Patent US6036587A successfully refreshed from Google Patents.
US6036587A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Carrier head with layer of conformable material for a chemical mechanical polishing system
Assignee: Applied Materials Inc
•
Filing: 1996-10-10
•
Granted: 2000-03-14
•
Expires: 2016-10-10
Abstract
Abstract A carrier head for a chemical mechanical polishing apparatus. A layer of conformable material is disposed in a recess of the carrier head to provide a mounting surface for a substrate. The conformable material may be elastic and undergo normal strain in response to an applied load. The carrier head may also include a support fixture detachably connected to a backing fixture, a retaining ring connected directly to the conformable material, and a shield ring which projects over a portion of the layer of conformable material.
Inventors
- 👤 Robert D. Tolles
- 👤 Tsungan Cheng
- 👤 John Prince
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 22:58
CPC Classifications
B; B24; B24B; B24B37/00; B24B37/27; B24B37/30
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
52 words
A carrier head for positioning a substrate on a polishing surface in a chemical mechanical polishing apparatus, comprising: a base assembly having a recess; a volume of conformable material disposed in and filling the recess to provide a mounting surface for a substrate; and a retaining ring connected to the mounting surface.
Claim 2
Dependent Claim
52 words
A carrier head for positioning a substrate on a polishing surface in a chemical mechanical polishing apparatus, comprising: a base assembly having a recess; a volume of conformable material disposed in and filling the recess to provide a mounting surface for a substrate; and a retaining ring connected to the mounting surface.
Claim 3
Dependent Claim
18 words
The carrier head of claim 1 wherein the retaining ring has approximately the same thickness as the substrate.
Claim 4
Dependent Claim
24 words
The carrier head of claim 1 further comprising a shield connected to the base assembly and projecting over a portion of the conformable material.
Claim 5
Dependent Claim
15 words
The carrier head of claim 3 wherein the shield is thinner than the retaining ring.
Claim 6
Dependent Claim
13 words
The carrier head of claim 3 wherein the shield surrounds the retaining ring.
Claim 7
Dependent Claim
63 words
A carrier head for positioning a substrate on a polishing surface in a chemical mechanical polishing apparatus, comprising: a base assembly having a recess; a volume of conformable material disposed in and filling the recess to provide a mounting surface for a substrate; and a shield ring connected to the base assembly and projecting over a portion of the layer of conformable material.
Claim 8
Dependent Claim
63 words
A carrier head for positioning a substrate on a polishing surface in a chemical mechanical polishing apparatus, comprising: a base assembly having a recess; a volume of conformable material disposed in and filling the recess to provide a mounting surface for a substrate; and a shield ring connected to the base assembly and projecting over a portion of the layer of conformable material.
Claim 9
Dependent Claim
33 words
The carrier head of claim 6 wherein the base assembly has a rim surrounding the recess, and the conformable material fills the recess so that the mounting surface is flush with the rim.
Claim 10
Dependent Claim
25 words
The carrier head of claim 7 wherein an upper surface of the shield ring is adjacent the rim and is flush with the conformable material.
Claim 11
Dependent Claim
30 words
The carrier head of claim 6 the shield ring is positioned to prevent the conformable material from extruding from the recess when the substrate is pressed against the polishing surface.
Claim 12
Dependent Claim
20 words
The carrier head of claim 9, further comprising a loading mechanism to apply a downward pressure to the base assembly.
Claim 13
Dependent Claim
83 words
A carrier head for positioning a substrate on a polishing surface in a chemical mechanical polishing apparatus, comprising: a base assembly having a recess; a layer of conformable material disposed in the recess to provide a mounting surface for a substrate; and a passageway formed through the layer of conformable material to provide vacuum chucking of the substrate, wherein a diameter of the passageway is selected so that the passageway collapses when a load is applied to a substrate on the mounting surface.
Claim 14
Dependent Claim
83 words
A carrier head for positioning a substrate on a polishing surface in a chemical mechanical polishing apparatus, comprising: a base assembly having a recess; a layer of conformable material disposed in the recess to provide a mounting surface for a substrate; and a passageway formed through the layer of conformable material to provide vacuum chucking of the substrate, wherein a diameter of the passageway is selected so that the passageway collapses when a load is applied to a substrate on the mounting surface.
