Claims Analysis
Total Claims: 70
Claim 1
Independent Claim
139 words
An inductively coupled plasma reactor for processing a substrate in a reactor chamber containing a process gas, comprising: an inductively coupled coil antenna, said coil antenna comprising plural inductive antenna loops adjacent different portions of said chamber and which are electrically separate from one another; plural RF impedance match networks each connected to respective ones of the antenna loops; plural RF power level adjusting circuits each connected to a respective one of the RF match networks and being capable of changing and setting an RF power level; an RF power distribution controller connected to each of the RF power level adjusting circuits, said controller being capable of simultaneously controlling each of the RF power level adjusting circuits to individually govern the RF power levels to provide a uniform plasma ion density distribution across the top surface of the substrate.
Claim 2
Dependent Claim
139 words
An inductively coupled plasma reactor for processing a substrate in a reactor chamber containing a process gas, comprising: an inductively coupled coil antenna, said coil antenna comprising plural inductive antenna loops adjacent different portions of said chamber and which are electrically separate from one another; plural RF impedance match networks each connected to respective ones of the antenna loops; plural RF power level adjusting circuits each connected to a respective one of the RF match networks and being capable of changing and setting an RF power level; an RF power distribution controller connected to each of the RF power level adjusting circuits, said controller being capable of simultaneously controlling each of the RF power level adjusting circuits to individually govern the RF power levels to provide a uniform plasma ion density distribution across the top surface of the substrate.
Claim 3
Dependent Claim
29 words
The reactor of claim 1 further comprising RF power circuitry connected to said plural inductive antenna loops that generates an RF power signal from a common RF power generator.
Claim 4
Dependent Claim
23 words
The reactor of claim 1 further comprising plural RF power generators, each of said RF power generators generating a respective RF power signal.
Claim 5
Dependent Claim
19 words
The reactor of claim 3, wherein at least two of said respective RF power signals are a different frequency.
Claim 6
Dependent Claim
28 words
The reactor of claim 1 wherein said RF power level adjusting circuits comprises plural variable reactance elements connected in series with respective ones of said independent antenna loops.
Claim 7
Dependent Claim
26 words
The reactor of claim 1 wherein said reactor comprises: a ceiling, wherein said plural independent antenna loops are disposed over said ceiling; and a wafer pedestal.
Claim 8
Dependent Claim
36 words
The reactor of claim 6 wherein said plural independent antenna loops comprise respective conductors wound around respective loop axes, all of said respective loop axes being coincident with an axis of symmetry of said wafer pedestal.
Claim 9
Dependent Claim
28 words
The reactor of claim 7 wherein said reactor ceiling is dome-shaped and wherein said axis of symmetry is coincident with an axis of symmetry of said dome-shaped ceiling.
Claim 10
Dependent Claim
30 words
The reactor of claim 8 wherein said antenna loops are centered at intervals along plural radii of said dome-shaped ceiling, said plural radii being centered relative to said wafer pedestal.
Claim 11
Dependent Claim
10 words
The reactor of claim 9 wherein said intervals are uniform.
Claim 12
Dependent Claim
41 words
The reactor of claim 6 wherein said plural independent antenna loops comprise respective conductors wound around respective loop axes, said respective loop axes being distributed among different points over said ceiling, said loops having diameters less than that of said wafer.
Claim 13
Dependent Claim
36 words
The reactor of claim 11 wherein said diameters are a relatively small fraction of the diameter of said wafer whereby each loop primarily affects a plasma ion density at a small local region over said wafer.
Claim 14
Dependent Claim
168 words
A plasma reactor for processing a substrate in a reactor chamber containing a process gas, comprising: a coil antenna including plural antenna loops adjacent respective different portions of said chamber, said loops being in parallel with each other electrically, and adapted to establish a plasma within said chamber primarily by inductive coupling; plural RF impedance match networks each connected to respective ones of the antenna loops; a plurality of RF power level adjustors connected to respective ones of the RF impedance match network, said RF power level adjustors connected in series with said antenna loops, each of said RF power level adjustors also adapted to be connected to a source of RF power and being independently controllable with respect to the remaining RF power level adjustors to provide a desired plasma characteristic; an RF power distribution controller wherein each of said RF power level adjustors responds to an adjustment signal from said controller to adjust the power to each antenna loop to achieve a predetermined desired plasma characteristic.
