights and slopes of heat-radiation surfaces of the integrated circuit devices; and a connecting material contained in said plurality of recess portions that connects an interior of the recess portions of the heat sink to a part of the projection portion received in the interior of the recess portions, for preventing the thermal conduction members from moving relative to the heat sink.
Claim 2
Dependent Claim
167 words
A cooling structure of a multichip module on which a plurality of integrated circuit devices are mounted, said cooling structure comprising: a plurality of thermal conduction members that are respectively provided on the plurality of integrated circuit devices of the multichip module; a heat sink being provided on the multichip module, the heat sink having a plurality of recess portions which are located at positions corresponding to the plurality of thermal conduction members; a projection portion formed on the thermal conduction members, being received in each of the plurality of recess portions of the heat sink and having a shape operative to absorb dispersion in heights and slopes of heat-radiation surfaces of the integrated circuit devices; and a connecting material contained in said plurality of recess portions that connects an interior of the recess portions of the heat sink to a part of the projection portion received in the interior of the recess portions, for preventing the thermal conduction members from moving relative to the heat sink.
Claim 3
Dependent Claim
52 words
A cooling structure of the multichip module as defined in claim 1 wherein the projecting portions have a conic shape and the interior of the recess portion of the heat sink is formed to have a conic surface matching with the conic shape of the projecting portion of the thermal conduction member.
Claim 4
Dependent Claim
52 words
A cooling structure of the multichip module as defined in claim 1 wherein the projecting portions have a hemispheric shape, and the interior of the recess portion of the heat sink is formed to have a hemispheric surface matching with the hemispheric shape of the projecting portion of the thermal conduction member.
Claim 5
Dependent Claim
18 words
A cooling structure of the multichip module as defined in claim 1 wherein the connecting material is solder.
Claim 6
Dependent Claim
79 words
A cooling structure of the multichip module as defined in claim 1, wherein the connecting material is greater in specific gravity than the thermal conduction member and the connecting material is in a melted state when it is initially provided in the recess portion so as to allow temporary floating of the thermal conduction member within the recess portion in order to adjust a positional relationship between the thermal conduction member and the recess portion of the heat sink.
Claim 7
Dependent Claim
41 words
A cooling structure of the multichip module as defined in claim 1, wherein the connecting material is lower in melting point than the thermal conduction member and has a thermal conductivity sufficient for facilitating the cooling performance of the heat sink.
Claim 8
Dependent Claim
32 words
A cooling structure of the multichip module as defined in claim 1 further comprising a second thermal conduction member, which is provided between the integrated circuit device and the thermal conduction member.
Claim 9
Dependent Claim
39 words
A cooling structure of the multichip module as defined in claim 1 further comprising a second thermal conduction member, which is provided between the integrated circuit device and the thermal conduction member, and which is made of metal material.
Claim 10
Dependent Claim
155 words
A cooling structure of a multichip module on which a plurality of integrated circuit devices having heat-radiation surfaces respectively are mounted, comprising: a heat sink having a surface at which a plurality of recess portions are formed in connection with the plurality of integrated circuit devices of the multichip module; a plurality of thermal conduction blocks, which are partially inserted into interiors of the plurality of recess portions of the heat sink respectively; solder members, which are provided in the plurality of recess portions of the heat sink respectively, wherein when the thermal conduction block is partially inserted into the interior of the recess portion, the solder member is heated and melted, then, the solder member is solidified; and a plurality of thermal compounds that are place on the plurality of thermal conduction blocks respectively, so that the integrated circuit device and the thermal conduction block are connected together by means of the thermal compound.
Claim 11
Dependent Claim
155 words
A cooling structure of a multichip module on which a plurality of integrated circuit devices having heat-radiation surfaces respectively are mounted, comprising: a heat sink having a surface at which a plurality of recess portions are formed in connection with the plurality of integrated circuit devices of the multichip module; a plurality of thermal conduction blocks, which are partially inserted into interiors of the plurality of recess portions of the heat sink respectively; solder members, which are provided in the plurality of recess portions of the heat sink respectively, wherein when the thermal conduction block is partially inserted into the interior of the recess portion, the solder member is heated and melted, then, the solder member is solidified; and a plurality of thermal compounds that are place on the plurality of thermal conduction blocks respectively, so that the integrated circuit device and the thermal conduction block are connected together by means of the thermal compound.
Claim 12
Dependent Claim
47 words
A cooling structure of the multichip module as defined in claim 9 further comprising a heat insulating sheet, which is provided on the plurality of thermal conduction blocks when the solder members are heated and melted, and which is then removed after the solder members are solidified.
Claim 13
Dependent Claim
76 words
A cooling structure of the multichip module as defined in claim 9 further comprising a heat insulating sheet, which is provided on the plurality of thermal conduction blocks when the solder members are heated and melted, and which is then removed after the solder members are solidified, and wherein the heat insulating sheet has small thermal conductivity as well as a high thermal resistance temperature which is higher than a melting temperature of the solder member.
Claim 14
Dependent Claim
41 words
A cooling structure of the multichip module as defined in claim 9 wherein the heat sink has a plurality of fins, which are formed at a surface opposite to the surface at which the plurality of integrated circuit devices are mounted.
Claim 15
Dependent Claim
36 words
A cooling structure of the multichip module as defined in claim 11 wherein the thermal conduction block is made of metal material having good thermal conductivity and is smaller in specific gravity than the solder member.
Claim 16
Dependent Claim
24 words
A cooling structure of the multichip module as defined in claim 9 wherein the thermal compound is made of silicon oil mixed with alumina-filler.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-04-04 | 2003-10-04 | 2004-04-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-04-04 | 2007-10-04 | 2008-04-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-04-04 | 2011-10-04 | 2012-04-04 | $7700.00 | Window Closed / Lapsed |