Integrated circuit package and compact assemblies thereof

Claim 1

An assembly of electrically interconnectable integrated circuit packages comprising: (a) a plurality of rectangular integrated circuit packages, each package comprising: (1) a thermally conductive plate for supporting an integrated circuit, (2) an open rectangular structure having a central opening, exterior transverse surfaces and interior peripheral surfaces with respect to said opening and parallel lateral surfaces, said rectangular structure mounted on said conductive plate with said interior peripheral surfaces positioned for extending around the periphery of an integrated circuit, (3) at least one interior peripheral surface presenting at least one linear array of contact means for interconnection with contacts on said integrated circuit, each of said contact means provided with electrical connection means extending laterally through said rectangular structure to a respective exterior transverse surface and each of said contact means provided with electrical connection means extending transversely through said rectangular structure to the overlying lateral surface, (b) alignment means for aligning said plurality of rectangular packages stacked with their exterior transverse surfaces aligned to form one or more contact planes; and (c) interconnect means disposed between successive stacked packages for interconnecting transverse contacts on the top lateral surface of each package with the bottom lateral surface of any next successive package whereby said stacked packages in said assembly are electrically interconnectable.