US5703405A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit chip formed from processing two opposing surfaces of a wafer
Assignee: NXP USA Inc
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Filing: 1996-01-16
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Granted: 1997-12-30
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Expires: 2016-01-16
Abstract
Abstract An integrated circuit chip (100) includes an integrated circuit die (105) having first and second opposing surfaces (110, 115). A first integrated circuit (205) is formed on the first surface (110), and has a first plurality of terminals (200) coupled thereto for connection to first circuitry external to the integrated circuit chip (100), wherein the first plurality of terminals (200) is formed on the first surface (110). A second integrated circuit (300) is formed on the second surface (115), is electrically isolated from the first integrated circuit (205), and has a second plurality of terminals (305) coupled thereto for connection to second circuitry external to the integrated circuit chip (100). The second plurality of terminals (305) is formed on the first surface (110) and is coupled to the second integrated circuit (300) via plated holes formed through the integrated circuit die (105). The second plurality of terminals (300) is electrically isolated from the first plurality of terminals (200) and the first integrated circuit (205).
Inventors
- 👤 Kenneth Arthur Zeber
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 15:54
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/20; H10W99/00; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/50; H10W72/541; H10W72/5445; H10W72/5449; H10W72/851; H10W72/874; H10W72/879; H10W74/00; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
151 words
An integrated circuit chip, comprising: an integrated circuit die having first and second opposing surfaces; a first integrated circuit formed on the first surface, the first integrated circuit having a first plurality of terminals coupled thereto for connection to first circuitry external to the integrated circuit chip, wherein the first plurality of terminals is formed on the first surface; and a second integrated circuit formed on the second surface, the second integrated circuit electrically isolated from the first integrated circuit, the second integrated circuit having a second plurality of terminals coupled thereto for connection to second circuitry external to the integrated circuit chip, wherein the second plurality of terminals is formed on the first surface and coupled to the second integrated circuit via plated holes formed through the integrated circuit die, wherein the second plurality of terminals is electrically isolated from the first plurality of terminals and the first integrated circuit.
Claim 2
Dependent Claim
151 words
An integrated circuit chip, comprising: an integrated circuit die having first and second opposing surfaces; a first integrated circuit formed on the first surface, the first integrated circuit having a first plurality of terminals coupled thereto for connection to first circuitry external to the integrated circuit chip, wherein the first plurality of terminals is formed on the first surface; and a second integrated circuit formed on the second surface, the second integrated circuit electrically isolated from the first integrated circuit, the second integrated circuit having a second plurality of terminals coupled thereto for connection to second circuitry external to the integrated circuit chip, wherein the second plurality of terminals is formed on the first surface and coupled to the second integrated circuit via plated holes formed through the integrated circuit die, wherein the second plurality of terminals is electrically isolated from the first plurality of terminals and the first integrated circuit.
Claim 3
Dependent Claim
173 words
An electronic assembly, comprising: a circuit carrying substrate having first and second pluralities of contacts formed thereon; and an integrated circuit chip mounted on the circuit carrying substrate, the integrated circuit chip comprising: an integrated circuit die having first and second opposing surfaces; a first integrated circuit formed on the first surface, the first integrated circuit having a first plurality of terminals coupled thereto for interconnection with the first plurality of contacts, wherein the first plurality of terminals is formed on the first surface; and a second integrated circuit formed on the second surface, the second integrated circuit electrically isolated from the first integrated circuit, the second integrated circuit having a second plurality of terminals coupled thereto for interconnection with the second plurality of contacts, wherein the second plurality of terminals is formed on the first surface and coupled to the second integrated circuit via plated holes formed through the integrated circuit die, wherein the second plurality of terminals is electrically isolated from the first plurality of terminals and the first integrated circuit.
