US6013944A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device in which chip electrodes are connected to terminals arranged along the periphery of an insulative board
Assignee: Socionext Inc
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Filing: 1997-08-18
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Granted: 2000-01-11
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Expires: 2017-08-18
Abstract
Abstract A semiconductor device including a semiconductor chip; a plurality of electrodes provided on a surface of the semiconductor chip; an insulative board which includes a plurality of conductive patterns, one end of each of the plurality of conductive patterns being protruded from a periphery of the insulative board so as to function as an outer terminal; a connecting element for electrically connecting the outer terminal to a corresponding one of the plurality of electrodes; and a conductive element which is in electrical contact with a corresponding one of the plurality of conductive patterns.
Inventors
- 👤 Susumu Moriya
- 👤 Norio Fukasawa
- 👤 Shirou Youda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 04:10
CPC Classifications
H; H10; H10W; H10W74/00; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/073; H10W72/20; H10W72/851; H10W72/853; H10W72/865; H10W72/90; H10W72/941; H10W72/9415; H10W74/10; H10W74/15; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
94 words
A semiconductor device comprising: a semiconductor chip; a plurality of electrodes provided on a surface of said semiconductor chip; an insulative board which includes a plurality of conductive patterns, one end of each of said plurality of conductive patterns protruding laterally from a peripheral edge of said insulative board so as to finction as an outer terminal; a connecting means for electrically connecting said outer terminal to a corresponding one of said plurality of electrodes; and a conductive element which is in electrical contact with a corresponding one of said plurality of conductive patterns.
Claim 2
Dependent Claim
94 words
A semiconductor device comprising: a semiconductor chip; a plurality of electrodes provided on a surface of said semiconductor chip; an insulative board which includes a plurality of conductive patterns, one end of each of said plurality of conductive patterns protruding laterally from a peripheral edge of said insulative board so as to finction as an outer terminal; a connecting means for electrically connecting said outer terminal to a corresponding one of said plurality of electrodes; and a conductive element which is in electrical contact with a corresponding one of said plurality of conductive patterns.
Claim 3
Dependent Claim
39 words
The semiconductor device as claimed in claim 1, wherein said insulative board is provided on said surface of said semiconductor chip so that peripheral portions of said insulative board are positioned in the vicinity of said plurality of electrodes.
Claim 4
Dependent Claim
23 words
The semiconductor device as claimed in claim 2, wherein an elastic adhesive layer is provided between said insulative board and said semiconductor chip.
Claim 5
Dependent Claim
37 words
The semiconductor device as claimed in claim 1, wherein a land having a greater width than said plurality of conductive patterns is provided at an end portion of a corresponding one of said plurality of conductive patterns.
Claim 6
Dependent Claim
26 words
The semiconductor device as claimed in claim 4, wherein a plurality of opening portions are provided in said insulative board corresponding to positions of said land.
Claim 7
Dependent Claim
52 words
The semiconductor device as claimed in claim 5, wherein said conductive element is a bump, a portion of said bump being embedded in a corresponding one of said plurality of opening portions so as to be in contact with said land and another portion of said bump protecting from said insulative board.
Claim 8
Dependent Claim
20 words
The semiconductor device as claimed in claim 1, wherein said plurality of conductive patterns are embedded in said insulative board.
Claim 9
Dependent Claim
17 words
The semiconductor device as claimed in claim 1, wherein said outer terminal is in a curved shape.
Claim 10
Dependent Claim
34 words
The semiconductor device as claimed in claim 1, wherein said insulative board includes a central hole and slits extending from said periphery of said insulative board toward a center portion of said insulative board.
Claim 11
Dependent Claim
32 words
The semiconductor device as claimed in claim 1, wherein said outer terminal has a bent shape so as to be in electrical contact with a corresponding one of said plurality of electrodes.
Claim 12
Dependent Claim
30 words
The semiconductor device as claimed in claim 1, wherein a sealing resin is provided on a portion connecting said outer terminal to a corresponding one of said plurality of electrodes.
Claim 13
Dependent Claim
105 words
A semiconductor device comprising: a semiconductor chip; a plurality of electrodes provided on a surface of said semiconductor chip; an insulative board which includes a plurality of conductive patterns, one end of each of said plurality of conductive patterns being exposed at a side surface of said insulative board so as to function as an outer terminal wherein said side surface of said insulative board is contained within an inner region with respect to said plurality of electrodes provided in said surface of said semiconductor chip; and a connecting means for electrically connecting said outer terminal to a corresponding one of said plurality of electrodes.
Claim 14
Dependent Claim
105 words
A semiconductor device comprising: a semiconductor chip; a plurality of electrodes provided on a surface of said semiconductor chip; an insulative board which includes a plurality of conductive patterns, one end of each of said plurality of conductive patterns being exposed at a side surface of said insulative board so as to function as an outer terminal wherein said side surface of said insulative board is contained within an inner region with respect to said plurality of electrodes provided in said surface of said semiconductor chip; and a connecting means for electrically connecting said outer terminal to a corresponding one of said plurality of electrodes.
Claim 15
Dependent Claim
39 words
The semiconductor device as claimed in claim 12, wherein said insulative board is provided on said surface of said semiconductor chip so that peripheral portions of said insulative board are positioned in the vicinity of said plurality of electrodes.
Claim 16
Dependent Claim
23 words
The semiconductor device as claimed in claim 13, wherein an elastic adhesive layer is provided between said insulative board and said semiconductor chip.
Claim 17
Dependent Claim
30 words
The semiconductor device as claimed in claim 12, wherein a sealing resin is provided on a portion connecting said outer terminal to a corresponding one of said plurality of electrodes.
References Cited (Backward Citations)
US4918511A
Cited
US5302854A
Cited
US5148265A
Cited
US5293067A
Cited
US5258648A
Cited
US5703405A
Cited
US5510758A
Cited
US5528458A
Cited
US5677575A
Cited
US5659952A
Cited
US5616958A
Cited
US5874784A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-01-10 | 2003-07-12 | 2004-01-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-01-10 | 2007-07-12 | 2008-01-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-01-10 | 2011-07-12 | 2012-01-11 | $7700.00 | Window Closed / Lapsed |