Patent US6031284A successfully refreshed from Google Patents.
US6031284A
Expired / Lapsed
US
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Package body and semiconductor chip package using same
Assignee: SK Hynix Inc
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Filing: 1998-02-11
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Granted: 2000-02-29
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Expires: 2018-02-11
Abstract
Abstract A package for housing an electronic device without the use of wire bonds includes a package body with a first cavity formed in its top surface, and a second cavity formed in a bottom surface of the first cavity. A plurality of signal lines in the package body connect the bottom surface of the second cavity to the bottom surface of the package body. A semiconductor chip package incorporating the package of the present invention further includes a semiconductor chip mounted in the package body. Bonding pads on the semiconductor chip are connected to the signal lines on the bottom surface of the second cavity via electrically conductive bumps.
Inventors
- 👤 Chi-Jung Song
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:30
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W74/00; H10W74/01; H10W72/00; H10W72/071; H10W90/00; H10W90/701; H10W70/62; H10W70/65; H10W70/654; H10W70/655; H10W70/682; H10W72/072; H10W72/07251; H10W72/20; H10W72/50; H10W72/551; H10W72/552; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/941; H10W72/9415; H10W74/10; H10W74/131; H10W74/142; H10W90/721; H10W90/724; H10W90/731; H10W90/734
Claims Analysis
Total Claims: 36
Claim 1
Independent Claim
80 words
A package for housing an electronic device, comprising: a package body; a first cavity formed in a top surface of the package body; a second cavity formed in a bottom surface of the first cavity; a plurality of signal lines connecting a bottom surface of the second cavity to a bottom surface of the package body; and a plurality of first through holes extending from the bottom surface of the second cavity to the bottom surface of the package body.
Claim 2
Dependent Claim
80 words
A package for housing an electronic device, comprising: a package body; a first cavity formed in a top surface of the package body; a second cavity formed in a bottom surface of the first cavity; a plurality of signal lines connecting a bottom surface of the second cavity to a bottom surface of the package body; and a plurality of first through holes extending from the bottom surface of the second cavity to the bottom surface of the package body.
Claim 3
Dependent Claim
40 words
The package in accordance with claim 1, further comprising: a plurality of second through holes at peripheral portions of the package body and extending from the top surface of the package body to the bottom surface of the package body.
Claim 4
Dependent Claim
34 words
The package in accordance with claim 2, further comprising at least one dummy ball attached to at least one of the first and second through holes at the bottom surface of the package body.
Claim 5
Dependent Claim
36 words
The package in accordance with claim 1, further comprising a material, for improving adhesion between the package body and a molding compound, formed on a peripheral edge portion of the bottom surface of the first cavity.
Claim 6
Dependent Claim
25 words
The package in accordance with claim 4, wherein the material for improving adhesion between the package body and the molding compound comprises a metallic plate.
Claim 7
Dependent Claim
32 words
The package in accordance with claim 1, wherein portions of the signal lines are exposed at the bottom surface of the second cavity and at the bottom surface of the package body.
Claim 8
Dependent Claim
56 words
The package in accordance with claim 6, further comprising: a plurality of anisotropic conductive members attached to the exposed portions of the signal lines at the bottom surface of the second cavity; and a plurality of electrically conductive balls attached to the exposed portions of the signal lines at the bottom surface of the package body.
Claim 9
Dependent Claim
20 words
The package body in accordance with claim 1, wherein the plurality of signal lines comprise a plurality of metallic patterns.
Claim 10
Dependent Claim
96 words
A semiconductor chip package, comprising: a package body; a first cavity formed in a top surface of the package body; a second cavity formed in a bottom surface of the first cavity; a plurality of signal lines connecting a bottom surface of the second cavity to a bottom surface of the package body; a semiconductor chip having a plurality of bonding pads attached thereon; a plurality of electrically conductive bumps coupling the bonding pads to corresponding ones of the signal lines; and a plurality of anisotropic conductive members attached to exposed portions of the signal lines.
Claim 11
Dependent Claim
96 words
A semiconductor chip package, comprising: a package body; a first cavity formed in a top surface of the package body; a second cavity formed in a bottom surface of the first cavity; a plurality of signal lines connecting a bottom surface of the second cavity to a bottom surface of the package body; a semiconductor chip having a plurality of bonding pads attached thereon; a plurality of electrically conductive bumps coupling the bonding pads to corresponding ones of the signal lines; and a plurality of anisotropic conductive members attached to exposed portions of the signal lines.
Claim 12
Dependent Claim
19 words
The semiconductor chip package in accordance with claim 9, further comprising a filing agent formed in the second cavity.
Claim 13
Dependent Claim
28 words
The semiconductor chip package in accordance with claim 10, wherein an upper surface of the filling agent is substantially co-planer with the bottom surface of the first cavity.
Claim 14
Dependent Claim
19 words
The semiconductor chip package in accordance with claim 9, further comprising a molding compound formed in the first cavity.
Claim 15
Dependent Claim
38 words
The semiconductor chip package in accordance with claim 12, further comprising a material, for improving adhesion between the package body and the molding compound, formed on a peripheral edge portion of the bottom surface of the first cavity.
Claim 16
Dependent Claim
35 words
The package in accordance with claim 13, wherein the molding compound comprises an epoxy molding compound, and wherein the material for improving adhesion between the package body and the molding compound comprises a metallic plate.
Claim 17
Dependent Claim
24 words
The semiconductor chip package in accordance with claim 12, wherein a top surface of the semiconductor chip is not covered by the molding compound.