Claim 15
Dependent Claim
168 words
A plasma reactor for processing a substrate in a reactor chamber containing a process gas, comprising: a coil antenna including plural antenna loops adjacent respective different portions of said chamber, said loops being in parallel with each other electrically, and adapted to establish a plasma within said chamber primarily by inductive coupling; plural RF impedance match networks each connected to respective ones of the antenna loops; a plurality of RF power level adjustors connected to respective ones of the RF impedance match network, said RF power level adjustors connected in series with said antenna loops, each of said RF power level adjustors also adapted to be connected to a source of RF power and being independently controllable with respect to the remaining RF power level adjustors to provide a desired plasma characteristic; an RF power distribution controller wherein each of said RF power level adjustors responds to an adjustment signal from said controller to adjust the power to each antenna loop to achieve a predetermined desired plasma characteristic.
Claim 16
Dependent Claim
23 words
A plasma reactor as in claim 13 in which each antenna loop is provided with a respective one of said power level adjustors.
Claim 17
Dependent Claim
22 words
A plasma reactor as in claim 13 in which a single source of RF power supplies each of said power level adjustors.
Claim 18
Dependent Claim
19 words
A plasma reactor as in claim 13 in which each of said loops has a central axis of symmetry.
Claim 19
Dependent Claim
21 words
A plasma reactor as in claim 16 in which each said axis of symmetry is spaced from every other such axis.
Claim 20
Dependent Claim
21 words
A plasma reactor as in claim 16 in which at least two of said axes of symmetry coincide with each other.
Claim 21
Dependent Claim
17 words
A plasma reactor as in claim 13 in which each of said adjustors includes an adjustable reactance.
Claim 22
Independent Claim
193 words
A method for processing a substrate in a reactor chamber containing a process gas, comprising: coupling RF power into said chamber using an RF radiator comprising plural conductive elements which are electrically separated from one another and distributed at respective locations adjacent said chamber, each of said plural conductive elements connected to a respective one of a plural RF impedance match network, said coupling of RF power by employing plural RF power level adjusting circuits, each of the adjusting circuits being connected to a respective one of the RF impedance match networks and connected to receive respective RF power signals, respective RF power signals being provided by an RF power generator, each of the RF power level adjusting circuits further being capable of changing and setting an RF power level of the RF power signal; and simultaneously controlling each of the RF power level adjusting circuits to individually govern the RF power level of each of the RF power signals so as to control the plasma ion density distribution across the top surface of the substrate by employing an RF power distribution controller connected to each of the RF power level adjusting circuits.
Claim 23
Independent Claim
193 words
A method for processing a substrate in a reactor chamber containing a process gas, comprising: coupling RF power into said chamber using an RF radiator comprising plural conductive elements which are electrically separated from one another and distributed at respective locations adjacent said chamber, each of said plural conductive elements connected to a respective one of a plural RF impedance match network, said coupling of RF power by employing plural RF power level adjusting circuits, each of the adjusting circuits being connected to a respective one of the RF impedance match networks and connected to receive respective RF power signals, respective RF power signals being provided by an RF power generator, each of the RF power level adjusting circuits further being capable of changing and setting an RF power level of the RF power signal; and simultaneously controlling each of the RF power level adjusting circuits to individually govern the RF power level of each of the RF power signals so as to control the plasma ion density distribution across the top surface of the substrate by employing an RF power distribution controller connected to each of the RF power level adjusting circuits.
Claim 24
Dependent Claim
17 words
The method of claim 20, wherein respective RF power signals are generated by plural RF power generators.
Claim 25
Dependent Claim
18 words
The method of claim 21, wherein at least two of said plural RF power generators generate different frequencies.
