Polishing device

Abstract

Abstract PURPOSE:To uniformize the moisture content of an elastic film, to prevent the deterioration of a wafer holding accuracy and to polish the wafer in a high shape accuracy by providing a pipe line pressure control device for controlling the air pressure of the pipe line inside communicating to the hole of the elastic film in a wafer pressurizing plate. CONSTITUTION:An air pressure inside a pipe line 3 communicating with the hole 2 group of an elastic film 1 in a wafer pressurizing plate 17 is controlled by a pipe line pressure control device 4. This air pressure is balanced with a polishing pressure, the flowout of the wafer impregnated in the elastic film 1 from the elastic film 1 is prevented and the moisture content of the elastic film 1 effected on the pressure distribution of a wafer polishing face is uniformized. Accordingly, the holding accuracy of a wafer 21 is secured within 1mum, the polishing pressure is uniformized and the wafer 21 is polished in a high shape accuracy. In this case, the pipe line pressure control device 4 is equipped with a low air pressure setting unit 10 and a low pressure measurement control device 14 for controlling this unit 10 so that the air pressure of the pipe line 3 inside becomes in a set pressure.

Inventors

• 👤 Kiyoshi Akamatsu
• 👤 潔 赤松
• 👤 Masayasu Fujisawa
• 👤 藤沢　政泰
• 👤 Takashi Shimura
• 👤 俊 志村
• 👤 Hajime Yui
• 👤 肇 油井

Bibliographic Details