Claim 18
Dependent Claim
40 words
The semiconductor chip package in accordance with claim 15, wherein the top surface of the semiconductor chip, a peripheral edge portion of the top surface of the package body and a top surface of the molding compound are substantially co-planar.
Claim 19
Dependent Claim
34 words
The semiconductor chip package in accordance with claim 9, wherein portions of the signal lines are exposed at the bottom surface of the second cavity and at the bottom surface of the package body.
Claim 20
Dependent Claim
32 words
The semiconductor chip package of claim 17 further comprising: a plurality of electrically conductive balls attached to the exposed portions of the signal lines at the bottom surface of the package body.
Claim 21
Dependent Claim
66 words
The semiconductor chip package in accordance with claim 9, further comprising: a plurality of first through holes extending from the bottom surface of the second cavity to the bottom surface of the package body; and a plurality of second through holes at peripheral portions of the package body and extending from the top surface of the package body to the bottom surface of the package body.
Claim 22
Dependent Claim
36 words
The semiconductor chip package in accordance with claim 19, further comprising at least one dummy ball attached to at least one of the first and second through holes at the bottom surface of the package body.
Claim 23
Dependent Claim
21 words
The semiconductor chip package in accordance with claim 9, wherein the plurality of signal lines comprise a plurality of metallic patterns.
Claim 24
Dependent Claim
64 words
A package for housing an electronic device comprising: a package body; a cavity formed in a top surface of the package body; a plurality of signal lines connecting a bottom surface of the cavity to a bottom surface of the package body; and a material, for improving adhesion between the package body and a molding compound, formed on a bottom surface of the cavity.
Claim 25
Dependent Claim
64 words
A package for housing an electronic device comprising: a package body; a cavity formed in a top surface of the package body; a plurality of signal lines connecting a bottom surface of the cavity to a bottom surface of the package body; and a material, for improving adhesion between the package body and a molding compound, formed on a bottom surface of the cavity.
Claim 26
Dependent Claim
25 words
The package in accordance with claim 22, wherein the material for improving adhesion between the package body and the molding compound comprises a metallic plate.
Claim 27
Dependent Claim
36 words
The package in accordance with claim 23, wherein the cavity comprises: a first recess formed in a top surface of the package body; and a second recess formed in a bottom surface of the first recess.
Claim 28
Dependent Claim
29 words
The package in accordance with claim 24, wherein the plurality of signal lines connect a bottom surface of the second recess to a bottom surface of the package body.
Claim 29
Dependent Claim
36 words
The package in accordance with claim 24, wherein the material for improving adhesion between the package body and the molding compound is formed on a peripheral edge portion of the bottom surface of the first recess.
Claim 30
Dependent Claim
89 words
A package for housing an electronic device comprising: a package body; a cavity formed in a top surface in a package body; a plurality of signal lines connecting a bottom surface of the cavity to a bottom surface of the package body, wherein portions of the signal lines are exposed at the bottom surface of the cavity and at the bottom surface of the package body; and a plurality of anisotropic conductive members attached to the exposed portions of the signal lines at the bottom surface of the cavity.
Claim 31
Dependent Claim
89 words
A package for housing an electronic device comprising: a package body; a cavity formed in a top surface in a package body; a plurality of signal lines connecting a bottom surface of the cavity to a bottom surface of the package body, wherein portions of the signal lines are exposed at the bottom surface of the cavity and at the bottom surface of the package body; and a plurality of anisotropic conductive members attached to the exposed portions of the signal lines at the bottom surface of the cavity.
Claim 32
Dependent Claim
36 words
The package in accordance with claim 27, wherein the cavity comprises: a first recess formed in a top surface of the package body; and a second recess formed in a bottom surface of the first recess.
Claim 33
Dependent Claim
29 words
The package in accordance with claim 28, wherein the plurality of signal lines connect a bottom surface of the second recess to a bottom surface of the package body.
Claim 34
Dependent Claim
32 words
The package in accordance with claim 27, further comprising a plurality of electrically conductive balls attached to the exposed portions of the signal lines at the bottom surface of the package body.
Claim 35
Dependent Claim
146 words
A package for housing an electronic device, comprising: a package body; a cavity formed in a top surface of the package body; a plurality of signal lines connecting a bottom surface of the cavity to a bottom surface of the package body, wherein portions of the signal lines are exposed at the bottom surface of the cavity and at the bottom surface of the package body; a plurality of first through holes extending from the bottom surface of the second cavity to the bottom surface of the package body; a plurality of second through holes at peripheral portions of the package body and extending from the top surface of the package body to the bottom surface of the package body; and at least one dummy ball attached to at least one of the first and second through holes at the bottom surface of the package body.
Claim 36
Dependent Claim
146 words
A package for housing an electronic device, comprising: a package body; a cavity formed in a top surface of the package body; a plurality of signal lines connecting a bottom surface of the cavity to a bottom surface of the package body, wherein portions of the signal lines are exposed at the bottom surface of the cavity and at the bottom surface of the package body; a plurality of first through holes extending from the bottom surface of the second cavity to the bottom surface of the package body; a plurality of second through holes at peripheral portions of the package body and extending from the top surface of the package body to the bottom surface of the package body; and at least one dummy ball attached to at least one of the first and second through holes at the bottom surface of the package body.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-02-28 | 2003-08-30 | 2004-02-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-02-28 | 2007-08-30 | 2008-02-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-02-28 | 2011-08-30 | 2012-02-29 | $7700.00 | Window Closed / Lapsed |