Claim 26
Dependent Claim
161 words
A plasma reactor for processing a substrate, comprising: an RF radiator capable of coupling power into a processing chamber, said radiator comprising plural conductive elements adjacent different portions of the chamber which are electrically separate from one another; plural RF impedance match networks each connected to respective ones of the plural conductive elements; plural RF power level adjusting circuits each connected to a respective one of the RF impedance match networks and connected to receive respective RF power signals, each of the RF power level adjusting circuits being capable of changing and setting an RF power level of the RF power signal; an RF power distribution controller connected to each of the RF power level adjusting circuits, said controller being capable of simultaneously controlling each of the RF power level adjusting circuits to individually govern the RF power level of each of the RF power signals to provide a uniform plasma ion density distribution across the top surface of the substrate.
Claim 27
Dependent Claim
161 words
A plasma reactor for processing a substrate, comprising: an RF radiator capable of coupling power into a processing chamber, said radiator comprising plural conductive elements adjacent different portions of the chamber which are electrically separate from one another; plural RF impedance match networks each connected to respective ones of the plural conductive elements; plural RF power level adjusting circuits each connected to a respective one of the RF impedance match networks and connected to receive respective RF power signals, each of the RF power level adjusting circuits being capable of changing and setting an RF power level of the RF power signal; an RF power distribution controller connected to each of the RF power level adjusting circuits, said controller being capable of simultaneously controlling each of the RF power level adjusting circuits to individually govern the RF power level of each of the RF power signals to provide a uniform plasma ion density distribution across the top surface of the substrate.
Claim 28
Dependent Claim
30 words
The reactor of claim 23 further comprising: plural RF power generators providing said respective RF power signals, wherein at least two of said respective RF power signals are different frequencies.
Claim 29
Dependent Claim
193 words
An inductively coupled plasma reactor for processing a substrate, comprising: a wafer pedestal; an inductively coupled coil antenna, said coil antenna comprising plural inductive antenna loops adjacent different portions of said chamber and which are electrically separate from one another; said plural inductive antenna loops comprising respective conductors wound around respective loop axes, all of said respective loop axes being coincident with an axis of symmetry of said wafer pedestal; plural RF impedance match networks each connected to respective ones of the antenna loops; plural RF power level adjusting circuits each connected to a respective one of the RF impedance match networks and connected to receive respective RF power signals, each of the RF power level adjusting circuits being capable of changing and setting an RF power level of the RF power signal; and an RF power distribution controller connected to each of the RF power level adjusting circuits, said controller being capable of simultaneously controlling each of the RF power level adjusting circuits to individually govern the RF power level of each of the RF power signals to provide a uniform plasma ion density distribution across the top surface of the substrate.
Claim 30
Dependent Claim
193 words
An inductively coupled plasma reactor for processing a substrate, comprising: a wafer pedestal; an inductively coupled coil antenna, said coil antenna comprising plural inductive antenna loops adjacent different portions of said chamber and which are electrically separate from one another; said plural inductive antenna loops comprising respective conductors wound around respective loop axes, all of said respective loop axes being coincident with an axis of symmetry of said wafer pedestal; plural RF impedance match networks each connected to respective ones of the antenna loops; plural RF power level adjusting circuits each connected to a respective one of the RF impedance match networks and connected to receive respective RF power signals, each of the RF power level adjusting circuits being capable of changing and setting an RF power level of the RF power signal; and an RF power distribution controller connected to each of the RF power level adjusting circuits, said controller being capable of simultaneously controlling each of the RF power level adjusting circuits to individually govern the RF power level of each of the RF power signals to provide a uniform plasma ion density distribution across the top surface of the substrate.
Claim 31
Dependent Claim
34 words
The reactor of claim 25 further comprising RF power circuitry connected to said plural RF power level adjusting circuits, said RF power circuitry generating said respective RF power signals from a common RF generator.
Claim 32
Dependent Claim
28 words
The reactor of claim 26 wherein said RF power level adjusting circuits comprise plural variable reactance elements connected in series with respective ones of said independent antenna loops.
Claim 33
Dependent Claim
17 words
The reactor of claim 25 further comprising plural RF power generators generating said respective RF power signals.
