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US6007684A
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Process for forming improved titanium-containing barrier layers
Assignee: Applied Materials Inc
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Filing: 1997-11-12
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Granted: 1999-12-28
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Expires: 2017-11-12
Abstract
Abstract An improved titanium nitride barrier layer that prevents spiking between an overlying aluminum layer and a silicon substrate is formed by first sputter depositing a titanium layer onto the substrate, forming an oxygen-containing titanium layer thereover, and sputter depositing a titanium nitride layer over the oxygen-containing layer. The oxygen-containing layer can be formed in an oxygen-containing plasma, or titanium can be sputtered in the presence of oxygen. The titanium-containing layers can be deposited in a single sputtering chamber fitted with a source of RF power to the substrate support to form the plasma. An aluminum contact layer is sputter deposited over the titanium nitride layer.
Inventors
- 👤 Jianming Fu
- 👤 Fusen Chen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 03:51
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/40; H10P14/42; H10P14/44; C; C23; C23C; C23C14/00; C23C14/58; C23C14/5846; C23C14/5853; C23C14/06; C23C14/0641; C23C14/0676; C23C14/14; C23C14/16; C23C14/165; H10P14/60; H10P14/69; H10P14/692; H10P14/6938; H10P14/6939; H10P14/69394; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/032; H10W20/033; H10W20/047; H10W20/048
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
49 words
A process for depositing a titanium nitride barrier layer in a sputtering chamber comprising the steps of a) sputter depositing a titanium layer onto an exposed surface of a substrate, b) forming a titanium oxide layer over the titanium layer and c) sputter depositing a titanium nitride layer thereover.
Claim 2
Dependent Claim
49 words
A process for depositing a titanium nitride barrier layer in a sputtering chamber comprising the steps of a) sputter depositing a titanium layer onto an exposed surface of a substrate, b) forming a titanium oxide layer over the titanium layer and c) sputter depositing a titanium nitride layer thereover.
Claim 3
Dependent Claim
22 words
A process according to claim 1 wherein the titanium oxide layer is formed by adding an oxygen-containing gas to said sputtering chamber.
Claim 4
Dependent Claim
23 words
A process according to claim 1 wherein said titanium oxide layer is formed by sputtering titanium in the presence of an oxygen-containing gas.
Claim 5
Dependent Claim
17 words
A process according to claim 3 wherein said oxygen-containing gas is a mixture of oxygen and argon.
Claim 6
Dependent Claim
26 words
A process according to claim 1 wherein after the formation of the titanium oxide layer, sputtering is continued in the same chamber to deposit titanium nitride.
Claim 7
Dependent Claim
32 words
A process according to claim 1 wherein the formation of the titanium oxide layer is continued until the titanium oxide layer is deposited that is up to about 20 angstroms in thickness.
Claim 8
Dependent Claim
18 words
A process according to claim 1 wherein oxygen is added to argon during the titanium layer sputtering step.
Claim 9
Dependent Claim
18 words
A process according to claim 5 wherein nitrogen is added to argon during the titanium nitride sputtering step.
Claim 10
Dependent Claim
19 words
A process according to claim 1 wherein steps a), b) and c) are performed in a single sputtering chamber.
Claim 11
Dependent Claim
27 words
A process according to claim 1 wherein steps a) and b) are performed in one sputtering chamber and step c) is performed in a second sputtering chamber.
Claim 12
Dependent Claim
27 words
A process according to claim 1 wherein step a) is performed in one sputtering chamber and steps b) and c) are performed in a second sputtering chamber.
Claim 13
Dependent Claim
15 words
A process according to claim 1 wherein aluminum is sputtered over the titanium nitride layer.
References Cited (Backward Citations)
DE1955716A1
Cited
JPH01111666A
Cited
CA1275332C
Cited
US5232871A
Cited
US5290731A
Cited
US5341026A
Cited
JPH0536627A
Cited
JPH05121356A
Cited
EP0545602A1
Cited
US5371042A
Cited
US5378660A
Cited
EP0680077A1
Cited
EP0747499A1
Cited
EP0747500A1
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-12-27 | 2003-06-28 | 2003-12-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-12-27 | 2007-06-28 | 2007-12-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-12-27 | 2011-06-28 | 2011-12-28 | $7700.00 | Window Closed / Lapsed |