Claim 15
Dependent Claim
22 words
The carrier head of claim 11, wherein a pump is connected to the passageway to chuck the substrate to the mounting surface.
Claim 16
Dependent Claim
33 words
The carrier head of claim 12 wherein the passageway through the layer of conformable material has a diameter such that it does not collapse if the substrate is chucked to the mounting surface.
Claim 17
Dependent Claim
73 words
A carrier head for positioning a substrate on a polishing surface in a chemical mechanical polishing apparatus, comprising: a base assembly having a movable section and a recess; a layer of conformable material disposed in the recess to provide a mounting surface for a substrate; and a chucking mechanism to attach the substrate to the mounting surface, the chucking mechanism including an actuating mechanism connected to the movable section of the base assembly.
Claim 18
Dependent Claim
73 words
A carrier head for positioning a substrate on a polishing surface in a chemical mechanical polishing apparatus, comprising: a base assembly having a movable section and a recess; a layer of conformable material disposed in the recess to provide a mounting surface for a substrate; and a chucking mechanism to attach the substrate to the mounting surface, the chucking mechanism including an actuating mechanism connected to the movable section of the base assembly.
Claim 19
Dependent Claim
53 words
The carrier head of claim 14 wherein the movable section is positioned adjacent to the layer of conformable material and above the mounting surface, and wherein the vertical motion of the movable section forms a pocket between the substrate and the layer of conformable material to chuck the substrate to the mounting surface.
Claim 20
Independent Claim
47 words
An apparatus for use with carrier head of a chemical mechanical polishing apparatus, comprising: a module magnetically and detachably connected to the carrier head, the module including a recess; and a layer of conformable material disposed in the recess to provide a mounting surface for a substrate.
Claim 21
Independent Claim
47 words
An apparatus for use with carrier head of a chemical mechanical polishing apparatus, comprising: a module magnetically and detachably connected to the carrier head, the module including a recess; and a layer of conformable material disposed in the recess to provide a mounting surface for a substrate.
Claim 22
Dependent Claim
90 words
A carrier head for a chemical mechanical polishing apparatus, comprising: a housing; a backing fixture movably connected to the housing, a volume between the housing and backing fixture providing a pressurizable chamber; a module detachably connected to the backing fixture, the module including a rigid support fixture with a recess formed therein and a rim surrounding the recess, and a layer of conformable material disposed in and filling the recess to provide a mounting surface for a substrate, the mounting surface being flush with a bottom surface of the rim.
Claim 23
Dependent Claim
90 words
A carrier head for a chemical mechanical polishing apparatus, comprising: a housing; a backing fixture movably connected to the housing, a volume between the housing and backing fixture providing a pressurizable chamber; a module detachably connected to the backing fixture, the module including a rigid support fixture with a recess formed therein and a rim surrounding the recess, and a layer of conformable material disposed in and filling the recess to provide a mounting surface for a substrate, the mounting surface being flush with a bottom surface of the rim.
Claim 24
Dependent Claim
16 words
The carrier head of claim 17, further comprising a retaining ring connected to the mounting surface.
Claim 25
Dependent Claim
27 words
The carrier head of claim 17, further comprising a shield ring connected to the backing fixture and projecting over a portion of the layer of conformable material.
References Cited (Backward Citations)
US4132037A
Cited
US4270316A
Cited
US4519168A
Cited
US4373991A
Cited
FR2558095A1
Cited
JPS6125768A
Cited
US4669226A
Cited
US4918869A
Cited
US5081795A
Cited
US4954142A
Cited
JPH02243263A
Cited
US5255474A
Cited
US5230184A
Cited
US5193316A
Cited
US5205082A
Cited
US5441444A
Cited
US5443416A
Cited
US5584746A
Cited
US5624299A
Cited
US5423716A
Cited
US5449316A
Cited
US5733182A
Cited
US5423558A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-03-14 | 2003-09-13 | 2004-03-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-03-14 | 2007-09-13 | 2008-03-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-03-14 | 2011-09-13 | 2012-03-14 | $7700.00 | Window Closed / Lapsed |