Claim 34
Dependent Claim
19 words
The reactor of claim 28 wherein at least two of said respective RF power signals are of different frequencies.
Claim 35
Dependent Claim
23 words
The reactor of claim 25 wherein said reactor further comprises a ceiling, wherein said plural independent antenna loops are disposed over said ceiling.
Claim 36
Dependent Claim
28 words
The reactor of claim 30 wherein said reactor ceiling is dome-shaped and wherein said axis of symmetry is coincident with an axis of symmetry of said dome-shaped ceiling.
Claim 37
Dependent Claim
34 words
The reactor of claim 25 further comprising RF power circuitry connected to said plural RF power level adjusting circuits, said RF power circuitry generating said respective RF power signal from a common RF generator.
Claim 38
Dependent Claim
28 words
The reactor of claim 32 wherein said RF power level adjusting circuits comprise plural variable reactance elements connected in series with respective ones of said independent antenna loops.
Claim 39
Dependent Claim
17 words
The reactor of claim 25 further comprising plural RF power generators generating said respective RF power signals.
Claim 40
Dependent Claim
19 words
The reactor of claim 34 wherein at least two of said respective RF power signals are of different frequencies.
Claim 41
Dependent Claim
23 words
The reactor of claim 25 wherein said reactor further comprises a ceiling, wherein said plural independent antenna loops are disposed over said ceiling.
Claim 42
Dependent Claim
27 words
The reactor of claim 36 wherein said ceiling is dome-shaped and wherein said axis of symmetry is coincident with an axis of symmetry of said dome-shaped ceiling.
Claim 43
Dependent Claim
99 words
A plasma reactor for processing a workpiece, comprising: a processing chamber; a workpiece support disposed within said processing chamber; a dome-shaped ceiling overlying said workpiece support; an RF radiator comprising plural conductive elements that are electrically separate from each other, said plural conductive elements adjacent different portions of said processing chamber; an RF power distribution controller connected to respective ones of said plural conductive elements, said RF power distribution controller capable of simultaneously controlling an RF power level to each one of said plural conductive elements so as to provide a uniform plasma ion density distribution across the workpiece.
Claim 44
Dependent Claim
99 words
A plasma reactor for processing a workpiece, comprising: a processing chamber; a workpiece support disposed within said processing chamber; a dome-shaped ceiling overlying said workpiece support; an RF radiator comprising plural conductive elements that are electrically separate from each other, said plural conductive elements adjacent different portions of said processing chamber; an RF power distribution controller connected to respective ones of said plural conductive elements, said RF power distribution controller capable of simultaneously controlling an RF power level to each one of said plural conductive elements so as to provide a uniform plasma ion density distribution across the workpiece.
Claim 45
Dependent Claim
22 words
The reactor of claim 38 further comprising plural RF impedance match networks each connected to respective ones of said plural conductive elements.
Claim 46
Dependent Claim
47 words
The reactor of claim 39, further comprising plural RF power level adjusting circuits each connected to said plural RF impedance match networks and to said RF power distribution controller, each of said plural RF power level adjusting circuits capable of changing and setting said RF power level.
Claim 47
Dependent Claim
31 words
The reactor of claim 40 wherein each of said plural RF power level adjusting circuits comprises plural variable reactance elements connected in series with respective ones of said plural conductive elements.
Claim 48
Dependent Claim
28 words
The reactor of claim 38 further comprising RF power circuitry connected to said plural conductive elements that generates an RF power signal from a common RF power generator.
Claim 49
Dependent Claim
17 words
The reactor of claim 38 further comprising plural RF power generators each generating an RF power signal.
Claim 50
Dependent Claim
19 words
The reactor of claim 43, wherein at least two of said plural RF power signals are at different frequencies.
Claim 51
Dependent Claim
29 words
The reactor of claim 38 wherein said plural conductive elements comprise respective conductors wound around respective axes that are coincident with an axis of symmetry of said workpiece support.
Claim 52
Dependent Claim
21 words
The reactor of claim 45, wherein said axis of symmetry is coincident with an axis of symmetry of said dome-shaped ceiling.