Claim 4
Dependent Claim
173 words
An electronic assembly, comprising: a circuit carrying substrate having first and second pluralities of contacts formed thereon; and an integrated circuit chip mounted on the circuit carrying substrate, the integrated circuit chip comprising: an integrated circuit die having first and second opposing surfaces; a first integrated circuit formed on the first surface, the first integrated circuit having a first plurality of terminals coupled thereto for interconnection with the first plurality of contacts, wherein the first plurality of terminals is formed on the first surface; and a second integrated circuit formed on the second surface, the second integrated circuit electrically isolated from the first integrated circuit, the second integrated circuit having a second plurality of terminals coupled thereto for interconnection with the second plurality of contacts, wherein the second plurality of terminals is formed on the first surface and coupled to the second integrated circuit via plated holes formed through the integrated circuit die, wherein the second plurality of terminals is electrically isolated from the first plurality of terminals and the first integrated circuit.
Claim 5
Dependent Claim
29 words
The electronic assembly according to claim 2, wherein the first and second pluralities of terminals are coupled to the first and second pluralities of contacts utilizing flip-chip interconnect technology.
Claim 6
Dependent Claim
57 words
The electronic assembly according to claim 2, wherein: the integrated circuit chip is mounted on the circuit carrying substrate such that second surface of the integrated circuit die is adjacent to the circuit carrying substrate; and a plurality of interconnects electrically couples the first and second pluralities of terminals to the first and second pluralities of contacts.
Claim 7
Dependent Claim
29 words
The electronic assembly according to claim 4 wherein the first and second pluralities of terminals are coupled to the first and second pluralities of contacts utilizing wirebonding interconnect technology.
Claim 8
Dependent Claim
178 words
An electronic device, comprising: a circuit carrying substrate having first and second pluralities of contacts formed thereon; circuitry for processing electrical signals mounted on the circuit carrying substrate, the circuitry including at least one integrated circuit chip comprising: an integrated circuit die having first and second opposing surfaces; a first integrated circuit formed on the first surface, the first integrated circuit having a first plurality of terminals coupled thereto for interconnection with the first plurality of contacts, wherein the first plurality of terminals is formed on the first surface; and a second integrated circuit formed on the second surface, the second integrated circuit electrically isolated from the first integrated circuit, the second integrated circuit having a second plurality of terminals coupled thereto for interconnection with the second plurality of contacts, wherein the second plurality of terminals is formed on the first surface and coupled to the second integrated circuit via plated holes formed through the integrated circuit die, wherein the second plurality of terminals is electrically isolated from the first plurality of terminals and the first integrated circuit.
Claim 9
Dependent Claim
178 words
An electronic device, comprising: a circuit carrying substrate having first and second pluralities of contacts formed thereon; circuitry for processing electrical signals mounted on the circuit carrying substrate, the circuitry including at least one integrated circuit chip comprising: an integrated circuit die having first and second opposing surfaces; a first integrated circuit formed on the first surface, the first integrated circuit having a first plurality of terminals coupled thereto for interconnection with the first plurality of contacts, wherein the first plurality of terminals is formed on the first surface; and a second integrated circuit formed on the second surface, the second integrated circuit electrically isolated from the first integrated circuit, the second integrated circuit having a second plurality of terminals coupled thereto for interconnection with the second plurality of contacts, wherein the second plurality of terminals is formed on the first surface and coupled to the second integrated circuit via plated holes formed through the integrated circuit die, wherein the second plurality of terminals is electrically isolated from the first plurality of terminals and the first integrated circuit.
Claim 10
Dependent Claim
28 words
The electronic device according to claim 6, wherein the circuitry comprises receiving circuitry for receiving and processing a radio frequency signal to recover therefrom a selective call message.
Claim 11
Dependent Claim
57 words
The electronic device according to claim 6, wherein: the integrated circuit chip is mounted on the circuit carrying substrate such that second surface of the integrated circuit die is adjacent to the circuit carrying substrate; and a plurality of interconnects electrically couples the first and second pluralities of terminals to the first and second pluralities of contacts.
Claim 12
Dependent Claim
29 words
The electronic device according to claim 8, wherein the first and second pluralities of terminals are coupled to the first and second pluralities of contacts utilizing wirebonding interconnect technology.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-12-29 | 2001-06-30 | 2001-12-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-12-29 | 2005-06-30 | 2005-12-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-12-29 | 2009-06-30 | 2009-12-30 | $7700.00 | Window Closed / Lapsed |