Claim 53
Dependent Claim
33 words
The reactor of claim 46, wherein each of said plural conductive elements are centered at intervals along plural radii of said dome-shaped ceiling, said plural radii being centered relative to said workpiece support.
Claim 54
Dependent Claim
47 words
The reactor of claim 38, wherein said plural conductive elements comprise respective conductors wound around respective axes, said respective axes being distributed among different points over said dome-shaped ceiling, and wherein each of said plural conductive elements have a diameter less than a diameter of said workpiece.
Claim 55
Dependent Claim
42 words
The reactor of claim 48, wherein said plural conductive element diameters are a relatively small fraction of said workpiece diameter whereby each one of said plural conductive elements primarily affects a plasma ion density at a small local region over said workpiece.
Claim 56
Dependent Claim
10 words
The reactor of claim 49, wherein said intervals are uniform.
Claim 57
Independent Claim
104 words
A method of processing a workpiece, comprising: coupling RF power into a processing chamber, said processing chamber having a workpiece support therein and a dome-shaped ceiling overlying said workpiece support, using an RF radiator comprising plural conductive elements that are electrically separate from each other and distributed at different locations adjacent said processing chamber, each of said plural conductive elements connected to an RF power distribution controller; and simultaneously controlling an RF power level to each one of said plural conductive elements using said RF power distribution controller so as to control the plasma ion density distribution across the top surface of the workpiece.
Claim 58
Independent Claim
104 words
A method of processing a workpiece, comprising: coupling RF power into a processing chamber, said processing chamber having a workpiece support therein and a dome-shaped ceiling overlying said workpiece support, using an RF radiator comprising plural conductive elements that are electrically separate from each other and distributed at different locations adjacent said processing chamber, each of said plural conductive elements connected to an RF power distribution controller; and simultaneously controlling an RF power level to each one of said plural conductive elements using said RF power distribution controller so as to control the plasma ion density distribution across the top surface of the workpiece.
Claim 59
Dependent Claim
22 words
The method of claim 51, further comprising plural RF impedance match networks each connected to respective ones of said plural conductive elements.
Claim 60
Dependent Claim
47 words
The method of claim 52, further comprising plural RF power level adjusting circuits each connected to said plural RF impedance match networks and to said RF power distribution controller, each of said plural RF power level adjusting circuits capable of changing and setting said RF power level.
Claim 61
Dependent Claim
31 words
The method of claim 53, wherein each of said plural RF power level adjusting circuits comprise plural variable reactance elements connected in series with respective ones of said plural conductive elements.
Claim 62
Dependent Claim
28 words
The method of claim 51 further comprising RF power circuitry connected to said plural conductive elements that generate an RF power signal from a common RF power generator.
Claim 63
Dependent Claim
17 words
The method of claim 51 further comprising plural RF power generators each generating an RF power signal.
Claim 64
Dependent Claim
19 words
The method of claim 56, wherein at least two of said plural RF power signals are at different frequencies.
Claim 65
Dependent Claim
29 words
The method of claim 51, wherein said plural conductive elements comprise respective conductors wound around respective axes that are coincident with an axis of symmetry of said workpiece support.
Claim 66
Dependent Claim
21 words
The method of claim 58, wherein said axis of symmetry is coincident with an axis of symmetry of said dome-shaped ceiling.
Claim 67
Dependent Claim
33 words
The method of claim 59, wherein each of said plural conductive elements are centered at intervals along plural radii of said dome-shaped ceiling, said plural radii being centered relative to said workpiece support.
Claim 68
Dependent Claim
47 words
The method of claim 51, wherein said plural conductive elements comprise respective conductors wound around respective axes, said respective axes being distributed among different points over said dome-shaped ceiling, and wherein each of said plural conductive elements have a diameter less that a diameter of said workpiece.
Claim 69
Dependent Claim
41 words
The method of claim 61, wherein said plural conductive elements diameters are a relatively small fraction of said workpiece diameter whereby each one of said plural conductive elements primarily affects a plasma density at a small local region over said workpiece.
Claim 70
Dependent Claim
10 words
The method of claim 62, wherein said intervals are uniform.